combustion measurement
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2021 ◽  
Author(s):  
David R Rogers ◽  

Engine Combustion: Pressure Measurement and Analysis, 2E provides practical information on measuring, analyzing, and qualifying combustion data, as well as details on hardware and software requirements and system components. Describing the principles of a successful combustion measurement process, the book will enable technicians and engineers to efficiently generate the required data to complete their development tasks. The revised edition has been updated with color photos and a fresh modern format has been adapted enhancing the readability of the book. As with the original printing, Engine Combustion: Pressure Measurement and Analysis, 2E is a comprehensive handbook for technicians and engineers involved in engine testing and development, and a valuable reference for scientists and students who wish to understand combustion measurement processes and techniques.


2015 ◽  
Author(s):  
Tetsuya Nagai ◽  
Ryoji Hiraoka ◽  
Nobuyuki Iwai ◽  
Mitsuru Kowada ◽  
Isao Azumagakito

2014 ◽  
Vol 2014.89 (0) ◽  
pp. _1-21_
Author(s):  
Shinnosuke WATANABE ◽  
Kenya HIROSAWA ◽  
Takamitsu YOSHIMOTO ◽  
Tomio FUJI ◽  
Hiroshi AKAMATSU

2013 ◽  
Vol 2013.51 (0) ◽  
pp. _1405-1_-_1405-2_
Author(s):  
Kan LU ◽  
Hiroki SATO ◽  
Toshiki HIROCHIKA ◽  
Tomoaki YATSUFUSA

2003 ◽  
Vol 125 (3) ◽  
pp. 487-493 ◽  
Author(s):  
Dae Hoon Lee ◽  
Dae-Eun Park ◽  
Euisik Yoon ◽  
Sejin Kwon

Combustion measurement in a cylindrical micro combustor, the construction procedure and test run of a MEMS reciprocating device are described. The sizing of the MEMS device was based on the findings of combustion measurements. Thermodynamic analysis of the pressure measurement resulted in available work up to 2.4 Joules in a combustor height of 2 mm and more with combustion efficiency of 0.6∼0.7. With combustor height less than 2 mm, combustion was incomplete due to excessive heat loss to the wall. In order to achieve the chamber height imposed by the combustion measurement, a fabrication process and wafer material that allow deeper etching was used.


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