2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Latest Publications

TOTAL DOCUMENTS

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Published By IEEE

9781424465170

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Investigation of an on product high-k/metal metrology methodology using an in-line, high throughput XPS measurement technique

2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2010.5551418 ◽

2010 ◽

Author(s):

Min Dai ◽

Mark Klare ◽

Srinivasan Rangarajan ◽

Michael P Chudzik ◽

Joseph Shepard ◽

...

Keyword(s):

High Throughput ◽

Measurement Technique ◽

High K

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Advanced 3D metrology Atomic Force Microscope

2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2010.5551408 ◽

2010 ◽

Cited By ~ 4

Author(s):

Yueming Hua ◽

Cynthia Coggins ◽

Sung Park

Keyword(s):

Atomic Force Microscope ◽

Atomic Force ◽

3D Metrology

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Eliminating solvents in resist removal processes using low-cost detergents

2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2010.5551473 ◽

2010 ◽

Author(s):

J. Petit ◽

J. Moore

Keyword(s):

Low Cost ◽

Removal Processes

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Rule induction for identifying multi layer tool commonalities

2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2010.5551477 ◽

2010 ◽

Author(s):

Alexander Borisov ◽

Igor Chikalov ◽

Eric St. Pierre ◽

Eugene Tuv

Keyword(s):

Rule Induction

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Identification of yield loss sources in the outer dies using SEM based wafer bevel review

2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2010.5551435 ◽

2010 ◽

Cited By ~ 1

Author(s):

Britta Becker ◽

Ronnie Porat ◽

Hana Eschwege

Keyword(s):

Yield Loss

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Infrared microscopy for overlay and defect metrology on 3D-interconnect bonded wafers

2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2010.5551481 ◽

2010 ◽

Cited By ~ 2

Author(s):

Andrew C. Rudack ◽

Lay Wai Kong ◽

Greg G Baker

Keyword(s):

Infrared Microscopy

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Configuring AVM as a MES component

2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2010.5551454 ◽

2010 ◽

Cited By ~ 2

Author(s):

Fan-Tien Cheng ◽

Jonathan Yung-Cheng Chang ◽

Chi-An Kao ◽

Ying-Lin Chen ◽

Ju-Lei Peng

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Committee

2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2010.5551409 ◽

2010 ◽

Download Full-text

Identifying design systematics using learning based diagnostic analysis

2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ◽

10.1109/asmc.2010.5551472 ◽

2010 ◽

Cited By ~ 12

Author(s):

Rao Desineni ◽

Leah Pastel ◽

Maroun Kassab ◽

Mohammed Fazil Fayaz ◽

Julie Lee

Keyword(s):

Diagnostic Analysis

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2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Investigation of an on product high-k/metal metrology methodology using an in-line, high throughput XPS measurement technique

Advanced 3D metrology Atomic Force Microscope

Eliminating solvents in resist removal processes using low-cost detergents

Rule induction for identifying multi layer tool commonalities

Identification of yield loss sources in the outer dies using SEM based wafer bevel review

Sponsors

Infrared microscopy for overlay and defect metrology on 3D-interconnect bonded wafers

Configuring AVM as a MES component

Committee

Identifying design systematics using learning based diagnostic analysis

Export Citation Format

2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Investigation of an on product high-k/metal metrology methodology using an in-line, high throughput XPS measurement technique

Advanced 3D metrology Atomic Force Microscope

Eliminating solvents in resist removal processes using low-cost detergents

Rule induction for identifying multi layer tool commonalities

Identification of yield loss sources in the outer dies using SEM based wafer bevel review

Sponsors

Infrared microscopy for overlay and defect metrology on 3D-interconnect bonded wafers

Configuring AVM as a MES component

Committee

Identifying design systematics using learning based diagnostic analysis

2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Latest Publications