Failure Analysis and Stress Evaluation of Maleimide Molding Films during Temperature Cycling

Abstract In a prequalification effort to evaluate the assembly process for the industrial grade high pin count devices for use in a high reliability application, one device exhibited characteristics that, without corrective actions and/or extensive screening, may lead to intermittent system failures and unacceptable reliability. Five methodologies confirmed this conclusion: (1) low post-decapsulation wire pull results; (2) bond shape analysis showed process variation; (3) Failure Analysis (FA) using state of the art equipment determined the root causes and verified the low wire pull results; (4) temperature cycling parts while monitoring, showed intermittent failures, and (5) parts tested from other vendors using the same techniques passed all limits.

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Design and Reliability in Electronic Packaging Including Power Temperature Cycling and Vibration Effects

2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2 ◽

10.1115/ipack2003-35353 ◽

2003 ◽

Cited By ~ 1

Author(s):

Mark D. Nickerson ◽

Chandrakant S. Desai

Keyword(s):

Finite Element ◽

Failure Analysis ◽

Thermal Cycling ◽

Temperature Cycling ◽

Damage Models ◽

Disturbed State Concept ◽

Solder Balls ◽

Element Failure ◽

Viscoplastic Models ◽

Cycles To Failure

Thermomechanical, power temperature cycling (PTC) and vibration analyses were performed on a 313 staggered pin PBGA package using plastic and viscoplastic disturbed-state damage models. An accelerated finite element failure analysis was performed using a newly developed procedure. Validations were performed using published PBGA test data. The disturbed state concept was used to model the disturbance (damage) accumulated in PBGA solder joints subjected to thermal cycling (PTC and TCT), vibration, and vibration coupled with three distinct temperatures. 2D FEA plastic and viscoplastic models were created based on a diagonal “slice” of the PBGA. This allowed the most critical solder balls (under the die and furthest DNP) to be analyzed in the same model. The thermal cycling results indicate that the solder balls under the die are the most likely to fail. The vibration results indicate the solder balls furthest from the package center are most likely to fail. The vibration results, coupled with distinct isothermal temperatures, indicate that as temperature increases, the cycles to failure decreases.

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Application to Non Destructive Physical Analysis Method Using X-ray CT Imaging

ISTFA 2010: Conference Proceedings from the 36th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2010p0265 ◽

2010 ◽

Author(s):

Akira Mizoguchi ◽

Minoru Sugawara ◽

Masahide Nakamura ◽

Koichiro Takeuchi

Keyword(s):

Failure Analysis ◽

Three Dimensional ◽

Ct Imaging ◽

Temperature Cycling ◽

Physical Analysis ◽

Printed Wiring Boards ◽

X Ray ◽

X Ray Imaging ◽

X Ray Computed ◽

Non Destructive

Abstract We have been paying attention to the development of the nondestructive physical analysis (NDPA) technology. We think that NDPA is a technology which doesn't depend on the worker's capability or experience. There are many NDPA techniques, and analysis using X-ray imaging is one of the principal techniques. Due to the progress of the image analysis using computers in recent years, X-ray imaging have been evolving from two dimensional images to three dimensional imaging. We have been applying X-ray CT imaging to actual failure analysis and reliability evaluation since 2008. At ISTFA 2009, we reported on the effectiveness of X-ray Computed Tomography (CT) images in the failure analysis. [1] We confirmed that the X-ray CT image had various applications, for example, screening for counterfeit parts, the detection of the defect of the multi-layers printed wiring boards (multi-layers PWB), the structure confirmation of caulking contacts, and the detection of cracks or voids of the solder joint. This paper discusses the effectiveness of X-ray CT imaging in failure analysis and discusses the effectiveness of applying X-ray CT imaging to the propagation of cracks occurring at solder joints during temperature cycling test.

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Failure Analysis of Lead-Free Solder Joints of an 1657CCGA (Ceramic Column Grid Array) Package

Journal of Microelectronics and Electronic Packaging ◽

10.4071/1551-4897-4.3.112 ◽

2007 ◽

Vol 4 (3) ◽

pp. 112-120 ◽

Cited By ~ 2

Author(s):

John Lau ◽

Todd Castello ◽

Dongkai Shangguan ◽

Walter Dauksher ◽

Joe Smetana ◽

...

Keyword(s):

Failure Analysis ◽

Surface Finish ◽

Failure Modes ◽

Solder Joints ◽

Temperature Cycling ◽

Lead Free ◽

Lead Free Solder ◽

Organic Solderability Preservative ◽

Solder Pastes ◽

Free Solder

In this study, failure analysis of the 1657CCGA package with 95.5wt%Sn3.9wt%Ag0.6wt%Cu and 63wt%Sn37wt%Pb solder pastes on lead-free PCBs with the Entek OSP (organic solderability preservative) surface finish is investigated. Emphasis is placed on determining the failure locations and failure modes of the solder joints of the 1657CCGA assemblies after they have been through 7,000 cycles of temperature cycling.

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Failure Analysis and Reliability of 3D Integrated Systems

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2011dpc-tha11 ◽

2011 ◽

Vol 2011 (DPC) ◽

pp. 002071-002111

Author(s):

Peter Ramm ◽

Armin Klumpp ◽

German Franz ◽

Laurens Kwakman

Keyword(s):

Failure Analysis ◽

Cross Sections ◽

Ion Beam ◽

Temperature Cycling ◽

Integrated Systems ◽

Good Resolution ◽

The Novel ◽

3D Integration ◽

Test Chip ◽

The Impact

Today 3D integration based on through silicon vias (TSV) is a well-accepted approach to overcome the performance bottleneck and simultaneously shrink the form factor. According to the ITRS road map [1] there is a variety of reasons for application of 3D integration, such as miniaturization, improved circuit performance, lower power consumption and heterogeneous integration. World-wide, several full 3D process flows have been demonstrated. However, there is a strong demand for considering the behaviour and reliability of 3D-integrated systems [2]. Explicitly, the impact of 3D processes on the system, e.g. thermo-mechanical stresses, has to be evaluated before the implementation to production lines. A test chip for reliability evaluation of 3D TSV technologies was designed and fabricated by Fraunhofer EMFT. The 3D-integrated reliability test chip is a 3-level-stack with TSVs through a middle (2nd) device layer to connect structures on the bottom (1st) level with the top (3rd) level device. The layout is modular, so you can test basic assembly processing with the combination of level 1 with level 2 only and the influence of additional processing when adding level 3. For reliability testing, temperature cycling following the JEDEC standard was performed from −55 C ° to +150 °C (at a soak time of 5 minutes). Additionally, analysis was done by cross sectioning and reversed engineering. The 3D-integrated test chips were fabricated by application of Fraunhofer EMFT's TSV SLID technology. The applied 3D TSV process is based on intermetallic compound (IMC) bonding and TSV formation before stacking [3]. Reliability issues related to thermo-mechanical stress caused by the 3D integration process have to be considered. Failures of 3D integrated systems caused by TSV formation and the permanent bonding process were analysed by a novel high rate milling Focussed Ion Beam equipment. Figure 1 schematically shows the application of the novel FIB analysis technique for the areas of interest (IMC bond, TSV cross sections). Compared to classical FIB systems, the new equipment allows to remove material significantly faster while maintaining good resolution at low beam currents, important for the subsequent analysis. Cross sections of the 3-layer stack are shown in Figure 2. The merits of the novel plasma FIB and the resulting failure analysis will be discussed in detail.

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Temperature Cycling Failure Analysis and Improvement of A Panel Level Fan-out QFN Package

10.1109/ipfa53173.2021.9617341 ◽

2021 ◽

Author(s):

Li Chen ◽

Wei Gao ◽

Yan Huo ◽

Lei Xie ◽

Yuyu Peng ◽

...

Keyword(s):

Failure Analysis ◽

Temperature Cycling

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Failure Analysis With the Scanning Electron Microscope

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100095662 ◽

1972 ◽

Vol 30 ◽

pp. 482-483

Author(s):

John R. Devaney

Keyword(s):

Electron Microscope ◽

Scanning Electron Microscope ◽

Integrated Circuits ◽

Failure Analysis ◽

High Reliability ◽

Military Applications ◽

Small Structure ◽

Useful Life ◽

Insight Into ◽

Scanning Electron

Occasionally in history, an event may occur which has a profound influence on a technology. Such an event occurred when the scanning electron microscope became commercially available to industry in the mid 60's. Semiconductors were being increasingly used in high-reliability space and military applications both because of their small volume but, also, because of their inherent reliability. However, they did fail, both early in life and sometimes in middle or old age. Why they failed and how to prevent failure or prolong “useful life” was a worry which resulted in a blossoming of sophisticated failure analysis laboratories across the country. By 1966, the ability to build small structure integrated circuits was forging well ahead of techniques available to dissect and analyze these same failures. The arrival of the scanning electron microscope gave these analysts a new insight into failure mechanisms.

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Using the scanning electron microscope for failure analysis of high density magnetic media

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100126755 ◽

1987 ◽

Vol 45 ◽

pp. 392-393

Author(s):

Evelyn R. Ackerman ◽

Gary D. Burnett

Keyword(s):

Electron Microscope ◽

Scanning Electron Microscope ◽

Failure Analysis ◽

High Density ◽

Magnetic Media ◽

Specific Data ◽

Retrieval Systems ◽

Operating Environments ◽

The Media ◽

Scanning Electron

Advancements in state of the art high density Head/Disk retrieval systems has increased the demand for sophisticated failure analysis methods. From 1968 to 1974 the emphasis was on the number of tracks per inch. (TPI) ranging from 100 to 400 as summarized in Table 1. This emphasis shifted with the increase in densities to include the number of bits per inch (BPI). A bit is formed by magnetizing the Fe203 particles of the media in one direction and allowing magnetic heads to recognize specific data patterns. From 1977 to 1986 the tracks per inch increased from 470 to 1400 corresponding to an increase from 6300 to 10,800 bits per inch respectively. Due to the reduction in the bit and track sizes, build and operating environments of systems have become critical factors in media reliability.Using the Ferrofluid pattern developing technique, the scanning electron microscope can be a valuable diagnostic tool in the examination of failure sites on disks.

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