2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Latest Publications

TOTAL DOCUMENTS

100

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H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781467382595

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Recent advances of RTN technique towards the understanding of the gate dielectric reliability in trigate FinFETs

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2016.7564242 ◽

2016 ◽

Cited By ~ 1

Author(s):

Steve S. Chung

Keyword(s):

Gate Dielectric ◽

Recent Advances

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BGA packaged IC sample preparing for electrical failure analysis

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2016.7564260 ◽

2016 ◽

Cited By ~ 1

Author(s):

Quande Zhang ◽

Yi Che ◽

Jinglong Li ◽

Binghai Liu

Keyword(s):

Failure Analysis ◽

Electrical Failure

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Study on fab environment induced Al and Cu metal corrosion by TEM failure analysis

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2016.7564331 ◽

2016 ◽

Author(s):

Binghai Liu ◽

Zhihong Mai ◽

Jeffrey Lam ◽

Zhao Yuzhe ◽

Tan Pik Kee

Keyword(s):

Failure Analysis ◽

Metal Corrosion

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A study on device robustness with integrated effects from low parts-per-billion level of metallic elements in wafer cleaning process chemicals

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2016.7564295 ◽

2016 ◽

Cited By ~ 1

Author(s):

K. H. Raymond Tan ◽

P. L. Emily Liew ◽

Chai Chin Chin ◽

C. Y. Joanne Wong

Keyword(s):

Cleaning Process ◽

Metallic Elements ◽

Wafer Cleaning

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High resolution 3D X-ray microscopy for streamlined failure analysis workflow

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2016.7564285 ◽

2016 ◽

Cited By ~ 2

Author(s):

C. Y. Liu ◽

P. S. Kuo ◽

C. H. Chu ◽

Allen Gu ◽

Jin Yoon

Keyword(s):

High Resolution ◽

Failure Analysis ◽

X Ray ◽

Analysis Workflow

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Innovative fault isolation analysis technique to identify failure mechanism on recovering device failure

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2016.7564320 ◽

2016 ◽

Author(s):

Izhar Helmi Ahmad ◽

Anton Van Alferez ◽

Yusnani Muhamad Yusof

Keyword(s):

Failure Mechanism ◽

Fault Isolation ◽

Device Failure ◽

Analysis Technique

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Logics of Failure Analysis: 20 Years of rules of the Rue Morgue

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2016.7564321 ◽

2016 ◽

Author(s):

G. Mura ◽

M. Vanzi

Keyword(s):

Failure Analysis

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Film-profile-engineered IGZO thin-film transistors with gate/drain offset for high voltage operation

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2016.7564298 ◽

2016 ◽

Cited By ~ 1

Author(s):

Ming-Hung Wu ◽

Horng-Chih Lin ◽

Pei-Wen Li ◽

Tiao-Yuan Huang

Keyword(s):

Thin Film ◽

High Voltage ◽

Thin Film Transistors ◽

Film Profile

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From IC debug to hardware security risk: The power of backside access and optical interaction

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2016.7564318 ◽

2016 ◽

Cited By ~ 4

Author(s):

C. Boit ◽

S. Tajik ◽

P. Scholz ◽

E. Amini ◽

A. Beyreuther ◽

...

Keyword(s):

Hardware Security ◽

Security Risk ◽

Optical Interaction

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Effect of thickness on microstructure and texture in Cu thin films for interconnects

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2016.7564300 ◽

2016 ◽

Author(s):

L. Chen

Keyword(s):

Thin Films

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2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Recent advances of RTN technique towards the understanding of the gate dielectric reliability in trigate FinFETs

BGA packaged IC sample preparing for electrical failure analysis

Study on fab environment induced Al and Cu metal corrosion by TEM failure analysis

A study on device robustness with integrated effects from low parts-per-billion level of metallic elements in wafer cleaning process chemicals

High resolution 3D X-ray microscopy for streamlined failure analysis workflow

Innovative fault isolation analysis technique to identify failure mechanism on recovering device failure

Logics of Failure Analysis: 20 Years of rules of the Rue Morgue

Film-profile-engineered IGZO thin-film transistors with gate/drain offset for high voltage operation

From IC debug to hardware security risk: The power of backside access and optical interaction

Effect of thickness on microstructure and texture in Cu thin films for interconnects

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Latest Publications