2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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100

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9781467382595

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Innovative fault isolation analysis technique to identify failure mechanism on recovering device failure

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2016.7564320 ◽

2016 ◽

Author(s):

Izhar Helmi Ahmad ◽

Anton Van Alferez ◽

Yusnani Muhamad Yusof

Keyword(s):

Failure Mechanism ◽

Fault Isolation ◽

Device Failure ◽

Analysis Technique

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Logics of Failure Analysis: 20 Years of rules of the Rue Morgue

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2016.7564321 ◽

2016 ◽

Author(s):

G. Mura ◽

M. Vanzi

Keyword(s):

Failure Analysis

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Film-profile-engineered IGZO thin-film transistors with gate/drain offset for high voltage operation

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2016.7564298 ◽

2016 ◽

Author(s):

Ming-Hung Wu ◽

Horng-Chih Lin ◽

Pei-Wen Li ◽

Tiao-Yuan Huang

Keyword(s):

Thin Film ◽

High Voltage ◽

Thin Film Transistors ◽

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BGA packaged IC sample preparing for electrical failure analysis

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2016.7564260 ◽

2016 ◽

Author(s):

Quande Zhang ◽

Yi Che ◽

Jinglong Li ◽

Binghai Liu

Keyword(s):

Failure Analysis ◽

Electrical Failure

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Study on fab environment induced Al and Cu metal corrosion by TEM failure analysis

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2016.7564331 ◽

2016 ◽

Author(s):

Binghai Liu ◽

Zhihong Mai ◽

Jeffrey Lam ◽

Zhao Yuzhe ◽

Tan Pik Kee

Keyword(s):

Failure Analysis ◽

Metal Corrosion

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A study on device robustness with integrated effects from low parts-per-billion level of metallic elements in wafer cleaning process chemicals

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2016.7564295 ◽

2016 ◽

Author(s):

K. H. Raymond Tan ◽

P. L. Emily Liew ◽

Chai Chin Chin ◽

C. Y. Joanne Wong

Keyword(s):

Cleaning Process ◽

Metallic Elements ◽

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High resolution 3D X-ray microscopy for streamlined failure analysis workflow

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2016.7564285 ◽

2016 ◽

Author(s):

C. Y. Liu ◽

P. S. Kuo ◽

C. H. Chu ◽

Allen Gu ◽

Jin Yoon

Keyword(s):

High Resolution ◽

Failure Analysis ◽

X Ray ◽

Analysis Workflow

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Recent advances of RTN technique towards the understanding of the gate dielectric reliability in trigate FinFETs

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2016.7564242 ◽

2016 ◽

Author(s):

Steve S. Chung

Keyword(s):

Gate Dielectric ◽

Recent Advances

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From IC debug to hardware security risk: The power of backside access and optical interaction

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2016.7564318 ◽

2016 ◽

Author(s):

C. Boit ◽

S. Tajik ◽

P. Scholz ◽

E. Amini ◽

A. Beyreuther ◽

...

Keyword(s):

Hardware Security ◽

Security Risk ◽

Optical Interaction

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Effect of thickness on microstructure and texture in Cu thin films for interconnects

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2016.7564300 ◽

2016 ◽

Author(s):

L. Chen

Keyword(s):

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