2006 29th International Spring Seminar on Electronics Technology
Latest Publications

TOTAL DOCUMENTS

111

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

1424405505, 1424405513

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Transformation of Data for Statistical Processing

2006 29th International Spring Seminar on Electronics Technology ◽

10.1109/isse.2006.365112 ◽

2006 ◽

Author(s):

Pavel Mach ◽

Josef Thuring ◽

David Samal

Keyword(s):

Statistical Processing

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Analysis of a Simple Model Contact Au-CdTe by Detectors of Gamma Ray

2006 29th International Spring Seminar on Electronics Technology ◽

10.1109/isse.2006.365386 ◽

2006 ◽

Author(s):

Alexey Andreev ◽

Jiri Zajacek

Keyword(s):

Simple Model ◽

Gamma Ray

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Lifetime Modeling based on an Advanced Test Chip Configuration for Lead-free Solder Joints

2006 29th International Spring Seminar on Electronics Technology ◽

10.1109/isse.2006.365354 ◽

2006 ◽

Author(s):

Bjorn Bohme ◽

Mike Rollig ◽

Steffen Wiese ◽

Klaus-Jurgen Wolter

Keyword(s):

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

Test Chip ◽

Free Solder

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System of Hydraulic Dampers Diagnostics

2006 29th International Spring Seminar on Electronics Technology ◽

10.1109/isse.2006.365391 ◽

2006 ◽

Author(s):

N. G. Nenov ◽

E. N. Dimitrov ◽

T. G. Ruzhekov ◽

E. Georgiev

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Two-level Pipeline Scheduling of Adiabatic Logic

2006 29th International Spring Seminar on Electronics Technology ◽

10.1109/isse.2006.365136 ◽

2006 ◽

Cited By ~ 1

Author(s):

Laszlo Varga ◽

Gabor Hosszu ◽

Ferenc Kovacs

Keyword(s):

Pipeline Scheduling ◽

Adiabatic Logic

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Applying of Stacked Microvias in Printed Circuit Board

2006 29th International Spring Seminar on Electronics Technology ◽

10.1109/isse.2006.365140 ◽

2006 ◽

Cited By ~ 1

Author(s):

Wojciech Falinski ◽

Grazyna Koziol

Keyword(s):

Printed Circuit Board ◽

Circuit Board ◽

Printed Circuit

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Three Dimensional RC Model of Heat Transfer in Thick-Film Multilayer Structure

2006 29th International Spring Seminar on Electronics Technology ◽

10.1109/isse.2006.365395 ◽

2006 ◽

Cited By ~ 1

Author(s):

Grzegorz Blad ◽

Wlodzimierz Kalita ◽

Dariusz Klepacki ◽

Mariusz Weglarski

Keyword(s):

Heat Transfer ◽

Thick Film ◽

Multilayer Structure ◽

Three Dimensional

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Methodology for Manufacturing Improvement

2006 29th International Spring Seminar on Electronics Technology ◽

10.1109/isse.2006.365356 ◽

2006 ◽

Author(s):

Jiri Tupa ◽

Ales Hamacek ◽

Jan Reboun ◽

Vlastimil Skocil ◽

Frantisek Steiner

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Method for improvement of mechanical assembly quality of precise electrical contacts

2006 29th International Spring Seminar on Electronics Technology ◽

10.1109/isse.2006.365398 ◽

2006 ◽

Author(s):

I. Valentin Tcenev ◽

Ph Filip Fillipov ◽

Irina Petrova

Keyword(s):

Electrical Contacts ◽

Mechanical Assembly ◽

Assembly Quality

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CFD simulations of LTCC based microsystems

2006 29th International Spring Seminar on Electronics Technology ◽

10.1109/isse.2006.365377 ◽

2006 ◽

Cited By ~ 2

Author(s):

Karol Malecha ◽

Leszek J. Golonka

Keyword(s):

Cfd Simulations

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2006 29th International Spring Seminar on Electronics TechnologyLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Transformation of Data for Statistical Processing

Analysis of a Simple Model Contact Au-CdTe by Detectors of Gamma Ray

Lifetime Modeling based on an Advanced Test Chip Configuration for Lead-free Solder Joints

System of Hydraulic Dampers Diagnostics

Two-level Pipeline Scheduling of Adiabatic Logic

Applying of Stacked Microvias in Printed Circuit Board

Three Dimensional RC Model of Heat Transfer in Thick-Film Multilayer Structure

Methodology for Manufacturing Improvement

Method for improvement of mechanical assembly quality of precise electrical contacts

CFD simulations of LTCC based microsystems

2006 29th International Spring Seminar on Electronics Technology
Latest Publications