2009 IEEE Workshop on Signal Propagation on Interconnects
Latest Publications

TOTAL DOCUMENTS

38

(FIVE YEARS 0)

H-INDEX

7

(FIVE YEARS 0)

Published By IEEE

9781424444908

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Differential to common mode conversion due to asymmetric ground via configurations

2009 IEEE Workshop on Signal Propagation on Interconnects ◽

10.1109/spi.2009.5089852 ◽

2009 ◽

Author(s):

Renato Rimolo-Donadio ◽

Xiaomin Duan ◽

Heinz-Dietrich Bruns ◽

Christian Schuster

Keyword(s):

Mode Conversion ◽

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Equivalent victim model of the coupled interconnects for simulating crosstalk induced glitches and delays

2009 IEEE Workshop on Signal Propagation on Interconnects ◽

10.1109/spi.2009.5089850 ◽

2009 ◽

Author(s):

Shehzad Hasan ◽

Ajoy K. Palit ◽

Walter Anheier

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Integral power net integrity analysis of a packaged u-Controller system including the u-Controller on-chip power net distribution

2009 IEEE Workshop on Signal Propagation on Interconnects ◽

10.1109/spi.2009.5089866 ◽

2009 ◽

Author(s):

Ekkehard Miersch ◽

Mehmet Goekcen ◽

Thomas Steinecke

Keyword(s):

Integral Power ◽

On Chip ◽

Integrity Analysis

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Acceleration of Transverse Waveform Relaxation using waveform compression

2009 IEEE Workshop on Signal Propagation on Interconnects ◽

10.1109/spi.2009.5089861 ◽

2009 ◽

Author(s):

T. Maestri ◽

I. M. Elfadel ◽

A. Ruehli

Keyword(s):

Waveform Relaxation

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Vector Fitting vs. Levenberg-Marquardt : Some experiments

2009 IEEE Workshop on Signal Propagation on Interconnects ◽

10.1109/spi.2009.5089858 ◽

2009 ◽

Author(s):

Luc Knockaert ◽

Francesco Ferranti ◽

Tom Dhaene

Keyword(s):

Vector Fitting ◽

Levenberg Marquardt

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Modeling the interconnection of a pseudo-differential link using a wide return conductor

2009 IEEE Workshop on Signal Propagation on Interconnects ◽

10.1109/spi.2009.5089862 ◽

2009 ◽

Author(s):

Frederic Broyde ◽

Evelyne Clavelier

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Identification of interconnect failure mechanisms using RF impedance analysis

2009 IEEE Workshop on Signal Propagation on Interconnects ◽

10.1109/spi.2009.5089855 ◽

2009 ◽

Author(s):

Daeil Kwon ◽

Michael H. Azarian ◽

Michael Pecht

Keyword(s):

Failure Mechanisms ◽

Impedance Analysis

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On the quantification and improvement of the models for surface roughness

2009 IEEE Workshop on Signal Propagation on Interconnects ◽

10.1109/spi.2009.5089851 ◽

2009 ◽

Author(s):

Brian Curran ◽

Ivan Ndip ◽

Stephan Guttowski ◽

Herbert Reichl

Keyword(s):

Surface Roughness

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High frequency characterization and modeling of high density TSV in 3D integrated circuits

2009 IEEE Workshop on Signal Propagation on Interconnects ◽

10.1109/spi.2009.5089840 ◽

2009 ◽

Author(s):

C. Bermond ◽

L. Cadix ◽

A. Farcy ◽

T. Lacrevaz ◽

P. Leduc ◽

...

Keyword(s):

Integrated Circuits ◽

High Frequency ◽

High Density ◽

3D Integrated Circuits

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Conductor modeling with the surface admittance operator of triangles

2009 IEEE Workshop on Signal Propagation on Interconnects ◽

10.1109/spi.2009.5089860 ◽

2009 ◽

Author(s):

Thomas Demeester ◽

Daniel De Zutter

Keyword(s):

Surface Admittance

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