Journal of Electronics Cooling and Thermal Control
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 5)

H-INDEX

(FIVE YEARS 0)

Published By "Scientific Research Publishing, Inc."

2162-6170, 2162-6162

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Best Practices for Thermal Modeling in Microelectronics with Natural Convection Cooling: Sensitivity Analysis

Journal of Electronics Cooling and Thermal Control ◽

10.4236/jectc.2021.102002 ◽

2021 ◽

Vol 10 (02) ◽

pp. 15-33

Author(s):

Mamadou Kabirou Touré ◽

Papa Momar Souaré ◽

Julien Sylvestre

Keyword(s):

Sensitivity Analysis ◽

Natural Convection ◽

Best Practices ◽

Thermal Modeling ◽

Convection Cooling

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New Measurement Method for Direct Cooled Power Electronic with Transmission Fluids

Journal of Electronics Cooling and Thermal Control ◽

10.4236/jectc.2021.101001 ◽

2021 ◽

Vol 10 (01) ◽

pp. 1-13

Author(s):

Andreas Griesinger ◽

Christian Windel ◽

Yungwan Kwak ◽

Arthur Petuchow

Keyword(s):

Measurement Method ◽

Power Electronic

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Techno-Economic and Sustainability Analysis of Potential Cooling Methods in Irish Data Centres

Journal of Electronics Cooling and Thermal Control ◽

10.4236/jectc.2021.103003 ◽

2021 ◽

Vol 10 (03) ◽

pp. 35-54

Author(s):

Lee Gibbons ◽

Tim Persoons ◽

Sajad Alimohammadi

Keyword(s):

Sustainability Analysis ◽

Irish Data ◽

Data Centres ◽

Cooling Methods

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Optimal Thermal Insulation Thickness in Isolated Air-Conditioned Buildings and Economic Analysis

Journal of Electronics Cooling and Thermal Control ◽

10.4236/jectc.2020.92002 ◽

2020 ◽

Vol 09 (02) ◽

pp. 23-45

Author(s):

Mousa M. Mohamed

Keyword(s):

Economic Analysis ◽

Thermal Insulation ◽

Insulation Thickness

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Modeling of Subcooled Boiling Heat Transfer to Cool Electronic Components in a Micro-Channel

Journal of Electronics Cooling and Thermal Control ◽

10.4236/jectc.2020.91001 ◽

2020 ◽

Vol 09 (01) ◽

pp. 1-21

Author(s):

Hasan Abbasinejad ◽

Reza Hoseini Abardeh

Keyword(s):

Heat Transfer ◽

Boiling Heat Transfer ◽

Micro Channel ◽

Subcooled Boiling ◽

Electronic Components

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Failure Stress Energy Formula

Journal of Electronics Cooling and Thermal Control ◽

10.4236/jectc.2018.83003 ◽

2018 ◽

Vol 08 (03) ◽

pp. 31-47

Author(s):

Zviad Kovziridze

Keyword(s):

Failure Stress ◽

Stress Energy ◽

Energy Formula

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Proposal of Functional Thermal Control Systems for High-Power Micro-Satellite and Its Demonstration under Thermal Vacuum Condition

Journal of Electronics Cooling and Thermal Control ◽

10.4236/jectc.2018.81001 ◽

2018 ◽

Vol 08 (01) ◽

pp. 1-17 ◽

Cited By ~ 1

Author(s):

Ai Ueno ◽

Kohei Yamada ◽

Kikuko Miyata ◽

Hosei Nagano

Keyword(s):

Control Systems ◽

High Power ◽

Thermal Control ◽

Vacuum Condition ◽

Thermal Vacuum

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Formula of Thermogradient Effect

Journal of Electronics Cooling and Thermal Control ◽

10.4236/jectc.2018.84004 ◽

2018 ◽

Vol 08 (04) ◽

pp. 49-54

Author(s):

Zviad Kovziridze

Keyword(s):

Thermogradient Effect

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Investigation and Comparison of the DIBL Parameter and Thermal Effects of SOD Transistors and SOI Transistors and Improving Them with the Change of Their BOX Thicknesses

Journal of Electronics Cooling and Thermal Control ◽

10.4236/jectc.2018.82002 ◽

2018 ◽

Vol 08 (02) ◽

pp. 19-30

Author(s):

Nooshien Laderian ◽

Arash Daghighi

Keyword(s):

Thermal Effects

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Simulation of District Cooling Plant and Efficient Energy Air Cooled Condensers (Part I)

Journal of Electronics Cooling and Thermal Control ◽

10.4236/jectc.2017.73005 ◽

2017 ◽

Vol 07 (03) ◽

pp. 45-62 ◽

Cited By ~ 2

Author(s):

Mousa M. Mohamed ◽

Mohammed Hueesin Almarshadi

Keyword(s):

Efficient Energy ◽

Air Cooled Condensers

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Journal of Electronics Cooling and Thermal ControlLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By "Scientific Research Publishing, Inc."

Best Practices for Thermal Modeling in Microelectronics with Natural Convection Cooling: Sensitivity Analysis

New Measurement Method for Direct Cooled Power Electronic with Transmission Fluids

Techno-Economic and Sustainability Analysis of Potential Cooling Methods in Irish Data Centres

Optimal Thermal Insulation Thickness in Isolated Air-Conditioned Buildings and Economic Analysis

Modeling of Subcooled Boiling Heat Transfer to Cool Electronic Components in a Micro-Channel

Failure Stress Energy Formula

Proposal of Functional Thermal Control Systems for High-Power Micro-Satellite and Its Demonstration under Thermal Vacuum Condition

Formula of Thermogradient Effect

Investigation and Comparison of the DIBL Parameter and Thermal Effects of SOD Transistors and SOI Transistors and Improving Them with the Change of Their BOX Thicknesses

Simulation of District Cooling Plant and Efficient Energy Air Cooled Condensers (Part I)

Journal of Electronics Cooling and Thermal Control
Latest Publications