1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration
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A full experience of designing a wafer scale 2D array

1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration ◽

10.1109/icwsi.1993.255275 ◽

2002 ◽

Author(s):

A. Boubekeur ◽

J.L. Patry ◽

G. Saucier ◽

M. Slimane-kadi ◽

J. Trilhe

Keyword(s):

Wafer Scale ◽

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Three dimensional hybrid wafer scale integration using the GE high density interconnect technology

1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration ◽

10.1109/icwsi.1993.255247 ◽

2002 ◽

Author(s):

R.J. Wojnarowski ◽

R.A. Fillion ◽

B. Gorowitz ◽

R. Saia

Keyword(s):

Three Dimensional ◽

High Density ◽

Wafer Scale ◽

Wafer Scale Integration ◽

Scale Integration ◽

Interconnect Technology

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Use of high dielectric constant insulators for bypass capacitance in WSI and wafer scale hybrid multichip modules

1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration ◽

10.1109/icwsi.1993.255246 ◽

2002 ◽

Author(s):

R. Philhower ◽

J. Van Etten ◽

K.S. Nah ◽

C.J. Loy ◽

C. Maier ◽

...

Keyword(s):

Dielectric Constant ◽

High Dielectric Constant ◽

Multichip Modules ◽

Wafer Scale ◽

High Dielectric

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Optimizing multipliers for WSI

1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration ◽

10.1109/icwsi.1993.255270 ◽

2002 ◽

Author(s):

T.K. Callaway ◽

E.E. Swartzlander

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Interface design optimisation for WASP devices

1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration ◽

10.1109/icwsi.1993.255256 ◽

2002 ◽

Author(s):

H. Bolouri ◽

M.B.A. Hussaini ◽

S.J. Hedge ◽

R.M. Lea

Keyword(s):

Interface Design ◽

Design Optimisation

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Interconnection technologies for multichip assemblies (ITMA)-A UK Information Technology Engineering Directorate hybrid wafer scale project

1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration ◽

10.1109/icwsi.1993.255269 ◽

2002 ◽

Author(s):

D.J. Pedder

Keyword(s):

Information Technology ◽

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An advanced MCM associative string processor

1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration ◽

10.1109/icwsi.1993.255266 ◽

2002 ◽

Author(s):

I.P. Jalowiecki ◽

R.M. Lea ◽

D. Pedder

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Application opportunities for hybrid-WSI

1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration ◽

10.1109/icwsi.1993.255265 ◽

2002 ◽

Author(s):

D.R. Ming ◽

R.K. Scannell

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Testing constant-geometry FFT arrays for wafer scale integration

1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration ◽

10.1109/icwsi.1993.255258 ◽

2002 ◽

Author(s):

J. Salinas ◽

C. Feng ◽

F. Lombardi

Keyword(s):

Wafer Scale ◽

Wafer Scale Integration ◽

Scale Integration

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Effect of communication delay on gracefully degradable WSI processor array performance

1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration ◽

10.1109/icwsi.1993.255260 ◽

2002 ◽

Author(s):

D.L. Landis ◽

N. Nigam

Keyword(s):

Communication Delay ◽

Processor Array ◽

Array Performance

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