2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

System-level-model development of an SWCNT based piezoresistive sensor in VHDL-AMS

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2014.6813846 ◽

2014 ◽

Cited By ~ 1

Author(s):

Vladimir Kolchuzhin ◽

Jan Mehner ◽

Erik Markert ◽

Ulrich Heinkel ◽

Christian Wagner ◽

...

Keyword(s):

Model Development ◽

System Level ◽

Piezoresistive Sensor ◽

Level Model ◽

System Level Model

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Analytical tool for electro-thermal modelling of microbolometers

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2014.6813826 ◽

2014 ◽

Author(s):

Piotr Zajac ◽

Cezary Maj ◽

Michal Szermer ◽

Mykhaylo Lobur ◽

Andrzej Napieralski

Keyword(s):

Analytical Tool ◽

Thermal Modelling

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Using molecular modeling to uncover the origins of subtle solvation-based film defects

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2014.6813770 ◽

2014 ◽

Cited By ~ 1

Author(s):

Nancy Iwamoto ◽

Teri Baldwin

Keyword(s):

Molecular Modeling

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System reliability for LED-based products

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2014.6813879 ◽

2014 ◽

Cited By ~ 13

Author(s):

J. Lynn Davis ◽

Karmann Mills ◽

Mike Lamvik ◽

Robert Yaga ◽

Sarah D. Shepherd ◽

...

Keyword(s):

System Reliability

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Structure design and reliability assessment of double-sided with double-chip stacking packaging

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2014.6813809 ◽

2014 ◽

Cited By ~ 1

Author(s):

Yen-Fu Su ◽

Chun-Te Lin ◽

Tzu-Ying Kuo ◽

Kuo-Ning Chiang

Keyword(s):

Reliability Assessment ◽

Structure Design

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Multiphysical modeling of nanosecond laser dicing on ultra-thin silicon wafers

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2014.6813840 ◽

2014 ◽

Cited By ~ 3

Author(s):

G. Galasso ◽

M. Kaltenbacher ◽

B. Karunamurthy ◽

H. Eder ◽

T. Polster

Keyword(s):

Silicon Wafers ◽

Nanosecond Laser ◽

Thin Silicon

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Creep and fatigue as main degradation phenomena in reliability of solder joints

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2014.6813780 ◽

2014 ◽

Cited By ~ 1

Author(s):

K. Jankowski ◽

A. Wymyslowski

Keyword(s):

Solder Joints ◽

Reliability Of Solder Joints

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Thermo-mechanical stress investigation of integrated SAW strain sensors

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2014.6813773 ◽

2014 ◽

Author(s):

Jochen Hempel ◽

Sohaib Anees ◽

Jurgen Wilde ◽

Leonhard Reindl

Keyword(s):

Mechanical Stress ◽

Strain Sensors

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Theoretical and experimental investigations on failure mechanisms occuring during long-term cycling of electrostatic actuators

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2014.6813822 ◽

2014 ◽

Cited By ~ 2

Author(s):

R. Behlert ◽

T. Kunzig ◽

G. Schrag ◽

G. Wachutka

Keyword(s):

Failure Mechanisms ◽

Experimental Investigations ◽

Electrostatic Actuators

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FEM simulations for built-in reliability of innovative Liquid Crystal Polymer-based QFN packaging and Sn96.5Ag3Cu0.5 solder joint

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2014.6813805 ◽

2014 ◽

Author(s):

Walide Chenniki ◽

Isabelle Bord-Majek ◽

Bruno Levrier ◽

Komkrisd Wongtimnoi ◽

Jean-Luc Diot ◽

...

Keyword(s):

Liquid Crystal ◽

Solder Joint ◽

Liquid Crystal Polymer ◽

Fem Simulations ◽

Crystal Polymer

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2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

System-level-model development of an SWCNT based piezoresistive sensor in VHDL-AMS

Analytical tool for electro-thermal modelling of microbolometers

Using molecular modeling to uncover the origins of subtle solvation-based film defects

System reliability for LED-based products

Structure design and reliability assessment of double-sided with double-chip stacking packaging

Multiphysical modeling of nanosecond laser dicing on ultra-thin silicon wafers

Creep and fatigue as main degradation phenomena in reliability of solder joints

Thermo-mechanical stress investigation of integrated SAW strain sensors

Theoretical and experimental investigations on failure mechanisms occuring during long-term cycling of electrostatic actuators

FEM simulations for built-in reliability of innovative Liquid Crystal Polymer-based QFN packaging and Sn96.5Ag3Cu0.5 solder joint

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2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

System-level-model development of an SWCNT based piezoresistive sensor in VHDL-AMS

Analytical tool for electro-thermal modelling of microbolometers

Using molecular modeling to uncover the origins of subtle solvation-based film defects

System reliability for LED-based products

Structure design and reliability assessment of double-sided with double-chip stacking packaging

Multiphysical modeling of nanosecond laser dicing on ultra-thin silicon wafers

Creep and fatigue as main degradation phenomena in reliability of solder joints

Thermo-mechanical stress investigation of integrated SAW strain sensors

Theoretical and experimental investigations on failure mechanisms occuring during long-term cycling of electrostatic actuators

FEM simulations for built-in reliability of innovative Liquid Crystal Polymer-based QFN packaging and Sn96.5Ag3Cu0.5 solder joint

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Latest Publications