2008 Electrical Design of Advanced Packaging and Systems Symposium
Latest Publications

TOTAL DOCUMENTS

66

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5

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Published By IEEE

9781424426331

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

LTCC-based triplexers for WiMAX front-end modules

2008 Electrical Design of Advanced Packaging and Systems Symposium ◽

10.1109/edaps.2008.4736032 ◽

2008 ◽

Author(s):

Dongsu Kim ◽

Dong Ho Kim ◽

Chong Dae Park ◽

Jong In Ryu ◽

Jun Chul Kim ◽

...

Keyword(s):

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Estimation of parallel FDTD-based electromagnetic field solver on PC cluster with multi-core CPUs

2008 Electrical Design of Advanced Packaging and Systems Symposium ◽

10.1109/edaps.2008.4736024 ◽

2008 ◽

Author(s):

Naoki Oguni ◽

Hideki Aasai

Keyword(s):

Electromagnetic Field ◽

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An efficient and broadband slot antenna for 60 GHz wireless applications

2008 Electrical Design of Advanced Packaging and Systems Symposium ◽

10.1109/edaps.2008.4736001 ◽

2008 ◽

Author(s):

Florian Ohnimus ◽

Ivan Ndip ◽

Stephan Guttowski ◽

Herbert Reichl

Keyword(s):

Slot Antenna ◽

60 Ghz ◽

Wireless Applications

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Hardware implementation of an Adaptive Noise canceller in an automobile environment

2008 Electrical Design of Advanced Packaging and Systems Symposium ◽

10.1109/edaps.2008.4735995 ◽

2008 ◽

Author(s):

Bu-Shik Ryu ◽

Jae-Kyun Lee ◽

Joonwan Kim ◽

Chae-Wook Lee

Keyword(s):

Hardware Implementation ◽

Adaptive Noise ◽

Adaptive Noise Canceller

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Optimization of via structure in multilayer PCB for high speed signal transmission

2008 Electrical Design of Advanced Packaging and Systems Symposium ◽

10.1109/edaps.2008.4736010 ◽

2008 ◽

Author(s):

Bong-Gyu Kang ◽

Hyun Kim ◽

Hee-do Kang ◽

Jong-Gwan Yook

Keyword(s):

Signal Transmission

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Electro-thermal characterization of single-walled carbon nanotube (SWCNT) interconnect arrays

2008 Electrical Design of Advanced Packaging and Systems Symposium ◽

10.1109/edaps.2008.4736028 ◽

2008 ◽

Author(s):

Wen-Chao Chen ◽

Lei Jia ◽

Wen-Yan Yin ◽

Q. H. Liu

Keyword(s):

Carbon Nanotube ◽

Thermal Characterization ◽

Single Walled Carbon Nanotube ◽

Single Walled Carbon

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Electrical performance of the imperfect reference plane for transmission line

2008 Electrical Design of Advanced Packaging and Systems Symposium ◽

10.1109/edaps.2008.4736012 ◽

2008 ◽

Author(s):

Jimmy Huang ◽

Jiun Kai Beh ◽

Jackson Kong ◽

Chan Kim Lee

Keyword(s):

Transmission Line ◽

Electrical Performance ◽

Reference Plane

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Coupled high-speed interconnect analysis on parallel platforms

2008 Electrical Design of Advanced Packaging and Systems Symposium ◽

10.1109/edaps.2008.4736035 ◽

2008 ◽

Author(s):

D. Paul ◽

N. M. Nakhla ◽

R. Achar ◽

M. S. Nakhla

Keyword(s):

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Module design using 2-layers PCB for an automotive BLDC motor driver

2008 Electrical Design of Advanced Packaging and Systems Symposium ◽

10.1109/edaps.2008.4736011 ◽

2008 ◽

Author(s):

Chang-Gyun Kim ◽

Tae-Heon Lee ◽

Sang-Kook Kim ◽

Jin-Yong Jeon ◽

Jae-Kyung Wee

Keyword(s):

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In-circuit impedance measurement based on a two-probe approach

2008 Electrical Design of Advanced Packaging and Systems Symposium ◽

10.1109/edaps.2008.4735992 ◽

2008 ◽

Author(s):

Richard Weng-Yew Chang ◽

Kye-Yak See ◽

Hu Bo

Keyword(s):

Impedance Measurement ◽

Circuit Impedance ◽

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