Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces
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Mechanical properties of Sn-In and Pb-In solders at low temperature

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces ◽

10.1109/isapm.1997.581258 ◽

2002 ◽

Cited By ~ 1

Author(s):

W.K. Jones ◽

Y.Q. Liu ◽

M. Shah

Keyword(s):

Mechanical Properties ◽

Low Temperature

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Laser machining of ceramics and silicon for MCM-D applications

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces ◽

10.1109/isapm.1997.581287 ◽

2002 ◽

Cited By ~ 2

Author(s):

V. Glaw ◽

R. Hahn ◽

A. Paredes ◽

U. Hein ◽

O. Ehrmann ◽

...

Keyword(s):

Laser Machining ◽

Machining Of Ceramics

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Low cost solder flip chip

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces ◽

10.1109/isapm.1997.581270 ◽

2002 ◽

Author(s):

G.A. Rinne ◽

P.A. Magill

Keyword(s):

Flip Chip ◽

Low Cost

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Embedding technology-a chip-first approach using BCB

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces ◽

10.1109/isapm.1997.581243 ◽

2002 ◽

Cited By ~ 12

Author(s):

M. Topper ◽

K. Buschick ◽

J. Wolf ◽

V. Glaw ◽

R. Hahn ◽

...

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Characterizing the failure envelope of a conductive adhesive

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces ◽

10.1109/isapm.1997.581274 ◽

2002 ◽

Cited By ~ 4

Author(s):

D. Olliff ◽

M. Gaynes ◽

R. Kodnani ◽

A. Zubelewicz

Keyword(s):

Conductive Adhesive ◽

Failure Envelope

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A novel thick film materials technology offering high performance packaging solutions

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces ◽

10.1109/isapm.1997.581285 ◽

2002 ◽

Cited By ~ 1

Author(s):

P. Barnwell

Keyword(s):

Thick Film ◽

High Performance

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Cost/performance analysis for plastic package "ruggedization" and thermal enhancement

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces ◽

10.1109/isapm.1997.581264 ◽

2002 ◽

Author(s):

L. Nguyen ◽

D. Tracy ◽

A. Chen ◽

R. Giberti ◽

J. Hatch ◽

...

Keyword(s):

Performance Analysis ◽

Cost Performance ◽

Plastic Package ◽

Thermal Enhancement

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A comprehensive study on 40-mil PBGA

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces ◽

10.1109/isapm.1997.581257 ◽

2002 ◽

Author(s):

R.T. Chen ◽

Yukon Chou ◽

T.C. Ho ◽

P.H. Chiang ◽

Chien-Chi Chao ◽

...

Keyword(s):

Comprehensive Study

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New material technology for high density interconnections

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces ◽

10.1109/isapm.1997.581247 ◽

2002 ◽

Cited By ~ 1

Author(s):

D.D. Johnson

Keyword(s):

High Density ◽

Material Technology ◽

New Material

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Self-reinforced dielectric substrates based on PIBO film

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces ◽

10.1109/isapm.1997.581242 ◽

2002 ◽

Author(s):

D.A. Dalman ◽

W.-F. Hwang ◽

W.J. Harris ◽

L.C. Lopez ◽

C.J. Murphy

Keyword(s):

Dielectric Substrates

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Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and InterfacesLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Mechanical properties of Sn-In and Pb-In solders at low temperature

Laser machining of ceramics and silicon for MCM-D applications

Low cost solder flip chip

Embedding technology-a chip-first approach using BCB

Characterizing the failure envelope of a conductive adhesive

A novel thick film materials technology offering high performance packaging solutions

Cost/performance analysis for plastic package "ruggedization" and thermal enhancement

A comprehensive study on 40-mil PBGA

New material technology for high density interconnections

Self-reinforced dielectric substrates based on PIBO film

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces
Latest Publications