Proceedings of 1994 IEEE International Reliability Physics Symposium RELPHY-94
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Field and temperature acceleration of time-dependent dielectric breakdown in intrinsic thin SiO/sub 2/

Proceedings of 1994 IEEE International Reliability Physics Symposium RELPHY-94 ◽

10.1109/relphy.1994.307847 ◽

1994 ◽

Author(s):

J.S. Suehle ◽

P. Chaparala ◽

C. Messick ◽

W.M. Miller ◽

K.C. Boyko

Keyword(s):

Dielectric Breakdown ◽

Time Dependent ◽

Time Dependent Dielectric Breakdown

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Effects of temperature and defects on breakdown lifetime of thin SiO/sub 2/ at very low voltages

Proceedings of 1994 IEEE International Reliability Physics Symposium RELPHY-94 ◽

10.1109/relphy.1994.307846 ◽

1994 ◽

Author(s):

K.F. Schuegraf ◽

Chenming Hu

Keyword(s):

Effects Of Temperature

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Analysis of externally imposed mechanical stress effects on the hot-carrier-induced degradation of MOSFET's

Proceedings of 1994 IEEE International Reliability Physics Symposium RELPHY-94 ◽

10.1109/relphy.1994.307861 ◽

1994 ◽

Author(s):

R. Degraeve ◽

I. De Wolf ◽

G. Groeseneken ◽

H.E. Maes

Keyword(s):

Mechanical Stress ◽

Hot Carrier ◽

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Proceedings of 1994 IEEE International Reliability Physics Symposium

Proceedings of 1994 IEEE International Reliability Physics Symposium RELPHY-94 ◽

10.1109/relphy.1994.307866 ◽

1994 ◽

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Wide line, low current electromigration in Al-Cu metallization with refractory underlayer

Proceedings of 1994 IEEE International Reliability Physics Symposium RELPHY-94 ◽

10.1109/relphy.1994.307837 ◽

1994 ◽

Author(s):

B. Baerg ◽

R. Crandall ◽

K. Wu

Keyword(s):

Cu Metallization ◽

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Two electromigration failure modes in polycrystalline aluminum interconnects

Proceedings of 1994 IEEE International Reliability Physics Symposium RELPHY-94 ◽

10.1109/relphy.1994.307834 ◽

1994 ◽

Author(s):

E.M. Atakov ◽

J.J. Clement ◽

B. Miner

Keyword(s):

Failure Modes ◽

Polycrystalline Aluminum ◽

Aluminum Interconnects

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Characterization of wafer charging mechanisms and oxide survival prediction methodology

Proceedings of 1994 IEEE International Reliability Physics Symposium RELPHY-94 ◽

10.1109/relphy.1994.307816 ◽

1994 ◽

Author(s):

W. Lukaszek ◽

W. Dixon ◽

M. Vella ◽

C. Messick ◽

S. Reno ◽

...

Keyword(s):

Survival Prediction ◽

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Novel failure analysis techniques using photon probing with a scanning optical microscope

Proceedings of 1994 IEEE International Reliability Physics Symposium RELPHY-94 ◽

10.1109/relphy.1994.307808 ◽

1994 ◽

Author(s):

E.I. Cole ◽

J.M. Soden ◽

J.L. Rife ◽

D.L. Barton ◽

C.L. Henderson

Keyword(s):

Failure Analysis ◽

Optical Microscope ◽

Analysis Techniques

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Toward the maieutic management of business systems

Proceedings of 1994 IEEE International Reliability Physics Symposium RELPHY-94 ◽

10.1109/relphy.1994.307862 ◽

1994 ◽

Author(s):

R. Goldwater ◽

H. Berens ◽

F. Jonath ◽

B. Vasquez ◽

A. Jonath

Keyword(s):

Business Systems

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Long term charge loss in EPROMs with ONO interpoly dielectric

Proceedings of 1994 IEEE International Reliability Physics Symposium RELPHY-94 ◽

10.1109/relphy.1994.307811 ◽

1994 ◽

Author(s):

M.R. Hermann ◽

M. Ciappa ◽

A. Schenk

Keyword(s):

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