International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)
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77

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7

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Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Development of environmental friendly (green), thermally enhanced mold compound (TEMC) for advanced packages

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) ◽

10.1109/emap.2000.904147 ◽

2002 ◽

Author(s):

T.H. Tan ◽

N. Mogi ◽

L.P. Yeoh

Keyword(s):

Environmental Friendly

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Simulation of the stencil printing process [solder pastes]

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) ◽

10.1109/emap.2000.904181 ◽

2002 ◽

Author(s):

G.P. Glinski ◽

C. Bailey ◽

K. Pericleous

Keyword(s):

Stencil Printing ◽

Printing Process ◽

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Application of Py-GC/MS in electronic packaging industry for monitoring curing processes of EMCs

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) ◽

10.1109/emap.2000.904194 ◽

2002 ◽

Author(s):

Yijin Xu ◽

A. Teng

Keyword(s):

Electronic Packaging ◽

Packaging Industry

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Modelling the effect of geometrical scaling on micro-electronic packaging

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) ◽

10.1109/emap.2000.904139 ◽

2002 ◽

Author(s):

D.C. Hyslop ◽

W.H. Muller ◽

K.M.W. Ng ◽

K.H. Tan ◽

H.-J. Albrecht

Keyword(s):

Electronic Packaging ◽

Geometrical Scaling

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The mechanical properties degradation of solder joints under thermal cycling

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) ◽

10.1109/emap.2000.904153 ◽

2002 ◽

Author(s):

Wang Qian ◽

S.-W.R. Lee ◽

Wang Gangqiang ◽

Chen Guohai ◽

Hung Le ◽

...

Keyword(s):

Mechanical Properties ◽

Thermal Cycling ◽

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Experimental and numerical analyses of flip-chip attach reliability

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) ◽

10.1109/emap.2000.904140 ◽

2002 ◽

Author(s):

A. Schubert ◽

R. Dudek ◽

B. Michel

Keyword(s):

Flip Chip ◽

Numerical Analyses

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An investigation into curing behavior and kinetics of underfills for flip chip packages

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) ◽

10.1109/emap.2000.904172 ◽

2002 ◽

Author(s):

Zhang Fan ◽

Ming Li ◽

Lin Ting Ting ◽

Chiu Cheng-Hsin ◽

W.T. Chen

Keyword(s):

Flip Chip ◽

Curing Behavior ◽

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The applicability of electrodeposited photoresist in producing ultra-fine lines using sputtered seeding layers

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) ◽

10.1109/emap.2000.904145 ◽

2002 ◽

Author(s):

P. Jalonen ◽

A. Tuominen

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The application of mold flow simulation in electronic package

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) ◽

10.1109/emap.2000.904175 ◽

2002 ◽

Author(s):

K. Chai ◽

V. Liu ◽

Y.P. Wang ◽

T.D. Her

Keyword(s):

Flow Simulation ◽

Electronic Package ◽

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Design and estimation of embedded passives in multiple line grid array (MLGA) package

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) ◽

10.1109/emap.2000.904177 ◽

2002 ◽

Author(s):

Junho Lee ◽

Seungyoung Ahn ◽

Seungyong Baek ◽

Joungho Kim ◽

Young-Soo Kim ◽

...

Keyword(s):

Multiple Line ◽

Embedded Passives

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