International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)
Latest Publications

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(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

0780366549

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Simulation of the stencil printing process [solder pastes]

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) ◽

10.1109/emap.2000.904181 ◽

2002 ◽

Cited By ~ 6

Author(s):

G.P. Glinski ◽

C. Bailey ◽

K. Pericleous

Keyword(s):

Stencil Printing ◽

Printing Process ◽

Solder Pastes

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Application of Py-GC/MS in electronic packaging industry for monitoring curing processes of EMCs

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) ◽

10.1109/emap.2000.904194 ◽

2002 ◽

Author(s):

Yijin Xu ◽

A. Teng

Keyword(s):

Electronic Packaging ◽

Packaging Industry

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Development of environmental friendly (green), thermally enhanced mold compound (TEMC) for advanced packages

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) ◽

10.1109/emap.2000.904147 ◽

2002 ◽

Cited By ~ 3

Author(s):

T.H. Tan ◽

N. Mogi ◽

L.P. Yeoh

Keyword(s):

Environmental Friendly

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Modelling the effect of geometrical scaling on micro-electronic packaging

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) ◽

10.1109/emap.2000.904139 ◽

2002 ◽

Author(s):

D.C. Hyslop ◽

W.H. Muller ◽

K.M.W. Ng ◽

K.H. Tan ◽

H.-J. Albrecht

Keyword(s):

Electronic Packaging ◽

Geometrical Scaling

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The mechanical properties degradation of solder joints under thermal cycling

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) ◽

10.1109/emap.2000.904153 ◽

2002 ◽

Cited By ~ 1

Author(s):

Wang Qian ◽

S.-W.R. Lee ◽

Wang Gangqiang ◽

Chen Guohai ◽

Hung Le ◽

...

Keyword(s):

Mechanical Properties ◽

Thermal Cycling ◽

Solder Joints

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Experimental and numerical analyses of flip-chip attach reliability

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) ◽

10.1109/emap.2000.904140 ◽

2002 ◽

Author(s):

A. Schubert ◽

R. Dudek ◽

B. Michel

Keyword(s):

Flip Chip ◽

Numerical Analyses

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Microstructure and adhesion strength of copper substrate after oxidation with a newly developed chemical solution

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) ◽

10.1109/emap.2000.904158 ◽

2002 ◽

Author(s):

Xinyong Fan ◽

E. Chan ◽

J. Yuen ◽

A. Lam ◽

N. Fan ◽

...

Keyword(s):

Adhesion Strength ◽

Copper Substrate ◽

Chemical Solution

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Advanced substrate technology for ball grid array in electronic packaging

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) ◽

10.1109/emap.2000.904176 ◽

2002 ◽

Cited By ~ 3

Author(s):

Y.P. Wang ◽

T.D. Her

Keyword(s):

Electronic Packaging ◽

Ball Grid Array

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Measurement of water evaporation rate from epoxy

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) ◽

10.1109/emap.2000.904196 ◽

2002 ◽

Author(s):

Iok-Tong Chong ◽

D.C.C. Lam ◽

Pin Tong

Keyword(s):

Evaporation Rate ◽

Water Evaporation

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The application of mold flow simulation in electronic package

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) ◽

10.1109/emap.2000.904175 ◽

2002 ◽

Cited By ~ 4

Author(s):

K. Chai ◽

V. Liu ◽

Y.P. Wang ◽

T.D. Her

Keyword(s):

Flow Simulation ◽

Electronic Package ◽

Mold Flow

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International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Simulation of the stencil printing process [solder pastes]

Application of Py-GC/MS in electronic packaging industry for monitoring curing processes of EMCs

Development of environmental friendly (green), thermally enhanced mold compound (TEMC) for advanced packages

Modelling the effect of geometrical scaling on micro-electronic packaging

The mechanical properties degradation of solder joints under thermal cycling

Experimental and numerical analyses of flip-chip attach reliability

Microstructure and adhesion strength of copper substrate after oxidation with a newly developed chemical solution

Advanced substrate technology for ball grid array in electronic packaging

Measurement of water evaporation rate from epoxy

The application of mold flow simulation in electronic package

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)
Latest Publications