IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat No 01TH8565) EPEP-01

2002 ◽

Author(s):

Wei Cui ◽

Jun Fan ◽

Shaofeng Luan ◽

J.L. Drewniak

Keyword(s):

Layer Structure

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Effective decoupling radius of decoupling capacitor

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat No 01TH8565) EPEP-01 ◽

10.1109/epep.2001.967663 ◽

2002 ◽

Cited By ~ 3

Author(s):

Huabo Chen ◽

Jiayuan Fang ◽

Weimin Shi

Keyword(s):

Decoupling Capacitor

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Reduced-order models based on measured S-parameters for time-frequency analysis of microwave circuits using genetic algorithms

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat No 01TH8565) EPEP-01 ◽

10.1109/epep.2001.967639 ◽

2002 ◽

Author(s):

J.M. Gomez ◽

B. Gomez ◽

M. Ruiperez ◽

J.I. Alonso

Keyword(s):

Genetic Algorithms ◽

Frequency Analysis ◽

Microwave Circuits ◽

Reduced Order Models ◽

Time Frequency Analysis ◽

Reduced Order ◽

Time Frequency ◽

S Parameters

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Analysis of transmission line circuits using multi-dimensional model reduction techniques

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat No 01TH8565) EPEP-01 ◽

10.1109/epep.2001.967607 ◽

2002 ◽

Cited By ~ 4

Author(s):

P. Gunupudi ◽

R. Khazaka ◽

M. Nakhla

Keyword(s):

Transmission Line ◽

Model Reduction ◽

Dimensional Model ◽

Reduction Techniques

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Characterization of the novel anisotropic uniplanar compact photonic band-gap ground plane (UC-PBG-GP)

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat No 01TH8565) EPEP-01 ◽

10.1109/epep.2001.967601 ◽

2002 ◽

Cited By ~ 4

Author(s):

C. Caloz ◽

T. Itoh

Keyword(s):

Band Gap ◽

Photonic Band Gap ◽

Ground Plane ◽

The Novel ◽

Photonic Band

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Millimeter wave package design: a comparison of simulation and measurement results

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat No 01TH8565) EPEP-01 ◽

10.1109/epep.2001.967604 ◽

2002 ◽

Cited By ~ 6

Author(s):

L. Shan ◽

M. Meghelli ◽

Joong-Ho Kim ◽

J. Trewhella ◽

M. Taubenblatt ◽

...

Keyword(s):

Millimeter Wave ◽

Package Design ◽

Wave Package ◽

Measurement Results

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Integrated RF function architectures in fully-organic SOP technology

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat No 01TH8565) EPEP-01 ◽

10.1109/epep.2001.967619 ◽

2002 ◽

Cited By ~ 4

Author(s):

M.F. Davis ◽

A. Sutono ◽

A. Obatoyinbo ◽

S. Chakraborty ◽

K. Lim ◽

...

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Analysis of power/ground planes by PCB simulator with model order reduction technique

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat No 01TH8565) EPEP-01 ◽

10.1109/epep.2001.967615 ◽

2002 ◽

Cited By ~ 3

Author(s):

H. Kubota ◽

A. Kamo ◽

T. Watanabe ◽

H. Asai

Keyword(s):

Model Order Reduction ◽

Order Reduction ◽

Reduction Technique ◽

Model Order

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High bandwidth low latency chip to chip interconnects using high performance MLC glass ceramic POWER4/sup R/ MCM

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat No 01TH8565) EPEP-01 ◽

10.1109/epep.2001.967668 ◽

2002 ◽

Author(s):

P. Walling ◽

A. Tai ◽

H. Hamel ◽

R. Weekly ◽

A. Haridass

Keyword(s):

Glass Ceramic ◽

High Performance ◽

Low Latency ◽

High Bandwidth

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Robust extraction of the frequency-dependent characteristic impedance of transmission lines using one-port TDR measurements

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat No 01TH8565) EPEP-01 ◽

10.1109/epep.2001.967624 ◽

2002 ◽

Author(s):

Woopoung Kim ◽

Seock Hee Lee ◽

M. Swaminathan ◽

R.R. Tummala

Keyword(s):

Transmission Lines ◽

Characteristic Impedance ◽

Frequency Dependent

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IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat No 01TH8565) EPEP-01
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Modeling shared-via decoupling in a multi-layer structure using the CEMPIE approach

Effective decoupling radius of decoupling capacitor

Reduced-order models based on measured S-parameters for time-frequency analysis of microwave circuits using genetic algorithms

Analysis of transmission line circuits using multi-dimensional model reduction techniques

Characterization of the novel anisotropic uniplanar compact photonic band-gap ground plane (UC-PBG-GP)

Millimeter wave package design: a comparison of simulation and measurement results

Integrated RF function architectures in fully-organic SOP technology

Analysis of power/ground planes by PCB simulator with model order reduction technique

High bandwidth low latency chip to chip interconnects using high performance MLC glass ceramic POWER4/sup R/ MCM

Robust extraction of the frequency-dependent characteristic impedance of transmission lines using one-port TDR measurements

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IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat No 01TH8565) EPEP-01Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Modeling shared-via decoupling in a multi-layer structure using the CEMPIE approach

Effective decoupling radius of decoupling capacitor

Reduced-order models based on measured S-parameters for time-frequency analysis of microwave circuits using genetic algorithms

Analysis of transmission line circuits using multi-dimensional model reduction techniques

Characterization of the novel anisotropic uniplanar compact photonic band-gap ground plane (UC-PBG-GP)

Millimeter wave package design: a comparison of simulation and measurement results

Integrated RF function architectures in fully-organic SOP technology

Analysis of power/ground planes by PCB simulator with model order reduction technique

High bandwidth low latency chip to chip interconnects using high performance MLC glass ceramic POWER4/sup R/ MCM

Robust extraction of the frequency-dependent characteristic impedance of transmission lines using one-port TDR measurements

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat No 01TH8565) EPEP-01
Latest Publications