2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781479907076, 9781479907052

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Robust PoP probing solutions for high-performance application processor developments

2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2013.6703489 ◽

2013 ◽

Cited By ~ 2

Author(s):

Weiliang Yuan ◽

SungJoo Kim ◽

Woong Hwan Ryu ◽

SeongJae Moon ◽

Sangmin Lee

Keyword(s):

High Performance ◽

Application Processor ◽

High Performance Application

Download Full-text

Mitigation of TSV-substrate noise coupling in 3-D CMOS SOI technology

2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2013.6703470 ◽

2013 ◽

Cited By ~ 3

Author(s):

Xiaoxiong Gu ◽

Keith Jenkins

Keyword(s):

Substrate Noise ◽

Noise Coupling ◽

Substrate Noise Coupling ◽

Soi Technology

Download Full-text

Electrical characterization of low-cost glass/epoxy laminates at millimeter wave frequencies

2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2013.6703455 ◽

2013 ◽

Cited By ~ 4

Author(s):

Noam Kaminski ◽

Evgeny Shumakher ◽

Danny Elad ◽

Keishi Okamoto ◽

Kazushige Toriyama ◽

...

Keyword(s):

Millimeter Wave ◽

Low Cost ◽

Electrical Characterization

Download Full-text

Connecting vector fitting to barycentric interpolation and the Loewner matrix

2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2013.6703483 ◽

2013 ◽

Author(s):

Sanda Lefteriu ◽

Athanasios C. Antoulas

Keyword(s):

Vector Fitting ◽

Barycentric Interpolation

Download Full-text

A novel flexible on-die decoupling scheme using package interconnects

2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2013.6703488 ◽

2013 ◽

Cited By ~ 1

Author(s):

Kundan Chand ◽

Dan Oh ◽

Hui Liu ◽

Hong Shi

Download Full-text

Characterization of TSVs by cascaded daisy chains

2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2013.6703511 ◽

2013 ◽

Author(s):

Yi-Chen Wu ◽

Kai-Bin Wu ◽

Kang-Yun Yang ◽

Ting-Yi Huang ◽

Ruey-Beei Wu

Download Full-text

A novel algorithm for optimum order estimation of nonlinear reduced macromodels

2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2013.6703484 ◽

2013 ◽

Author(s):

Behzad Nouri ◽

Michel S. Nakhla ◽

Ramachandra Achar

Keyword(s):

Order Estimation ◽

Optimum Order ◽

Novel Algorithm

Download Full-text

Noise compliant macromodel synthesis for RF and Mixed-Signal applications

2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2013.6703482 ◽

2013 ◽

Cited By ~ 2

Author(s):

Salvatore Bernardo Olivadese ◽

Stefano Grivet-Talocia ◽

Pietro Brenner

Keyword(s):

Mixed Signal

Download Full-text

Rambus bringing invention to market

2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2013.6703449 ◽

2013 ◽

Download Full-text

Implementation of a RF front-end module by embedding ICs in molding package

2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2013.6703494 ◽

2013 ◽

Author(s):

Jong-In Ryu ◽

Se Hoon Park ◽

Jong Min Yook ◽

Dongsu Kim ◽

Jong Chul Park

Keyword(s):

Front End ◽

Rf Front End ◽

Front End Module

Download Full-text

2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and SystemsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Robust PoP probing solutions for high-performance application processor developments

Mitigation of TSV-substrate noise coupling in 3-D CMOS SOI technology

Electrical characterization of low-cost glass/epoxy laminates at millimeter wave frequencies

Connecting vector fitting to barycentric interpolation and the Loewner matrix

A novel flexible on-die decoupling scheme using package interconnects

Characterization of TSVs by cascaded daisy chains

A novel algorithm for optimum order estimation of nonlinear reduced macromodels

Noise compliant macromodel synthesis for RF and Mixed-Signal applications

Rambus bringing invention to market

Implementation of a RF front-end module by embedding ICs in molding package

2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems
Latest Publications