Proceedings 1997 International Conference on Multichip Modules
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Published By IEEE

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A process to improve capability in North American electronics manufacturing

Proceedings 1997 International Conference on Multichip Modules ◽

10.1109/icmcm.1997.581140 ◽

2002 ◽

Author(s):

R. Gedney ◽

J. McElroy

Keyword(s):

North American ◽

Electronics Manufacturing

Materials, processes and reliability evaluation of photodielectrics for sequential circuit application

Proceedings 1997 International Conference on Multichip Modules ◽

10.1109/icmcm.1997.581160 ◽

2002 ◽

Author(s):

Weiping Li ◽

R. Tummala ◽

R. Funer ◽

C. Sullivan

Keyword(s):

Reliability Evaluation ◽

Sequential Circuit

Trends in flip chip and advanced interconnection

Proceedings 1997 International Conference on Multichip Modules ◽

10.1109/icmcm.1997.581141 ◽

2002 ◽

Author(s):

D.H. Francis

Keyword(s):

Flip Chip

Simulated and practical behaviour of state-of-the-art MCM via structures

Proceedings 1997 International Conference on Multichip Modules ◽

10.1109/icmcm.1997.581192 ◽

2002 ◽

Author(s):

Daiqing Li ◽

C.E. Free ◽

K.E.G. Pitt ◽

P.G. Barnwell

Keyword(s):

State Of The Art

A wafer-level burn-in technology using the contactor controlled thermal expansion

Proceedings 1997 International Conference on Multichip Modules ◽

10.1109/icmcm.1997.581186 ◽

2002 ◽

Cited By ~ 4

Author(s):

Y. Nakata ◽

I. Miyanaga ◽

S. Oki ◽

H. Fujimoto

Keyword(s):

Thermal Expansion ◽

Wafer Level

Fabrication of a DRAM cube using a novel laser patterned 3-D interconnect process

Proceedings 1997 International Conference on Multichip Modules ◽

10.1109/icmcm.1997.581166 ◽

2002 ◽

Cited By ~ 2

Author(s):

V. Malba ◽

V. Liberman ◽

A.F. Bernhardt

Evaluation of die coating materials for chip-on-board technology insertion in spaceborne applications

Proceedings 1997 International Conference on Multichip Modules ◽

10.1109/icmcm.1997.581163 ◽

2002 ◽

Cited By ~ 2

Author(s):

B.Q. Le ◽

E. Nhan ◽

R.H. Maurer ◽

A.L. Lew ◽

J.R. Lander ◽

...

Keyword(s):

Coating Materials

A family of high performance MCM-C/D packages utilizing cofired alumina multilayer ceramic and a shielded thin film redistribution structure

Proceedings 1997 International Conference on Multichip Modules ◽

10.1109/icmcm.1997.581143 ◽

2002 ◽

Cited By ~ 4

Author(s):

W. Shutler ◽

Hai Longworth ◽

J. Pennacchia ◽

E. Perfecto ◽

R. Shields

Keyword(s):

Thin Film ◽

High Performance ◽

Multilayer Ceramic

Silicon MCM-D technology for RF integration

Proceedings 1997 International Conference on Multichip Modules ◽

10.1109/icmcm.1997.581202 ◽

2002 ◽

Cited By ~ 15

Author(s):

R.G. Arnold ◽

C.C. Faulkner ◽

D.J. Pedder

Design and development challenges for complex laminate multichip modules

Proceedings 1997 International Conference on Multichip Modules ◽

10.1109/icmcm.1997.581173 ◽

2002 ◽

Cited By ~ 1

Author(s):

C.D. Cotton ◽

D.R. Kling ◽

G. Sebesta

Keyword(s):

Multichip Modules ◽

Design And Development

Proceedings 1997 International Conference on Multichip ModulesLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A process to improve capability in North American electronics manufacturing

Materials, processes and reliability evaluation of photodielectrics for sequential circuit application

Trends in flip chip and advanced interconnection

Simulated and practical behaviour of state-of-the-art MCM via structures

A wafer-level burn-in technology using the contactor controlled thermal expansion

Fabrication of a DRAM cube using a novel laser patterned 3-D interconnect process

Evaluation of die coating materials for chip-on-board technology insertion in spaceborne applications

A family of high performance MCM-C/D packages utilizing cofired alumina multilayer ceramic and a shielded thin film redistribution structure

Silicon MCM-D technology for RF integration

Design and development challenges for complex laminate multichip modules

Proceedings 1997 International Conference on Multichip Modules
Latest Publications