IEEE International Integrated Reliability Workshop Final Report, 2004
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

0780385179

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Atomic scale defects involved in NBTI

IEEE International Integrated Reliability Workshop Final Report, 2004 ◽

10.1109/irws.2004.1422752 ◽

2005 ◽

Cited By ~ 2

Author(s):

J.P. Campbell ◽

P.M. Lenahan ◽

A.T. Krishnan ◽

S. Krishnan

Keyword(s):

Atomic Scale

Download Full-text

Hydrogen release and defect generation rate in ultra-thin oxides

IEEE International Integrated Reliability Workshop Final Report, 2004 ◽

10.1109/irws.2004.1422726 ◽

2005 ◽

Cited By ~ 1

Author(s):

V. Huard ◽

M. Denais ◽

F. Monsieur

Keyword(s):

Hydrogen Release ◽

Generation Rate ◽

Defect Generation

Download Full-text

Mechanism of dynamic NBTI of pMOSFETs

IEEE International Integrated Reliability Workshop Final Report, 2004 ◽

10.1109/irws.2004.1422751 ◽

2005 ◽

Cited By ~ 8

Author(s):

B. Zhu ◽

J.S. Suehle ◽

J.B. Bernstein ◽

Y. Chen

Download Full-text

A comprehensive analysis of NFET degradation due to off-state stress

IEEE International Integrated Reliability Workshop Final Report, 2004 ◽

10.1109/irws.2004.1422747 ◽

2005 ◽

Cited By ~ 10

Author(s):

K. Hofmann ◽

S. Holzbauser ◽

C.Y. Kuo

Keyword(s):

Comprehensive Analysis ◽

State Stress

Download Full-text

An innovative multi-via test structure for wafer-level isothermal electromigration

IEEE International Integrated Reliability Workshop Final Report, 2004 ◽

10.1109/irws.2004.1422762 ◽

2005 ◽

Cited By ~ 1

Author(s):

S.F.C. Tseng ◽

Wei-Ting Kary Chien ◽

Willings Wang

Keyword(s):

Test Structure ◽

Wafer Level

Download Full-text

Circuit and silicide impact on the correlation between TLP and ESD (HBM and MM)

IEEE International Integrated Reliability Workshop Final Report, 2004 ◽

10.1109/irws.2004.1422766 ◽

2005 ◽

Cited By ~ 8

Author(s):

S.C. Huang ◽

J.H. Lee ◽

S.C. Lee ◽

K.M. Chen ◽

M.H. Song ◽

...

Download Full-text

Electromigration in narrow and large damascene copper lines

IEEE International Integrated Reliability Workshop Final Report, 2004 ◽

10.1109/irws.2004.1422742 ◽

2005 ◽

Cited By ~ 1

Author(s):

V. Girault ◽

F. Terrier ◽

M. Gregoire

Download Full-text

Characterization of alternative gate dielectrics using electrical I-V and C-V measurements

IEEE International Integrated Reliability Workshop Final Report, 2004 ◽

10.1109/irws.2004.1422777 ◽

2005 ◽

Author(s):

K.Z. Ahmed

Keyword(s):

Gate Dielectrics

Download Full-text

Bayesian approach to reliability projection for high k dielectric thin films

IEEE International Integrated Reliability Workshop Final Report, 2004 ◽

10.1109/irws.2004.1422771 ◽

2005 ◽

Author(s):

Wen Luo ◽

Way Kuo ◽

Yue Kuo

Keyword(s):

Thin Films ◽

Bayesian Approach ◽

Dielectric Thin Films ◽

High K ◽

High K Dielectric

Download Full-text

The study of sputtered RF Ta on the PID in Cu dual damascene technology

IEEE International Integrated Reliability Workshop Final Report, 2004 ◽

10.1109/irws.2004.1422763 ◽

2005 ◽

Author(s):

Wen Hui Lu ◽

Kim Keng Teo ◽

Chaw Sing Ho ◽

Kin Leong Yap ◽

Keng Foo Lo

Keyword(s):

Dual Damascene

Download Full-text

IEEE International Integrated Reliability Workshop Final Report, 2004Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Atomic scale defects involved in NBTI

Hydrogen release and defect generation rate in ultra-thin oxides

Mechanism of dynamic NBTI of pMOSFETs

A comprehensive analysis of NFET degradation due to off-state stress

An innovative multi-via test structure for wafer-level isothermal electromigration

Circuit and silicide impact on the correlation between TLP and ESD (HBM and MM)

Electromigration in narrow and large damascene copper lines

Characterization of alternative gate dielectrics using electrical I-V and C-V measurements

Bayesian approach to reliability projection for high k dielectric thin films

The study of sputtered RF Ta on the PID in Cu dual damascene technology

IEEE International Integrated Reliability Workshop Final Report, 2004
Latest Publications