2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)
Latest Publications

TOTAL DOCUMENTS

653

(FIVE YEARS 653)

H-INDEX

5

(FIVE YEARS 5)

Published By IEEE

9781538681046

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Gas Visualization with Photo-Induced 2D Pixel Patterned Au/Ag Core-Shell LSPR Imaging Device by Mask-Less Exposure System

2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) ◽

10.1109/transducers.2019.8808591 ◽

2019 ◽

Author(s):

Takaaki Soeda ◽

Zhongyuan Yang ◽

Fumihiro Sassa ◽

Kenshi Hayashi

Keyword(s):

Exposure System ◽

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Reprogrammable Microelectromechanical Membrane Resonator for Logic Computation

2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) ◽

10.1109/transducers.2019.8808714 ◽

2019 ◽

Author(s):

Xinxin Liu ◽

Dengfei Yang ◽

Dongyang Chen ◽

Xuying Chen ◽

Xianhao Le ◽

...

Keyword(s):

Logic Computation

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Strain Sensor Based on Optical Intensity Change Through the Carbon Nanotube Embedded Elastomer

2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) ◽

10.1109/transducers.2019.8808701 ◽

2019 ◽

Author(s):

Jimin Gu ◽

Donguk Kwon ◽

Junseong Ahn ◽

Inkyu Park

Keyword(s):

Carbon Nanotube ◽

Strain Sensor ◽

Intensity Change ◽

Optical Intensity

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Rapid Assessment of Combined Drop on Demand and Extrusion-based Bioprinting with Controlled Shear Stress and High Shape Fidelity

2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) ◽

10.1109/transducers.2019.8808595 ◽

2019 ◽

Author(s):

Fritz Koch ◽

Maximilian Wehrle ◽

Kevin Trondle ◽

Peter Koltay ◽

Gunter Finkenzeller ◽

...

Keyword(s):

Shear Stress ◽

Rapid Assessment ◽

On Demand ◽

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Waterproof, Omnidirectionally Stretchable Electronics with Multilayer Patterns Via Rapid, Photolithography-Free Fabrication

2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) ◽

10.1109/transducers.2019.8808430 ◽

2019 ◽

Author(s):

Renxiao Xu ◽

Peisheng He ◽

Mohan Sanghadasa ◽

Liwei Lin

Keyword(s):

Stretchable Electronics

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Dynamic in Vitro Biosensing with Flexible Microporous Multimodal Cell-Interfacial Sensors

2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) ◽

10.1109/transducers.2019.8808615 ◽

2019 ◽

Author(s):

Ashley A. Chapin ◽

Pradeep R. Rajasekaran ◽

Jens Herberholz ◽

William E. Bentley ◽

Reza Ghodssi

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Facile, Packaging Substrate-Agnostic, Microfabrication and Assembly of Scalable 3D Metal Microelectrode Arrays for in Vitro Organ-on-a-Chip and Cellular Disease Modeling

2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) ◽

10.1109/transducers.2019.8808364 ◽

2019 ◽

Author(s):

Charles M. Didier ◽

Avra Kundu ◽

Swaminathan Rajaraman

Keyword(s):

Disease Modeling ◽

Microelectrode Arrays ◽

Metal Microelectrode ◽

Organ On A Chip

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Wafer-Scale Self-Aligned Fabrication of Nanometric Curved Tunneling Junctions

2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) ◽

10.1109/transducers.2019.8808559 ◽

2019 ◽

Author(s):

Yasser Pordeli ◽

Bjorn T.H. Borgelink ◽

Bernhard Y. van der Wel ◽

Erwin J.W. Berenschot ◽

Tamer Dogan ◽

...

Keyword(s):

Wafer Scale ◽

Tunneling Junctions

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TRANSDUCERS & EUROSENSORS XXXIII 2019 Author Index

2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) ◽

10.1109/transducers.2019.8808227 ◽

2019 ◽

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Effect of Substrate Thickness on Anchor Damping in MEMS Devices

2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) ◽

10.1109/transducers.2019.8808424 ◽

2019 ◽

Author(s):

Gabrielle D. Vukasin ◽

Veronica K. Sanchez ◽

Christopher P. Cameron ◽

Hyun-Keun Kwon ◽

Janna Rodriguez ◽

...

Keyword(s):

Substrate Thickness ◽

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