2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Mechanical Behavior Evolution of SAC+Bi Lead Free Solder Exposed to Thermal Cycling

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190579 ◽

2020 ◽

Author(s):

S. M. Kamrul Hasan ◽

Abdullah Fahim ◽

Jeffrey C. Suhling ◽

Sa'd Hamasha ◽

Pradeep Lall

Keyword(s):

Thermal Cycling ◽

Mechanical Behavior ◽

Lead Free ◽

Lead Free Solder ◽

Free Solder

Thermal Modeling of Vapor Chamber Heat Spreaders and Model Validation

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190467 ◽

2020 ◽

Author(s):

Pritish R. Parida ◽

Ken Marston ◽

Kevin Drummond ◽

Levi Campbell ◽

Yuji Saito ◽

...

Keyword(s):

Model Validation ◽

Thermal Modeling ◽

Vapor Chamber ◽

Heat Spreaders

Transient Thermal Analysis of an Air-Conditioned IT Rack with a Thermal Buffering Unit

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190229 ◽

2020 ◽

Author(s):

James VanGilder ◽

Wei Tian ◽

John Bean

Keyword(s):

Thermal Analysis ◽

Transient Thermal Analysis ◽

Thermal Buffering ◽

Transient Thermal

Corrosion in Liquid Cooling Systems with Water-Based Coolant – Part 1: Flow Loop Design for Reliability Tests

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190607 ◽

2020 ◽

Author(s):

Girish Kini ◽

Choong-Un Kim ◽

H. Madanipour ◽

Je-Young Chang ◽

Amitesh Saha ◽

...

Keyword(s):

Flow Loop ◽

Liquid Cooling ◽

Cooling Systems ◽

Design For Reliability ◽

Loop Design ◽

Water Based

Thermal Performance of Pump-assisted Loop Heat Pipe using R245fa as Working Fluid

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190552 ◽

2020 ◽

Author(s):

Shyy Woei Chang ◽

Kuei-Feng Chiang ◽

Fang-Chou Lin ◽

Wei-Sheng Hung

Keyword(s):

Heat Pipe ◽

Thermal Performance ◽

Working Fluid ◽

Loop Heat Pipe

An Electrochemical-thermal Coupled Gas Generation and Overcharge-to-thermal-runaway Model for Large-format Lithium Ion Battery

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190182 ◽

2020 ◽

Author(s):

Jiajun Xu ◽

Christopher Hendricks

Keyword(s):

Lithium Ion Battery ◽

Lithium Ion ◽

Thermal Runaway ◽

Gas Generation ◽

Large Format

Analyzing the Distribution of Microencapsulated Organic Phase Change Materials Embedded in a Metallic Matrix

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190502 ◽

2020 ◽

Author(s):

Melissa K. McCann ◽

Michael C. Fish ◽

Lauren M. Boteler ◽

Damena D. Agonafer

Keyword(s):

Phase Change ◽

Organic Phase ◽

Phase Change Materials ◽

Metallic Matrix

Quiet Revolutions: How Advanced Microelectronics Packaging Continues to Drive Heterogeneous Integration1

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190247 ◽

2020 ◽

Author(s):

Ravi Mahajan

Keyword(s):

Microelectronics Packaging

Smart Phone Based Host level Modeling for Thermal Performance Prediction of Next Generation microSD Cards

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190555 ◽

2020 ◽

Author(s):

Sundarraj Chandran ◽

Apratim Sanyal ◽

Ning Ye ◽

Rajesh Ravnikar ◽

Abhishek Azad

Keyword(s):

Thermal Performance ◽

Performance Prediction ◽

Smart Phone ◽

Next Generation

Cyclic Stress-Strain and Constitutive Behaviors of SAC-Bi-Ni-Sb Solder Alloys During Fatigue Testing

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190293 ◽

2020 ◽

Author(s):

Mohd Aminul Hoque ◽

Mohammad Ashraful Haq ◽

Md Mahmudur Chowdhury ◽

Jeffrey C. Suhling ◽

Pradeep Lall

Keyword(s):

Fatigue Testing ◽

Cyclic Stress ◽

Solder Alloys ◽

Stress Strain

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Mechanical Behavior Evolution of SAC+Bi Lead Free Solder Exposed to Thermal Cycling

Thermal Modeling of Vapor Chamber Heat Spreaders and Model Validation

Transient Thermal Analysis of an Air-Conditioned IT Rack with a Thermal Buffering Unit

Corrosion in Liquid Cooling Systems with Water-Based Coolant – Part 1: Flow Loop Design for Reliability Tests

Thermal Performance of Pump-assisted Loop Heat Pipe using R245fa as Working Fluid

An Electrochemical-thermal Coupled Gas Generation and Overcharge-to-thermal-runaway Model for Large-format Lithium Ion Battery

Analyzing the Distribution of Microencapsulated Organic Phase Change Materials Embedded in a Metallic Matrix

Quiet Revolutions: How Advanced Microelectronics Packaging Continues to Drive Heterogeneous Integration1

Smart Phone Based Host level Modeling for Thermal Performance Prediction of Next Generation microSD Cards

Cyclic Stress-Strain and Constitutive Behaviors of SAC-Bi-Ni-Sb Solder Alloys During Fatigue Testing

Export Citation Format

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Mechanical Behavior Evolution of SAC+Bi Lead Free Solder Exposed to Thermal Cycling

Thermal Modeling of Vapor Chamber Heat Spreaders and Model Validation

Transient Thermal Analysis of an Air-Conditioned IT Rack with a Thermal Buffering Unit

Corrosion in Liquid Cooling Systems with Water-Based Coolant – Part 1: Flow Loop Design for Reliability Tests

Thermal Performance of Pump-assisted Loop Heat Pipe using R245fa as Working Fluid

An Electrochemical-thermal Coupled Gas Generation and Overcharge-to-thermal-runaway Model for Large-format Lithium Ion Battery

Analyzing the Distribution of Microencapsulated Organic Phase Change Materials Embedded in a Metallic Matrix

Quiet Revolutions: How Advanced Microelectronics Packaging Continues to Drive Heterogeneous Integration1

Smart Phone Based Host level Modeling for Thermal Performance Prediction of Next Generation microSD Cards

Cyclic Stress-Strain and Constitutive Behaviors of SAC-Bi-Ni-Sb Solder Alloys During Fatigue Testing

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Latest Publications