2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Corrosion in Liquid Cooling Systems with Water-Based Coolant – Part 1: Flow Loop Design for Reliability Tests

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190607 ◽

2020 ◽

Author(s):

Girish Kini ◽

Choong-Un Kim ◽

H. Madanipour ◽

Je-Young Chang ◽

Amitesh Saha ◽

...

Keyword(s):

Flow Loop ◽

Liquid Cooling ◽

Cooling Systems ◽

Design For Reliability ◽

Loop Design ◽

Water Based

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Thermal Performance of Pump-assisted Loop Heat Pipe using R245fa as Working Fluid

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190552 ◽

2020 ◽

Author(s):

Shyy Woei Chang ◽

Kuei-Feng Chiang ◽

Fang-Chou Lin ◽

Wei-Sheng Hung

Keyword(s):

Heat Pipe ◽

Thermal Performance ◽

Working Fluid ◽

Loop Heat Pipe

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An Electrochemical-thermal Coupled Gas Generation and Overcharge-to-thermal-runaway Model for Large-format Lithium Ion Battery

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190182 ◽

2020 ◽

Author(s):

Jiajun Xu ◽

Christopher Hendricks

Keyword(s):

Lithium Ion Battery ◽

Lithium Ion ◽

Thermal Runaway ◽

Gas Generation ◽

Large Format

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Analyzing the Distribution of Microencapsulated Organic Phase Change Materials Embedded in a Metallic Matrix

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190502 ◽

2020 ◽

Author(s):

Melissa K. McCann ◽

Michael C. Fish ◽

Lauren M. Boteler ◽

Damena D. Agonafer

Keyword(s):

Phase Change ◽

Organic Phase ◽

Phase Change Materials ◽

Metallic Matrix

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Quiet Revolutions: How Advanced Microelectronics Packaging Continues to Drive Heterogeneous Integration1

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190247 ◽

2020 ◽

Author(s):

Ravi Mahajan

Keyword(s):

Microelectronics Packaging

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Smart Phone Based Host level Modeling for Thermal Performance Prediction of Next Generation microSD Cards

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190555 ◽

2020 ◽

Author(s):

Sundarraj Chandran ◽

Apratim Sanyal ◽

Ning Ye ◽

Rajesh Ravnikar ◽

Abhishek Azad

Keyword(s):

Thermal Performance ◽

Performance Prediction ◽

Smart Phone ◽

Next Generation

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Cyclic Stress-Strain and Constitutive Behaviors of SAC-Bi-Ni-Sb Solder Alloys During Fatigue Testing

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190293 ◽

2020 ◽

Author(s):

Mohd Aminul Hoque ◽

Mohammad Ashraful Haq ◽

Md Mahmudur Chowdhury ◽

Jeffrey C. Suhling ◽

Pradeep Lall

Keyword(s):

Fatigue Testing ◽

Cyclic Stress ◽

Solder Alloys ◽

Stress Strain

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Heat Transfer and Two-Phase Flow Regimes in Manifolded Microgaps: Performance Comparison Between R245fa and FC-72

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190239 ◽

2020 ◽

Author(s):

David C. Deisenroth ◽

Michael Ohadi ◽

Avram Bar-Cohen

Keyword(s):

Heat Transfer ◽

Two Phase Flow ◽

Flow Regimes ◽

Performance Comparison ◽

Phase Flow ◽

Two Phase

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Flex-to-Install Application Performance of Power Sources Subjected to Varying Fold Orientations, C-Rates and Depths of Charge

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190350 ◽

2020 ◽

Author(s):

Pradeep Lall ◽

Ved Soni ◽

Scott Miller

Keyword(s):

Application Performance ◽

Power Sources

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HIR Virtual Workshop

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190252 ◽

2020 ◽

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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Corrosion in Liquid Cooling Systems with Water-Based Coolant – Part 1: Flow Loop Design for Reliability Tests

Thermal Performance of Pump-assisted Loop Heat Pipe using R245fa as Working Fluid

An Electrochemical-thermal Coupled Gas Generation and Overcharge-to-thermal-runaway Model for Large-format Lithium Ion Battery

Analyzing the Distribution of Microencapsulated Organic Phase Change Materials Embedded in a Metallic Matrix

Quiet Revolutions: How Advanced Microelectronics Packaging Continues to Drive Heterogeneous Integration1

Smart Phone Based Host level Modeling for Thermal Performance Prediction of Next Generation microSD Cards

Cyclic Stress-Strain and Constitutive Behaviors of SAC-Bi-Ni-Sb Solder Alloys During Fatigue Testing

Heat Transfer and Two-Phase Flow Regimes in Manifolded Microgaps: Performance Comparison Between R245fa and FC-72

Flex-to-Install Application Performance of Power Sources Subjected to Varying Fold Orientations, C-Rates and Depths of Charge

HIR Virtual Workshop

Export Citation Format

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Corrosion in Liquid Cooling Systems with Water-Based Coolant – Part 1: Flow Loop Design for Reliability Tests

Thermal Performance of Pump-assisted Loop Heat Pipe using R245fa as Working Fluid

An Electrochemical-thermal Coupled Gas Generation and Overcharge-to-thermal-runaway Model for Large-format Lithium Ion Battery

Analyzing the Distribution of Microencapsulated Organic Phase Change Materials Embedded in a Metallic Matrix

Quiet Revolutions: How Advanced Microelectronics Packaging Continues to Drive Heterogeneous Integration1

Smart Phone Based Host level Modeling for Thermal Performance Prediction of Next Generation microSD Cards

Cyclic Stress-Strain and Constitutive Behaviors of SAC-Bi-Ni-Sb Solder Alloys During Fatigue Testing

Heat Transfer and Two-Phase Flow Regimes in Manifolded Microgaps: Performance Comparison Between R245fa and FC-72

Flex-to-Install Application Performance of Power Sources Subjected to Varying Fold Orientations, C-Rates and Depths of Charge

HIR Virtual Workshop

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Latest Publications