2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Mechanical Behavior Evolution of SAC+Bi Lead Free Solder Exposed to Thermal Cycling

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190579 ◽

2020 ◽

Author(s):

S. M. Kamrul Hasan ◽

Abdullah Fahim ◽

Jeffrey C. Suhling ◽

Sa'd Hamasha ◽

Pradeep Lall

Keyword(s):

Thermal Cycling ◽

Mechanical Behavior ◽

Lead Free ◽

Lead Free Solder ◽

Free Solder

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Thermal Modeling of Vapor Chamber Heat Spreaders and Model Validation

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190467 ◽

2020 ◽

Author(s):

Pritish R. Parida ◽

Ken Marston ◽

Kevin Drummond ◽

Levi Campbell ◽

Yuji Saito ◽

...

Keyword(s):

Model Validation ◽

Thermal Modeling ◽

Vapor Chamber ◽

Heat Spreaders

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Transient Thermal Analysis of an Air-Conditioned IT Rack with a Thermal Buffering Unit

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190229 ◽

2020 ◽

Author(s):

James VanGilder ◽

Wei Tian ◽

John Bean

Keyword(s):

Thermal Analysis ◽

Transient Thermal Analysis ◽

Thermal Buffering ◽

Transient Thermal

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Corrosion in Liquid Cooling Systems with Water-Based Coolant – Part 1: Flow Loop Design for Reliability Tests

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190607 ◽

2020 ◽

Author(s):

Girish Kini ◽

Choong-Un Kim ◽

H. Madanipour ◽

Je-Young Chang ◽

Amitesh Saha ◽

...

Keyword(s):

Flow Loop ◽

Liquid Cooling ◽

Cooling Systems ◽

Design For Reliability ◽

Loop Design ◽

Water Based

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Thermal Performance of Pump-assisted Loop Heat Pipe using R245fa as Working Fluid

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190552 ◽

2020 ◽

Author(s):

Shyy Woei Chang ◽

Kuei-Feng Chiang ◽

Fang-Chou Lin ◽

Wei-Sheng Hung

Keyword(s):

Heat Pipe ◽

Thermal Performance ◽

Working Fluid ◽

Loop Heat Pipe

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An Electrochemical-thermal Coupled Gas Generation and Overcharge-to-thermal-runaway Model for Large-format Lithium Ion Battery

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190182 ◽

2020 ◽

Author(s):

Jiajun Xu ◽

Christopher Hendricks

Keyword(s):

Lithium Ion Battery ◽

Lithium Ion ◽

Thermal Runaway ◽

Gas Generation ◽

Large Format

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Analyzing the Distribution of Microencapsulated Organic Phase Change Materials Embedded in a Metallic Matrix

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190502 ◽

2020 ◽

Author(s):

Melissa K. McCann ◽

Michael C. Fish ◽

Lauren M. Boteler ◽

Damena D. Agonafer

Keyword(s):

Phase Change ◽

Organic Phase ◽

Phase Change Materials ◽

Metallic Matrix

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Quiet Revolutions: How Advanced Microelectronics Packaging Continues to Drive Heterogeneous Integration1

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190247 ◽

2020 ◽

Author(s):

Ravi Mahajan

Keyword(s):

Microelectronics Packaging

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Smart Phone Based Host level Modeling for Thermal Performance Prediction of Next Generation microSD Cards

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190555 ◽

2020 ◽

Author(s):

Sundarraj Chandran ◽

Apratim Sanyal ◽

Ning Ye ◽

Rajesh Ravnikar ◽

Abhishek Azad

Keyword(s):

Thermal Performance ◽

Performance Prediction ◽

Smart Phone ◽

Next Generation

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Cyclic Stress-Strain and Constitutive Behaviors of SAC-Bi-Ni-Sb Solder Alloys During Fatigue Testing

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm45881.2020.9190293 ◽

2020 ◽

Author(s):

Mohd Aminul Hoque ◽

Mohammad Ashraful Haq ◽

Md Mahmudur Chowdhury ◽

Jeffrey C. Suhling ◽

Pradeep Lall

Keyword(s):

Fatigue Testing ◽

Cyclic Stress ◽

Solder Alloys ◽

Stress Strain

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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Mechanical Behavior Evolution of SAC+Bi Lead Free Solder Exposed to Thermal Cycling

Thermal Modeling of Vapor Chamber Heat Spreaders and Model Validation

Transient Thermal Analysis of an Air-Conditioned IT Rack with a Thermal Buffering Unit

Corrosion in Liquid Cooling Systems with Water-Based Coolant – Part 1: Flow Loop Design for Reliability Tests

Thermal Performance of Pump-assisted Loop Heat Pipe using R245fa as Working Fluid

An Electrochemical-thermal Coupled Gas Generation and Overcharge-to-thermal-runaway Model for Large-format Lithium Ion Battery

Analyzing the Distribution of Microencapsulated Organic Phase Change Materials Embedded in a Metallic Matrix

Quiet Revolutions: How Advanced Microelectronics Packaging Continues to Drive Heterogeneous Integration1

Smart Phone Based Host level Modeling for Thermal Performance Prediction of Next Generation microSD Cards

Cyclic Stress-Strain and Constitutive Behaviors of SAC-Bi-Ni-Sb Solder Alloys During Fatigue Testing

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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Mechanical Behavior Evolution of SAC+Bi Lead Free Solder Exposed to Thermal Cycling

Thermal Modeling of Vapor Chamber Heat Spreaders and Model Validation

Transient Thermal Analysis of an Air-Conditioned IT Rack with a Thermal Buffering Unit

Corrosion in Liquid Cooling Systems with Water-Based Coolant – Part 1: Flow Loop Design for Reliability Tests

Thermal Performance of Pump-assisted Loop Heat Pipe using R245fa as Working Fluid

An Electrochemical-thermal Coupled Gas Generation and Overcharge-to-thermal-runaway Model for Large-format Lithium Ion Battery

Analyzing the Distribution of Microencapsulated Organic Phase Change Materials Embedded in a Metallic Matrix

Quiet Revolutions: How Advanced Microelectronics Packaging Continues to Drive Heterogeneous Integration1

Smart Phone Based Host level Modeling for Thermal Performance Prediction of Next Generation microSD Cards

Cyclic Stress-Strain and Constitutive Behaviors of SAC-Bi-Ni-Sb Solder Alloys During Fatigue Testing

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Latest Publications