Thermal Modeling of Vapor Chamber Heat Spreaders and Model Validation

2020 ◽  
Author(s):  
Pritish R. Parida ◽  
Ken Marston ◽  
Kevin Drummond ◽  
Levi Campbell ◽  
Yuji Saito ◽  
...  
Keyword(s):  
Model Validation ◽  
Thermal Modeling ◽  
Vapor Chamber ◽  
Heat Spreaders

Wick-free paradigm for high-performance vapor-chamber heat spreaders

2022 ◽  
Vol 253 ◽  
pp. 115138
Author(s):  
George Damoulakis ◽  
Constantine M. Megaridis
Keyword(s):  
High Performance ◽  
Vapor Chamber ◽  
Heat Spreaders

Optimization design of grooved evaporator wick structures in vapor chamber heat spreaders

2020 ◽  
Vol 166 ◽  
pp. 114657 ◽  
Author(s):  
Baotong Li ◽  
Xinxin Yin ◽  
Wenhao Tang ◽  
Jinhua Zhang
Keyword(s):  
Optimization Design ◽  
Vapor Chamber ◽  
Heat Spreaders

Study of Miniaturization of a Silicon Vapor Chamber for Compact 3D Microelectronics, via a Hybrid Analytical and Finite Element Method

2019 ◽  
Vol 6 (5) ◽  
pp. 01-18
Author(s):  
Ma Yue ◽  
Shirazy Mahmoud ◽  
Coudrain Perceval ◽  
Colonna Jean-Phulippe ◽  
Souifi Abdelkader ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Numerical Models ◽  
Computational Cost ◽  
Vapor Chamber ◽  
Cooling Systems ◽  
Heat Spreaders ◽  
Operating Limits ◽  
Silicon Vapor ◽  
Core Height ◽  
Low Computational Cost

The interest in silicon vapor chambers (SVCs) has increased in the recent years as they have been identified as efficient cooling systems for microelectronics. They present the advantage of higher thermal conductivity and smaller form factor compared to conventional heat spreaders. This work aims to investigate the potential miniaturization of these devices, preliminary to integration on the backside of mobile device chips, located as close as possible to hotspots. While detailed numerical models of vapor chamber operation are developed, an easy modeling with low computational cost is needed for an effective parametric study.  Based on the study of the operating limits, this paper shows the thinning potential of a water filled micropillar for a device operating below 10 W and identify the corresponding vapour core height, and wick thickness.

scholarly journals Study of Miniaturization of a Silicon Vapor Chamber for Compact 3D Microelectronics, via a Hybrid Analytical and Finite Element Method

2019 ◽  
Vol 7 (6) ◽  
pp. 1-16
Author(s):  
Yue MA ◽  
M. R. S. Shirazy ◽  
Q. Struss ◽  
P. Coudrain ◽  
J.P. Colonna ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Numerical Models ◽  
Computational Cost ◽  
Vapor Chamber ◽  
Cooling Systems ◽  
Heat Spreaders ◽  
Operating Limits ◽  
Silicon Vapor ◽  
Core Height ◽  
Low Computational Cost

The interest in silicon vapor chambers (SVCs) has increased in the recent years as they have been identified as efficient cooling systems for microelectronics. They present the advantage of higher thermal conductivity and smaller form factor compared to conventional heat spreaders. This work aims to investigate the potential miniaturization of these devices, preliminary to integration on the backside of mobile device chips, located as close as possible to hotspots. While detailed numerical models of vapor chamber operation are developed, an easy modeling with low computational cost is needed for an effective parametric study.  Based on the study of the operating limits, this paper shows the thinning potential of a water filled micropillar for a device operating below 10 W and identify the corresponding vapour core height, and wick thickness.

scholarly journals Multiscale Micro/Nanostructured Heat Spreaders for Thermal Management of Power Electronics

2021 ◽  
Author(s):  
Huihe Qiu ◽  
Yinchuang Yang
Keyword(s):  
Thermal Performance ◽  
Superhydrophobic Surface ◽  
Evaporation Rate ◽  
Nucleate Boiling ◽  
Nanostructured Surface ◽  
Vapor Chamber ◽  
Nanostructured Surfaces ◽  
Patterned Surface ◽  
Heat Spreaders ◽  
Surface Modification Techniques

In this chapter, we describe surface modification techniques for enhancing heat/mass transfer and evaporation on heated surfaces. The effect of asymmetrical structure in designing a vapor chamber, patterned with multiscale micro/nanostructured surfaces will be introduced. The wettability patterned surface and its mechanism for improving the evaporation rate of a droplet and the thermal performance of nucleate boiling are discussed. An ultrathin vapor chamber based on a wettability patterned evaporator is introduced as a case for the application of the wettability pattern. Besides, modifying the surface with nanostructure to form a multiscale micro/nanostructured surface or superhydrophobic surface also enhances the phase change. Several types of heat spreaders are proposed to investigate the effects of multiscale micro/nanostructured surface and nanostructured superhydrophobic condenser on the thermal performance of the heat spreaders, respectively. The effects of multiscale micro/nanostructured evaporator surfaces with wettability patterns will be analyzed and experimental data will be presented.

scholarly journals A Method for Thermal Performance Characterization of Ultra-Thin Vapor Chambers Cooled by Natural Convection

2015 ◽  
Author(s):  
Gaurav Patankar ◽  
Simone Mancin ◽  
Justin A. Weibel ◽  
Suresh V. Garimella ◽  
Mark A. MacDonald
Keyword(s):  
Natural Convection ◽  
Temperature Distribution ◽  
Numerical Model ◽  
Thermal Resistance ◽  
Heat Dissipation ◽  
Test Facility ◽  
Vapor Chamber ◽  
Heat Spreader ◽  
Heat Spreaders

Vapor chamber technologies offer an attractive approach for passive cooling in portable electronic devices. Due to the market trends in device power consumption and thickness, vapor chamber effectiveness must be compared with alternative heat spreading materials at ultra-thin form factors and low heat dissipation rates. A test facility is developed to experimentally characterize performance and analyze the behavior of ultra-thin vapor chambers that must reject heat to the ambient via natural convection. The evaporator-side and ambient temperatures are measured directly; the condenser-side surface temperature distribution, which has critical ergonomics implications, is measured using an infrared camera calibrated pixel-by-pixel over the field of view and operating temperature range. The high thermal resistance imposed by natural convection in the vapor chamber heat dissipation pathway requires accurate prediction of the parasitic heat losses from the test facility using a combined experimental and numerical calibration procedure. Solid Metal heat spreaders of known thermal conductivity are first tested, and the temperature distribution is reproduced using a numerical model for conduction in the heat spreader and thermal insulation by iteratively adjusting the external boundary conditions. A regression expression for the heat loss is developed as a function of measured operating conditions using the numerical model. A sample vapor chamber is tested for heat inputs below 2.5 W. Performance metrics are developed to characterize heat spreader performance in terms of the effective thermal resistance and the condenser-side temperature uniformity. The study offers a rigorous approach for testing and analysis of new vapor chamber designs, with accurate characterization of their performance relative to other heat spreaders.

scholarly journals Characterization and thermal modeling of a miniature silicon vapor chamber for die-level heat redistribution

2020 ◽  
Vol 152 ◽  
pp. 119569 ◽  
Author(s):  
Tanya Liu ◽  
Marc T. Dunham ◽  
Ki Wook Jung ◽  
Baoxing Chen ◽  
Mehdi Asheghi ◽  
...  
Keyword(s):  
Thermal Modeling ◽  
Vapor Chamber ◽  
Silicon Vapor

Heat Transfer of an IGBT Module Integrated With a Vapor Chamber

2011 ◽  
Vol 133 (1) ◽  
Author(s):  
Xiaoling Yu ◽  
Lianghua Zhang ◽  
Enming Zhou ◽  
Quanke Feng
Keyword(s):  
Experimental Data ◽  
Heat Load ◽  
Thermal Modeling ◽  
Copper Plate ◽  
Vapor Chamber ◽  
Transient Time ◽  
Thermal Circuit ◽  
Igbt Modules ◽  
Igbt Module ◽  
Heat Spreading

Presently, many methods are adopted to reduce the junction-to-case thermal resistance (Rjc) of insulated-gate bipolar transistor (IGBT) modules in order to increase their power density. One of these approaches is to enhance the heat spreading capability of the base plate (heat spreader) of an IGBT module using a vapor chamber (VC). In this paper, both experimental measurement and thermal modeling are conducted on a VC-based IGBT module and two copper-plate-based IGBT modules. The experimental data show that Rjc of the VC-based IGBT module decreases substantially with the increase in the heat load of the IGBT. Rjc of the VC-based IGBT module is ∼50% of that of the 3 mm copper-plate-based IGBT module after it saturates at a heat load level of ∼200 W. The transient time of the VC-based IGBT module is also shorter than the copper-plate-based IGBT modules since the VC has higher heat spreading capability. The quicker responses of the VC-based IGBT module to reach its saturated temperature during the start-up can avoid a possible power surge. In the thermal modeling, the vapor is substituted as a solid conductor with extremely high thermal conductivity. Hence, the two-phase flow thermal modeling of the VC is simplified as a one-phase thermal conductive modeling. A thermal circuit model is also built for the VC-based IGBT module. Both the thermal modeling and thermal circuit results match well with the experimental data.

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