2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781538636312

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Mixed epistemic-aleatory uncertainty quantification using reduced dimensional polynomial chaos and parametric ANOVA

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2017.8329716 ◽

2017 ◽

Cited By ~ 1

Author(s):

Aditi K. Prasad ◽

Sourajeet Roy

Keyword(s):

Uncertainty Quantification ◽

Polynomial Chaos ◽

Aleatory Uncertainty

Embeded filtering in PCB integrated ultra high speed dielectric waveguides using photonic band gap structures

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2017.8329753 ◽

2017 ◽

Cited By ~ 1

Author(s):

Joshua C. Myers ◽

Jose A. Hejase ◽

Junyan Tang ◽

Daniel M. Dreps

Keyword(s):

Band Gap ◽

High Speed ◽

Photonic Band Gap ◽

Dielectric Waveguides ◽

Ultra High Speed ◽

Photonic Band Gap Structures ◽

Photonic Band

Inductance model of decoupling capacitors including the local environment

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2017.8329734 ◽

2017 ◽

Cited By ~ 1

Author(s):

Tamar Makharashvili ◽

Ying S. Cao ◽

Albert E. Ruehli ◽

James Drewniak ◽

Daryl G. Beetner

Keyword(s):

Local Environment ◽

Decoupling Capacitors

Distributed sinusoidal resonant converter with high step-down ratio

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2017.8329708 ◽

2017 ◽

Cited By ~ 2

Author(s):

Kan Xu ◽

Boris Vaisband ◽

Gregory Sizikov ◽

Xin Li ◽

Eby G. Friedman

Keyword(s):

Resonant Converter ◽

Step Down

Full-wave electromagnetic characterization of 3D interconnects using a surface integral formulation

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2017.8329738 ◽

2017 ◽

Cited By ~ 6

Author(s):

Utkarsh R. Patel ◽

Shashwat Sharma ◽

Shunchuan Yang ◽

Sean V. Hum ◽

Piero Triverio

Keyword(s):

Integral Formulation ◽

Surface Integral ◽

Full Wave

Output impedance design of distributed domains with high frequency voltage regulators

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2017.8329762 ◽

2017 ◽

Author(s):

Amit K. Jain ◽

Chin Lee Kuan ◽

Sameer Shekhar

Keyword(s):

High Frequency ◽

Voltage Regulators ◽

Output Impedance

Matrix formulations & GPU acceleration for high-speed digital link simulations

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2017.8329699 ◽

2017 ◽

Author(s):

Sunil Sudhakaran ◽

Arash Zargaran-Yazd

Keyword(s):

High Speed ◽

Gpu Acceleration

Causal version of conductor roughness models and its effect on characteristics of transmission lines

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2017.8329720 ◽

2017 ◽

Author(s):

Vladimir Dmitriev-Zdorov ◽

Lambert Simonovich

Keyword(s):

Transmission Lines

Unified approach to interconnect conductor surface roughness modelling

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2017.8329704 ◽

2017 ◽

Cited By ~ 7

Author(s):

Yuriy Shlepnev

Keyword(s):

Surface Roughness ◽

Unified Approach ◽

Conductor Surface

Modeling of DDR5 signaling from jitter sequences to accurate bit error rate (BER)

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ◽

10.1109/epeps.2017.8329722 ◽

2017 ◽

Cited By ~ 1

Author(s):

Alaeddin A. Aydiner ◽

Yunhui Chu ◽

Oleg Mikulchenko ◽

Jin Yan ◽

Robert J. Friar ◽

...

Keyword(s):

Bit Error Rate ◽

Error Rate

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Mixed epistemic-aleatory uncertainty quantification using reduced dimensional polynomial chaos and parametric ANOVA

Embeded filtering in PCB integrated ultra high speed dielectric waveguides using photonic band gap structures

Inductance model of decoupling capacitors including the local environment

Distributed sinusoidal resonant converter with high step-down ratio

Full-wave electromagnetic characterization of 3D interconnects using a surface integral formulation

Output impedance design of distributed domains with high frequency voltage regulators

Matrix formulations & GPU acceleration for high-speed digital link simulations

Causal version of conductor roughness models and its effect on characteristics of transmission lines

Unified approach to interconnect conductor surface roughness modelling

Modeling of DDR5 signaling from jitter sequences to accurate bit error rate (BER)

2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Latest Publications