2007 9th Electronics Packaging Technology Conference
Latest Publications

TOTAL DOCUMENTS

175
(FIVE YEARS 0)

H-INDEX

12
(FIVE YEARS 0)

Published By IEEE

9781424413249, 9781424413232
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Theoretical Stress Calculation and Experimental Results of "NCF-type Compliant-Bumped COG"

2007 ◽  
Author(s):  
Ming-Yao Chen ◽  
Chao-Chyun An ◽  
Shyh-Ming Chang ◽  
Kuo-Shu Kao ◽  
Jimmy Tsang ◽  
...  
Keyword(s):  
Experimental Results ◽  
Stress Calculation ◽  
Theoretical Stress

Study on Sn-2.3Ag Electroplated Solder Bump Properties Fabricated by Different Plating and Reflow Conditions

2007 ◽  
Author(s):  
C. K. Hsiung ◽  
C. A. Chang ◽  
Z. H. Tzeng ◽  
C. S. Ho ◽  
F. L. Chien
Keyword(s):  
Solder Bump

MCP Bottom Die Crack Issue during Destructive Analysis

2007 ◽  
Author(s):  
Yuqi Jiang ◽  
Xianzhong Song ◽  
TimFai Lam ◽  
Caihong Wu ◽  
Mingxia Sun ◽  
...  
Keyword(s):  
Destructive Analysis

Hybrid Heterogeneous Imaging Arrays with Reinforced Functionality and Reliability

2007 ◽  
Author(s):  
Francois Marion ◽  
Gilles Lasfargues ◽  
Herve Ribot ◽  
Christophe Largeron ◽  
Laeticia Adelmini ◽  
...  
Keyword(s):  
Imaging Arrays

Reliability Study on Copper Pillar Bumping with Lead Free Solder

2007 ◽  
Author(s):  
Jinhua Yu ◽  
Ashok Anand ◽  
YC Mui ◽  
Parthasarathy Srinivasan ◽  
Raj Master
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Reliability Study ◽  
Free Solder
Load More ...
Sign in / Sign up

Export Citation Format

Share Document