2010 IEEE International Interconnect Technology Conference
Latest Publications

TOTAL DOCUMENTS

70

(FIVE YEARS 0)

H-INDEX

8

(FIVE YEARS 0)

Published By IEEE

9781424476763

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

The improvement of electrical programmable fuse with salicide-block dielectric film in 40nm CMOS Technology

2010 IEEE International Interconnect Technology Conference ◽

10.1109/iitc.2010.5510461 ◽

2010 ◽

Author(s):

Kuei-Sheng Wu ◽

Chang-Chien Wong ◽

Sinclair Chi ◽

Ching-Hsiang Tseng ◽

Purple Huang ◽

...

Keyword(s):

Dielectric Film ◽

Cmos Technology

Download Full-text

Phase change memory: Development progress and system opportunities

2010 IEEE International Interconnect Technology Conference ◽

10.1109/iitc.2010.5510741 ◽

2010 ◽

Author(s):

Greg Atwood

Keyword(s):

Phase Change ◽

Phase Change Memory ◽

Memory Development ◽

Download Full-text

MEMS technology using back-end of line processes in CMOS LSI

2010 IEEE International Interconnect Technology Conference ◽

10.1109/iitc.2010.5510691 ◽

2010 ◽

Author(s):

Shuntaro Machida

Keyword(s):

Mems Technology ◽

Download Full-text

Improving Cu line Rs control using feed-forward information for CMP endpointing

2010 IEEE International Interconnect Technology Conference ◽

10.1109/iitc.2010.5510306 ◽

2010 ◽

Author(s):

Xiaoyuan Hu ◽

Zhihong Wang ◽

Wen-chiang Tu ◽

Daxin Mao

Keyword(s):

Download Full-text

Recent advances in submicron alignment 300 mm copper-copper thermocompressive face-to-face wafer-to-wafer bonding and integrated infrared, high-speed FIB metrology

2010 IEEE International Interconnect Technology Conference ◽

10.1109/iitc.2010.5510387 ◽

2010 ◽

Author(s):

W.H. Teh ◽

C. Deeb ◽

J. Burggraf ◽

M. Wimplinger ◽

T. Matthias ◽

...

Keyword(s):

Wafer Bonding ◽

Face To Face ◽

Recent Advances

Download Full-text

On-chip optical interconnection network performance evaluation using power penalty metrics from silicon photonic modulators

2010 IEEE International Interconnect Technology Conference ◽

10.1109/iitc.2010.5510310 ◽

2010 ◽

Author(s):

Aleksandr Biberman ◽

Johnnie Chan ◽

Keren Bergman

Keyword(s):

Performance Evaluation ◽

Network Performance ◽

Interconnection Network ◽

Optical Interconnection ◽

Power Penalty ◽

Silicon Photonic ◽

Network Performance Evaluation ◽

Download Full-text

Evolutionary and revolutionary interconnect technologies for performance enhancement of subthreshold circuits

2010 IEEE International Interconnect Technology Conference ◽

10.1109/iitc.2010.5510733 ◽

2010 ◽

Author(s):

Omer Jamal ◽

Azad Naeemi

Keyword(s):

Performance Enhancement ◽

Subthreshold Circuits

Download Full-text

Cap layer and grain size effects on electromigration reliability in Cu/low-k interconnects

2010 IEEE International Interconnect Technology Conference ◽

10.1109/iitc.2010.5510581 ◽

2010 ◽

Author(s):

L. Zhang ◽

M. Kraatz ◽

O. Aubel ◽

C. Hennesthal ◽

J. Im ◽

...

Keyword(s):

Size Effects ◽

Cap Layer ◽

Low K ◽

Grain Size Effects

Download Full-text

3D TSV integration technology challenges for high volume production from fabless supply chain aspect

2010 IEEE International Interconnect Technology Conference ◽

10.1109/iitc.2010.5510309 ◽

2010 ◽

Author(s):

S.Q. Gu ◽

U. Ray ◽

Y. Li ◽

A. Chandrasekaran ◽

B. Henderson ◽

...

Keyword(s):

Supply Chain ◽

High Volume ◽

Integration Technology ◽

High Volume Production ◽

Volume Production

Download Full-text

AC conductance modeling and analysis of graphene nanoribbon interconnects

2010 IEEE International Interconnect Technology Conference ◽

10.1109/iitc.2010.5510736 ◽

2010 ◽

Author(s):

Deblina Sarkar ◽

Chuan Xu ◽

Hong Li ◽

Kaustav Banerjee

Keyword(s):

Graphene Nanoribbon ◽

Modeling And Analysis ◽

Download Full-text