2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Latest Publications

TOTAL DOCUMENTS

115

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781467315135, 9781467315128, 9781467315111

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Modeling lead free solder reliability in SSL applications towards virtual design

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2012.6191755 ◽

2012 ◽

Author(s):

Rene Kregting ◽

Muge Erinc ◽

Jan Kloosterman ◽

Willem van Driel

Keyword(s):

Lead Free ◽

Lead Free Solder ◽

Virtual Design ◽

Free Solder ◽

Solder Reliability

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Increasing the robustness for reliable packages by prediction of delamination by cohesive zone element simulation

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2012.6191748 ◽

2012 ◽

Cited By ~ 3

Author(s):

R. Pufall ◽

M. Goroll ◽

W. Kanert ◽

R. Dudek

Keyword(s):

Cohesive Zone ◽

Element Simulation

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Simulation of the frequency response of a thermal flow sensor in gaseous media

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2012.6191728 ◽

2012 ◽

Author(s):

Diego Fernando Reyes-Romero ◽

Gerald Anton Urban

Keyword(s):

Frequency Response ◽

Flow Sensor ◽

Thermal Flow ◽

Thermal Flow Sensor ◽

Gaseous Media

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The method of lines for the analysis of mechanical structures

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2012.6191784 ◽

2012 ◽

Author(s):

Amirali Taghavi ◽

Larissa Vietzorreck

Keyword(s):

Method Of Lines ◽

The Method Of Lines

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Shear stress modeling of ACA joints in thermal tests

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2012.6191715 ◽

2012 ◽

Cited By ~ 1

Author(s):

Kirsi Saarinen ◽

Laura Frisk

Keyword(s):

Shear Stress ◽

Thermal Tests ◽

Stress Modeling

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A novel wafer -level test method to measure the bond strength in microelectronic materials

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2012.6191729 ◽

2012 ◽

Author(s):

Sara Carniello ◽

Jorg Siegert ◽

Bernhard Loffler ◽

Ewald Stuckler

Keyword(s):

Bond Strength ◽

Test Method ◽

Wafer Level ◽

Microelectronic Materials

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Cohesive zone model for delamination analysis of an embedded die system in package

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2012.6191787 ◽

2012 ◽

Cited By ~ 1

Author(s):

Xiaopei Li ◽

Jianghai Gu ◽

Yangjian Xu ◽

Yong Liu

Keyword(s):

Cohesive Zone ◽

Cohesive Zone Model ◽

Zone Model

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A comparison study of the prognostics approaches to Light Emitting Diodes under accelerated aging

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2012.6191783 ◽

2012 ◽

Cited By ~ 7

Author(s):

Thamo Sutharssan ◽

Chris Bailey ◽

Stoyan Stoyanov

Keyword(s):

Light Emitting Diodes ◽

Accelerated Aging ◽

Comparison Study ◽

Light Emitting

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Establishment of the mesoscale parameters for epoxy-copper interfacial separation

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2012.6191737 ◽

2012 ◽

Cited By ~ 2

Author(s):

C. K. Y. Wong ◽

S. Y. Y. Leung ◽

R.H. Poelma ◽

K.M.B. Jansen ◽

C. C. A. Yuan ◽

...

Keyword(s):

Interfacial Separation

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Assessment of thermo-mechanical stresses in Low Temperature Joining Technology

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/esime.2012.6191762 ◽

2012 ◽

Cited By ~ 9

Author(s):

Thomas Herboth ◽

Christiane Fruh ◽

Michael Gunther ◽

Jurgen Wilde

Keyword(s):

Low Temperature ◽

Mechanical Stresses ◽

Joining Technology

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2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and MicrosystemsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Modeling lead free solder reliability in SSL applications towards virtual design

Increasing the robustness for reliable packages by prediction of delamination by cohesive zone element simulation

Simulation of the frequency response of a thermal flow sensor in gaseous media

The method of lines for the analysis of mechanical structures

Shear stress modeling of ACA joints in thermal tests

A novel wafer -level test method to measure the bond strength in microelectronic materials

Cohesive zone model for delamination analysis of an embedded die system in package

A comparison study of the prognostics approaches to Light Emitting Diodes under accelerated aging

Establishment of the mesoscale parameters for epoxy-copper interfacial separation

Assessment of thermo-mechanical stresses in Low Temperature Joining Technology

2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Latest Publications