5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems 2004 EuroSimE 2004 Proceedings of the ESIME-04

Molecular simulation of cu-sam adhesion force

5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems 2004 EuroSimE 2004 Proceedings of the ESIME-04 ◽

10.1109/esime.2004.1304094 ◽

2005 ◽

Author(s):

Haibo Fan ◽

C.K.Y. Wong ◽

M.M.F. Yuen

Keyword(s):

Molecular Simulation ◽

Adhesion Force

Hermal cycling reliability of snagcu and snpb solder joints: a comparison for several ic-packages

5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems 2004 EuroSimE 2004 Proceedings of the ESIME-04 ◽

10.1109/esime.2004.1304092 ◽

2005 ◽

Author(s):

B. Vandevelde ◽

M. Gonzalez ◽

P. Limaye ◽

P. Ratchev ◽

E. Beyne

Keyword(s):

Solder Joints ◽

Snpb Solder

Microstructural and mechanical characterization of 95.5Sn-4Ag-0.5Cu solder balls by nano-indentation

5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems 2004 EuroSimE 2004 Proceedings of the ESIME-04 ◽

10.1109/esime.2004.1304076 ◽

2004 ◽

Author(s):

M. Erinc ◽

P.J.G. Schreurs ◽

G.Q. Zhang ◽

W.D. van Driel ◽

M.G.D. Geers

Keyword(s):

Mechanical Characterization ◽

Nano Indentation ◽

Solder Balls

Simulation of no-flow underfill process for flip-chip assembly

5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems 2004 EuroSimE 2004 Proceedings of the ESIME-04 ◽

10.1109/esime.2004.1304096 ◽

2004 ◽

Cited By ~ 3

Author(s):

A. Kolbeck ◽

T. Hauck ◽

J. Jendrny ◽

O. Hahn ◽

S. Lang

Keyword(s):

Flip Chip ◽

Flip Chip Assembly

Cure, temperature and time dependent constitutive modeling of moulding compounds

5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems 2004 EuroSimE 2004 Proceedings of the ESIME-04 ◽

10.1109/esime.2004.1304095 ◽

2004 ◽

Cited By ~ 18

Author(s):

K.M.B. Jansen ◽

L. Wang ◽

C. van 't Hof ◽

L.J. Ernst ◽

H.J.L. Bressers ◽

...

Keyword(s):

Constitutive Modeling ◽

Time Dependent ◽

Cure Temperature

Modeling heat transfer and liquid flow in micro-channels

5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems 2004 EuroSimE 2004 Proceedings of the ESIME-04 ◽

10.1109/esime.2004.1304085 ◽

2004 ◽

Cited By ~ 2

Author(s):

M.N. Sabry ◽

B.O. Djebedjian ◽

S.H. Saleh ◽

M.M. Mahgoub

Keyword(s):

Heat Transfer ◽

Liquid Flow ◽

Micro Channels

From chemical building blocks of polymers to microelectronics reliability

5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems 2004 EuroSimE 2004 Proceedings of the ESIME-04 ◽

10.1109/esime.2004.1304101 ◽

2004 ◽

Cited By ~ 2

Author(s):

H.J.L. Bressers ◽

W.D. van Driel ◽

K.M.B. Jansen ◽

L.J. Ernst ◽

G.Q. Zhang

Keyword(s):

Building Blocks ◽

Microelectronics Reliability

Reliability of SnPb and Pb-free flip-chips under different test conditions

5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems 2004 EuroSimE 2004 Proceedings of the ESIME-04 ◽

10.1109/esime.2004.1304075 ◽

2004 ◽

Cited By ~ 1

Author(s):

M. Spraul ◽

W. Nuchter ◽

A. Moller ◽

B. Wunderle ◽

B. Michel

Keyword(s):

Flip Chips ◽

Test Conditions

Tri-dimensional reduced-order thermal model of stacked electronic structures

5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems 2004 EuroSimE 2004 Proceedings of the ESIME-04 ◽

10.1109/esime.2004.1304073 ◽

2004 ◽

Cited By ~ 2

Author(s):

V. Feuillet ◽

V. Gatto ◽

Y. Scudeller ◽

Y. Jarny

Keyword(s):

Electronic Structures ◽

Thermal Model ◽

Reduced Order

A mechanics-based strain gage methodology for solder joint reliability assessment

5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems 2004 EuroSimE 2004 Proceedings of the ESIME-04 ◽

10.1109/esime.2004.1304088 ◽

2004 ◽

Cited By ~ 2

Author(s):

L.L. Mercado ◽

S. Girouard ◽

G. Hsieh

Keyword(s):

Solder Joint ◽

Strain Gage ◽

Reliability Assessment ◽

Solder Joint Reliability ◽

Joint Reliability

5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems 2004 EuroSimE 2004 Proceedings of the ESIME-04
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Molecular simulation of cu-sam adhesion force

Hermal cycling reliability of snagcu and snpb solder joints: a comparison for several ic-packages

Microstructural and mechanical characterization of 95.5Sn-4Ag-0.5Cu solder balls by nano-indentation

Simulation of no-flow underfill process for flip-chip assembly

Cure, temperature and time dependent constitutive modeling of moulding compounds

Modeling heat transfer and liquid flow in micro-channels

From chemical building blocks of polymers to microelectronics reliability

Reliability of SnPb and Pb-free flip-chips under different test conditions

Tri-dimensional reduced-order thermal model of stacked electronic structures

A mechanics-based strain gage methodology for solder joint reliability assessment

Export Citation Format

5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems 2004 EuroSimE 2004 Proceedings of the ESIME-04Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Molecular simulation of cu-sam adhesion force

Hermal cycling reliability of snagcu and snpb solder joints: a comparison for several ic-packages

Microstructural and mechanical characterization of 95.5Sn-4Ag-0.5Cu solder balls by nano-indentation

Simulation of no-flow underfill process for flip-chip assembly

Cure, temperature and time dependent constitutive modeling of moulding compounds

Modeling heat transfer and liquid flow in micro-channels

From chemical building blocks of polymers to microelectronics reliability

Reliability of SnPb and Pb-free flip-chips under different test conditions

Tri-dimensional reduced-order thermal model of stacked electronic structures

A mechanics-based strain gage methodology for solder joint reliability assessment

5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems 2004 EuroSimE 2004 Proceedings of the ESIME-04
Latest Publications