Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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9781479939299, 9781479939312, 9781479939091

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A case study on the defective contact with Schottky junction character

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2014.6898169 ◽

2014 ◽

Author(s):

Jinglong Li ◽

ChangYan Qi ◽

Yi Che ◽

Quande Zhang ◽

Horse Ma ◽

...

Keyword(s):

Schottky Junction

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Palladium-copper inter-diffusion during copper activation for electroless Nickel plating process on Copper power metal

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2014.6898185 ◽

2014 ◽

Author(s):

Poo Khai Yee ◽

Wan Tatt Wai ◽

Yong Foo Khong

Keyword(s):

Electroless Nickel ◽

Electroless Nickel Plating ◽

Nickel Plating

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Study on sensitive character of unexpected high impedance circuit in VLSI failure analysis

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2014.6898132 ◽

2014 ◽

Author(s):

Gaojie Wen

Keyword(s):

Failure Analysis ◽

High Impedance ◽

Sensitive Character

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Temperature effect on reflected laser probing signal of multiple elementary substructures

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2014.6898165 ◽

2014 ◽

Author(s):

M. M. Rebai ◽

F. Darracq ◽

J-P. Guillet ◽

D. Lewis ◽

P. Perdu ◽

...

Keyword(s):

Temperature Effect ◽

Laser Probing ◽

Probing Signal

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MOSFET implant failure analysis using plane-view scanning capacitance microscopy coupled with nano-probing and TCAD modeling

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2014.6898128 ◽

2014 ◽

Cited By ~ 1

Author(s):

Hun-Seong Choi ◽

Yong-Woon Han ◽

Il-Sub Chung

Keyword(s):

Failure Analysis ◽

Implant Failure ◽

Scanning Capacitance Microscopy ◽

Plane View

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Improvement of 3D current mapping by coupling magnetic microscopy and X-Ray computed tomography

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2014.6898141 ◽

2014 ◽

Author(s):

Nicolas Courjault ◽

Fulvia Infante ◽

Vincent Bley ◽

Thierry Lebey ◽

Philippe Perdu

Keyword(s):

Computed Tomography ◽

X Ray ◽

X Ray Computed ◽

Magnetic Microscopy

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An improved Coffin-Manson model for mid-power LED wire-bonding reliability

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2014.6898199 ◽

2014 ◽

Cited By ~ 2

Author(s):

Bin Zhang ◽

Guoqiao Tao

Keyword(s):

Wire Bonding

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Systematic methods to identify and verify non-visible defects in silicon substrate

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2014.6898133 ◽

2014 ◽

Author(s):

Hongwei Huang ◽

Winnie Wei ◽

J. J. Xin ◽

Candy Liu ◽

Luke Wu ◽

...

Keyword(s):

Silicon Substrate

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Effects of sidewall scallops on the performance and reliability of filled copper and open tungsten TSVs

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2014.6898137 ◽

2014 ◽

Cited By ~ 3

Author(s):

Lado Filipovic ◽

Roberto Lacerda de Orio ◽

Siegfried Selberherr

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In-depth description for the FA case with Gate-to-Source or Drain short by nanoprobing analysis

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ◽

10.1109/ipfa.2014.6898166 ◽

2014 ◽

Author(s):

Li Lung Lai ◽

Oscar Zhang ◽

Ling Zhu ◽

Feng Qian ◽

Mason Sun

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Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A case study on the defective contact with Schottky junction character

Palladium-copper inter-diffusion during copper activation for electroless Nickel plating process on Copper power metal

Study on sensitive character of unexpected high impedance circuit in VLSI failure analysis

Temperature effect on reflected laser probing signal of multiple elementary substructures

MOSFET implant failure analysis using plane-view scanning capacitance microscopy coupled with nano-probing and TCAD modeling

Improvement of 3D current mapping by coupling magnetic microscopy and X-Ray computed tomography

An improved Coffin-Manson model for mid-power LED wire-bonding reliability

Systematic methods to identify and verify non-visible defects in silicon substrate

Effects of sidewall scallops on the performance and reliability of filled copper and open tungsten TSVs

In-depth description for the FA case with Gate-to-Source or Drain short by nanoprobing analysis

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Latest Publications