IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524)
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Performance improvement using on-board wires for on-chip interconnects

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) ◽

10.1109/epep.2000.895555 ◽

2002 ◽

Author(s):

A. Naeemi ◽

P. Zarkesh-Ha ◽

C.S. Patel ◽

J.D. Meindl

Keyword(s):

Performance Improvement ◽

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An equivalent circuit based on radial transmission line theory for multiple vias in a parallel plate environment

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) ◽

10.1109/epep.2000.895511 ◽

2002 ◽

Author(s):

R. Abhari ◽

G.V. Eleftheriades ◽

E. Van Deventer-Perkins

Keyword(s):

Transmission Line ◽

Equivalent Circuit ◽

Parallel Plate ◽

Transmission Line Theory ◽

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Characterization and modeling of multiple coupled on-chip interconnects on silicon substrate

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) ◽

10.1109/epep.2000.895557 ◽

2002 ◽

Author(s):

Ji Zheng ◽

V.K. Tripathi ◽

A. Weisshaar

Keyword(s):

Silicon Substrate ◽

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Power plane SPICE models for frequency and time domains

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) ◽

10.1109/epep.2000.895491 ◽

2002 ◽

Author(s):

L. Smith ◽

T. Roy ◽

R. Anderson

Keyword(s):

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Measurement of electromagnetic interference in high frequency switching integrated circuits

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) ◽

10.1109/epep.2000.895507 ◽

2002 ◽

Author(s):

H. Harnaes ◽

F. Ndagijimana

Keyword(s):

Integrated Circuits ◽

Electromagnetic Interference ◽

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Frequency dependent RLC crosstalk evaluation of a high performance S/390 microprocessor chip

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) ◽

10.1109/epep.2000.895554 ◽

2002 ◽

Author(s):

H. Smith ◽

A. Deutsch ◽

S. Mehrotra ◽

D. Widiger ◽

M. Bowen ◽

...

Keyword(s):

High Performance ◽

Frequency Dependent

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Micromachined picosecond optical near-field probe for pulse-coupling measurement of interconnection lines

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) ◽

10.1109/epep.2000.895524 ◽

2002 ◽

Author(s):

Jongjoo Lee ◽

Heeseok Lee ◽

Seungyong Baek ◽

Yuchul Jung ◽

Joungho Kim

Keyword(s):

Interconnection Lines

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Over 20 GHz microwave frequency model of fine pitch ball grid array (FPBGA) bonding

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) ◽

10.1109/epep.2000.895505 ◽

2002 ◽

Author(s):

Junho Lee ◽

Seungyoung Ahn ◽

Jaeyoung Ryu ◽

Joungho Kim

Keyword(s):

Microwave Frequency ◽

Ball Grid Array ◽

Frequency Model ◽

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A moment generating algorithm for solution of MTL equations with frequency dependent loss

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) ◽

10.1109/epep.2000.895540 ◽

2002 ◽

Author(s):

W.T. Smith

Keyword(s):

Frequency Dependent

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Modeling of impedance of rectangular cross-section conductors

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) ◽

10.1109/epep.2000.895518 ◽

2002 ◽

Author(s):

Huabo Chen ◽

Jiayuan Fang

Keyword(s):

Cross Section ◽

Rectangular Cross Section

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