IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524)
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Characterization and modeling of multiple coupled on-chip interconnects on silicon substrate

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) ◽

10.1109/epep.2000.895557 ◽

2002 ◽

Author(s):

Ji Zheng ◽

V.K. Tripathi ◽

A. Weisshaar

Keyword(s):

Silicon Substrate ◽

On Chip

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Performance improvement using on-board wires for on-chip interconnects

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) ◽

10.1109/epep.2000.895555 ◽

2002 ◽

Cited By ~ 7

Author(s):

A. Naeemi ◽

P. Zarkesh-Ha ◽

C.S. Patel ◽

J.D. Meindl

Keyword(s):

Performance Improvement ◽

On Chip

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An equivalent circuit based on radial transmission line theory for multiple vias in a parallel plate environment

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) ◽

10.1109/epep.2000.895511 ◽

2002 ◽

Cited By ~ 2

Author(s):

R. Abhari ◽

G.V. Eleftheriades ◽

E. Van Deventer-Perkins

Keyword(s):

Transmission Line ◽

Equivalent Circuit ◽

Parallel Plate ◽

Transmission Line Theory ◽

Line Theory

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Power plane SPICE models for frequency and time domains

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) ◽

10.1109/epep.2000.895491 ◽

2002 ◽

Cited By ~ 12

Author(s):

L. Smith ◽

T. Roy ◽

R. Anderson

Keyword(s):

Time Domains

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Measurement of electromagnetic interference in high frequency switching integrated circuits

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) ◽

10.1109/epep.2000.895507 ◽

2002 ◽

Author(s):

H. Harnaes ◽

F. Ndagijimana

Keyword(s):

Integrated Circuits ◽

Electromagnetic Interference ◽

High Frequency

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Frequency dependent RLC crosstalk evaluation of a high performance S/390 microprocessor chip

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) ◽

10.1109/epep.2000.895554 ◽

2002 ◽

Cited By ~ 3

Author(s):

H. Smith ◽

A. Deutsch ◽

S. Mehrotra ◽

D. Widiger ◽

M. Bowen ◽

...

Keyword(s):

High Performance ◽

Frequency Dependent

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Micromachined picosecond optical near-field probe for pulse-coupling measurement of interconnection lines

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) ◽

10.1109/epep.2000.895524 ◽

2002 ◽

Author(s):

Jongjoo Lee ◽

Heeseok Lee ◽

Seungyong Baek ◽

Yuchul Jung ◽

Joungho Kim

Keyword(s):

Near Field ◽

Interconnection Lines

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Comparison of methods for modeling ALAN's power plane structure

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) ◽

10.1109/epep.2000.895538 ◽

2002 ◽

Cited By ~ 4

Author(s):

Sungjun Chun ◽

Joong-Ho Kim ◽

Nanju Na ◽

M. Swaminathan

Keyword(s):

Comparison Of Methods

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Extended adaptive voltage positioning (EAVP) [power delivery network design]

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) ◽

10.1109/epep.2000.895494 ◽

2002 ◽

Cited By ~ 9

Author(s):

A. Waizman ◽

Chee-Yee Chung

Keyword(s):

Network Design ◽

Power Delivery ◽

Power Delivery Network ◽

Delivery Network

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Accurate electrical measurement of coupled lines on lossy silicon

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) ◽

10.1109/epep.2000.895523 ◽

2002 ◽

Cited By ~ 4

Author(s):

U. Arz ◽

D.F. Williams ◽

D.K. Walker ◽

H. Grabinski

Keyword(s):

Electrical Measurement ◽

Coupled Lines

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IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Characterization and modeling of multiple coupled on-chip interconnects on silicon substrate

Performance improvement using on-board wires for on-chip interconnects

An equivalent circuit based on radial transmission line theory for multiple vias in a parallel plate environment

Power plane SPICE models for frequency and time domains

Measurement of electromagnetic interference in high frequency switching integrated circuits

Frequency dependent RLC crosstalk evaluation of a high performance S/390 microprocessor chip

Micromachined picosecond optical near-field probe for pulse-coupling measurement of interconnection lines

Comparison of methods for modeling ALAN's power plane structure

Extended adaptive voltage positioning (EAVP) [power delivery network design]

Accurate electrical measurement of coupled lines on lossy silicon

IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524)
Latest Publications