1999 4th International Symposium on Plasma Process-Induced Damage (IEEE Cat. No.99TH8395)
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Published By American Vacuum Soc

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Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Suppression of topography dependent charging using a phase-controlled pulsed inductively coupled plasma

1999 4th International Symposium on Plasma Process-Induced Damage (IEEE Cat. No.99TH8395) ◽

10.1109/ppid.1999.798837 ◽

2003 ◽

Author(s):

Kyoung-Sub Shin ◽

Wan-Jae Park ◽

Ji-Soo Kim ◽

Chang-Jin Kang ◽

Tae-Hyuk Ahn ◽

...

Keyword(s):

Inductively Coupled Plasma ◽

Inductively Coupled

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Application of the deuterium sintering process to improve the device design rule in reducing plasma induced damages

1999 4th International Symposium on Plasma Process-Induced Damage (IEEE Cat. No.99TH8395) ◽

10.1109/ppid.1999.798814 ◽

2003 ◽

Author(s):

Young-Kwang Kim ◽

Seok-Ha Lee ◽

Hyui-Seung Lee ◽

Bong-Seok Kim ◽

Yong-Hee Lee ◽

...

Keyword(s):

Design Rule ◽

Sintering Process ◽

Device Design

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Comparison of CHARM-2 and surface potential measurement to monitor plasma induced gate oxide damage

1999 4th International Symposium on Plasma Process-Induced Damage (IEEE Cat. No.99TH8395) ◽

10.1109/ppid.1999.798824 ◽

2003 ◽

Cited By ~ 1

Author(s):

Ming-Yi Lee ◽

J. Hu ◽

W. Catabay ◽

P. Schoenborn ◽

A. Burkus

Keyword(s):

Surface Potential ◽

Gate Oxide ◽

Potential Measurement ◽

Oxide Damage

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Plasma vacuum ultraviolet emission in a high density etcher

1999 4th International Symposium on Plasma Process-Induced Damage (IEEE Cat. No.99TH8395) ◽

10.1109/ppid.1999.798846 ◽

2003 ◽

Cited By ~ 11

Author(s):

C. Cismaru ◽

J.L. Shohet ◽

J.P. McVittie

Keyword(s):

Vacuum Ultraviolet ◽

High Density ◽

Ultraviolet Emission

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Effect of low temperature deuterium annealing on plasma process induced damage

1999 4th International Symposium on Plasma Process-Induced Damage (IEEE Cat. No.99TH8395) ◽

10.1109/ppid.1999.798845 ◽

2003 ◽

Author(s):

S.H. Lee ◽

Y.K. Kim ◽

Y.H. Lee ◽

H.S. Kang ◽

C.G. Ahn ◽

...

Keyword(s):

Low Temperature ◽

Plasma Process

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Plasma damage evaluation using matched transistors and determination of damage prevention options

1999 4th International Symposium on Plasma Process-Induced Damage (IEEE Cat. No.99TH8395) ◽

10.1109/ppid.1999.798817 ◽

2003 ◽

Author(s):

J. Ellis ◽

A.R. Comeau ◽

R. Porter ◽

J. Bossingham ◽

G. Alestig

Keyword(s):

Damage Evaluation ◽

Plasma Damage ◽

Damage Prevention

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On the dependence of plasma-induced charging damage on antenna area

1999 4th International Symposium on Plasma Process-Induced Damage (IEEE Cat. No.99TH8395) ◽

10.1109/ppid.1999.798799 ◽

2003 ◽

Cited By ~ 5

Author(s):

G.S. Hwang ◽

K.P. Giapis

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Damascene copper integration

1999 4th International Symposium on Plasma Process-Induced Damage (IEEE Cat. No.99TH8395) ◽

10.1109/ppid.1999.798841 ◽

2003 ◽

Cited By ~ 3

Author(s):

A.K. Stamper ◽

J.E. Heidenreich ◽

D.C. Hubanks ◽

S.L. Luce ◽

T.L. McDevitt

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Dependence of plasma damage on density and T/sub e/ in a decoupled plasma source metal etcher

1999 4th International Symposium on Plasma Process-Induced Damage (IEEE Cat. No.99TH8395) ◽

10.1109/ppid.1999.798849 ◽

2003 ◽

Author(s):

S.W. Downey ◽

M.V. Malyshev ◽

V.M. Donnelly ◽

J.I. Colonell ◽

N. Layadi ◽

...

Keyword(s):

Plasma Source ◽

Plasma Damage

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Process-induced damage by a low energy neutral beam source [etching/cleaning]

1999 4th International Symposium on Plasma Process-Induced Damage (IEEE Cat. No.99TH8395) ◽

10.1109/ppid.1999.798827 ◽

2003 ◽

Author(s):

Xianmin Tang ◽

Qi Wang ◽

D.M. Manos

Keyword(s):

Low Energy ◽

Neutral Beam ◽

Beam Source

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1999 4th International Symposium on Plasma Process-Induced Damage (IEEE Cat. No.99TH8395)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By American Vacuum Soc

Suppression of topography dependent charging using a phase-controlled pulsed inductively coupled plasma

Application of the deuterium sintering process to improve the device design rule in reducing plasma induced damages

Comparison of CHARM-2 and surface potential measurement to monitor plasma induced gate oxide damage

Plasma vacuum ultraviolet emission in a high density etcher

Effect of low temperature deuterium annealing on plasma process induced damage

Plasma damage evaluation using matched transistors and determination of damage prevention options

On the dependence of plasma-induced charging damage on antenna area

Damascene copper integration

Dependence of plasma damage on density and T/sub e/ in a decoupled plasma source metal etcher

Process-induced damage by a low energy neutral beam source [etching/cleaning]

1999 4th International Symposium on Plasma Process-Induced Damage (IEEE Cat. No.99TH8395)
Latest Publications