Transitioning to Lead-free: the Effect on Low Cycle Fatigue of Contaminating Solder Alloys

2006 ◽  
Author(s):  
Christopher Hunt ◽  
Martin Wickham ◽  
Milos Dusek
Keyword(s):  
Low Cycle Fatigue ◽  
Lead Free ◽  
Cycle Fatigue ◽  
Solder Alloys

Low cycle fatigue models for lead-free solders

2004 ◽  
Vol 462-463 ◽  
pp. 408-412 ◽  
Author(s):  
John H.L. Pang ◽  
B.S. Xiong ◽  
T.H. Low
Keyword(s):  
Low Cycle Fatigue ◽  
Lead Free ◽  
Cycle Fatigue ◽  
Lead Free Solders

Low Cycle Fatigue Test of Lead Free Solders Using Small Sized Specimen

2017 ◽  
Vol 734 ◽  
pp. 194-201 ◽  
Author(s):  
Yutaka Konishi ◽  
Takamoto Itoh ◽  
Masao Sakane ◽  
Fumio Ogawa ◽  
Hideyuki Kanayama
Keyword(s):  
Fatigue Testing ◽  
Low Cycle Fatigue ◽  
Testing Machine ◽  
Strain Range ◽  
Fatigue Tests ◽  
Lead Free ◽  
Cycle Fatigue ◽  
Bulk Specimen ◽  
Free Solder ◽  
Lead Free Solders

This paper investigates the fatigue results in low cycle fatigue region obtained from a miniaturized specimen having a 6mm gage length, 3mm diameter and 55mm total length. Fatigue tests were performed for two type lead-free solders using horizontal-type electrical servo hydraulic push-pull fatigue testing machine. Materials employed were Sn-3.0Ag-0.5Cu and Sn-5Sb. The results from Sn-3.0Ag-0.5Cu were compared with those obtained using a bulk specimen in a previous study. Relationship between strain range and number of cycles to failure of the small-sized specimen agreed with those of the bulk specimens. The testing techniques are applicable to Sn-5Sb following the Manson-Coffin law. These results confirm that the testing technique proposed here, using small-sized specimen, is suitable to get fruitful fatigue data for lead-free solder compounds.

Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders

2002 ◽  
Vol 31 (5) ◽  
pp. 456-465 ◽  
Author(s):  
Chaosuan Kanchanomai ◽  
Yukio Miyashita ◽  
Yoshiharu Mutoh
Keyword(s):  
Low Cycle Fatigue ◽  
Fatigue Behavior ◽  
Lead Free ◽  
Cycle Fatigue ◽  
Lead Free Solders

Low-cycle fatigue behavior and mechanisms of a lead-free solder 96.5Sn/3.5Ag

2002 ◽  
Vol 31 (2) ◽  
pp. 142-151 ◽  
Author(s):  
Chaosuan Kanchanomai ◽  
Yukio Miyashita ◽  
Yoshiharu Mutoh
Keyword(s):  
Low Cycle Fatigue ◽  
Fatigue Behavior ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cycle Fatigue ◽  
Free Solder

A Study on Strain Concentration Around V Notch in Lead Free Solder Material and the Low Cycle Fatigue Life

2015 ◽  
Author(s):  
Takashi Kawakami ◽  
Takahiro Kinoshita ◽  
Hirokazu Oriyama
Keyword(s):  
Fatigue Life ◽  
Solder Joints ◽  
Low Cycle Fatigue ◽  
Lead Free ◽  
Design Rule ◽  
Lead Free Solder ◽  
Cycle Fatigue ◽  
Stress Strain ◽  
Test Pieces ◽  
Free Solder

Solder joints are sometimes opened under thermal cyclic loads as low cycle fatigue phenomena. The fatigue crack is usually initiated around the edge of the interface where stress and strain very severely concentrate, having stress strain singularity. In this study, Sn-3.0Ag-0.5Cu test pieces with V shape notch were supplied to low cycle fatigue tests at 100°C. And inelastic stress strain simulations, which were based on time-dependent non-unified material model, were carried out under several cyclic load levels to obtain strain distributions around the bottom of the V notch. By results of fatigue test and inelastic simulation, the depth from the bottom of the V notch, where the strain range agrees with the prediction of the fatigue life based on smooth test pieces on Coffin-Manson rule, was investigated as the mechanical design rule for lead free solder joints.

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