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3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011)
Latest Publications
TOTAL DOCUMENTS
34
(FIVE YEARS 0)
H-INDEX
3
(FIVE YEARS 0)
Published By IEEE
9781467307598, 9781467307581
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Latest Documents
Most Cited Documents
Contributed Authors
Related Sources
Related Keywords
Hardware description language (HDL): An efficient approach to device independent designs for VLSI market segments
3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011)
◽
10.1109/icastech.2011.6145181
◽
2011
◽
Cited By ~ 3
Author(s):
Okafor Kennedy Chinedu
◽
Ezekwe Chinwe Genevera
◽
Ogungbenro Oluwaseyi Akinyele
Keyword(s):
Hardware Description Language
◽
Description Language
◽
Market Segments
◽
Efficient Approach
◽
Hardware Description
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[Front cover]
3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011)
◽
10.1109/icastech.2011.6145182
◽
2011
◽
Keyword(s):
Front Cover
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Real Time SMS-Based hashing scheme for securing financial transactions on ATM systems
3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011)
◽
10.1109/icastech.2011.6145151
◽
2011
◽
Cited By ~ 2
Author(s):
Ugochukwu Onwudebelu
◽
Olumide Longe
◽
Sanjo Fasola
◽
Ndidi C. Obi
◽
Olumuyiwa B. Alaba
Keyword(s):
Real Time
◽
Financial Transactions
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The saturation of the control channel in multi channel wireless access networks
3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011)
◽
10.1109/icastech.2011.6145167
◽
2011
◽
Author(s):
Mthulisi Velempini
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Mqhele E. Dlodlo
Keyword(s):
Access Networks
◽
Wireless Access
◽
Control Channel
◽
Wireless Access Networks
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Investigation of effects of heat sinks on thermal performance of microelectronic package
3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011)
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10.1109/icastech.2011.6145164
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2011
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Cited By ~ 3
Author(s):
Mathias Ekpu
◽
Raj Bhatti
◽
Ndy Ekere
◽
Sabuj Mallik
◽
Emeka Amalu
◽
...
Keyword(s):
Thermal Performance
◽
Heat Sinks
◽
Microelectronic Package
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Thermal effects of die-attach voids location and style on performance of chip level package
3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011)
◽
10.1109/icastech.2011.6145176
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2011
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Cited By ~ 6
Author(s):
K. C. Otiaba
◽
R. S. Bhatti
◽
N. N. Ekere
◽
S. Mallik
◽
E. H. Amalu
◽
...
Keyword(s):
Thermal Effects
◽
Die Attach
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Performance evaluation of constant bit rate and variable bit rate traffic models on Vehicular Ad hoc network using dynamic source routing protocol
3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011)
◽
10.1109/icastech.2011.6145171
◽
2011
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Cited By ~ 1
Author(s):
Panos Bakalis
◽
Lawal Bello
◽
Olamide Jagun
◽
Kwashie Anang
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Titus Eneh
◽
...
Keyword(s):
Routing Protocol
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Ad Hoc Network
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Ad Hoc
◽
Variable Bit Rate
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Bit Rate
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Traffic Models
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Source Routing
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Dynamic Source Routing
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Constant Bit Rate
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Dynamic Source
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Effect of signal strength on handover in GSM networks in Owo, Ondo State, Nigeria
3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011)
◽
10.1109/icastech.2011.6145166
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2011
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Cited By ~ 1
Author(s):
Omowunmi Mary Longe
Keyword(s):
Signal Strength
◽
Ondo State
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Effects of inter-metallic compound on high temperature reliability of flip chip interconnects for fine pitch applications
3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011)
◽
10.1109/icastech.2011.6145173
◽
2011
◽
Cited By ~ 1
Author(s):
E. H. Amalu
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N. N. Ekere
◽
G. Aminu
Keyword(s):
High Temperature
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Flip Chip
◽
Inter Metallic Compound
◽
Metallic Compound
◽
Fine Pitch
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Direct Sequence CDMA system using Finite-Time Altered Sinusoidal Signals as orthogonal signatures
3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011)
◽
10.1109/icastech.2011.6145170
◽
2011
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Author(s):
Fisusi Abimbola Adeola
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Adeniran Solomon Adekunle
◽
Awe Olusegun Peter
Keyword(s):
Finite Time
◽
Cdma System
◽
Direct Sequence
◽
Sinusoidal Signals
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