Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC.
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Regression models for parameters related to bayesian reliability inference procedures

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. ◽

10.1109/agec.2005.1452339 ◽

2005 ◽

Author(s):

Peng Wang ◽

Tongdan Jin ◽

Haitao Liao ◽

Jiachen Liu

Keyword(s):

Regression Models

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Interfacial characteristics of Sn3.5Ag solder on copper after Nd:YAG laser surface irradiation

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. ◽

10.1109/agec.2005.1452345 ◽

2005 ◽

Author(s):

Lei Wang ◽

Chun-qing Wang ◽

Zhen-qing Zhao ◽

Yi Huang

Keyword(s):

Nd:Yag Laser ◽

Laser Surface ◽

Interfacial Characteristics

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Optimising the wave soldering process for lead free solders

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. ◽

10.1109/agec.2005.1452331 ◽

2005 ◽

Author(s):

S. Stoyanov ◽

C. Bailey ◽

N. Saxena ◽

S. Adams

Keyword(s):

Lead Free ◽

Soldering Process ◽

Wave Soldering ◽

Lead Free Solders

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Mechanical shock modeling and testing of lead-free solder joint in hard disk drive head assembly

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. ◽

10.1109/agec.2005.1452343 ◽

2005 ◽

Author(s):

Chen Hongtao ◽

Wang Chunqing ◽

Li Mingyu

Keyword(s):

Solder Joint ◽

Hard Disk Drive ◽

Hard Disk ◽

Lead Free ◽

Lead Free Solder ◽

Mechanical Shock ◽

Head Assembly ◽

Free Solder ◽

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Experimental and modeling analysis on moisture induced failures in flip chip on flex interconnections with anisotropic conductive film

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. ◽

10.1109/agec.2005.1452340 ◽

2005 ◽

Author(s):

C.Y. Yin ◽

H. Lu ◽

C. Bailey ◽

Y.C. Chan

Keyword(s):

Flip Chip ◽

Anisotropic Conductive Film ◽

Modeling Analysis ◽

Conductive Film

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Micro-bga package reliability and optimization of reflow soldering profile

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. ◽

10.1109/agec.2005.1452333 ◽

2005 ◽

Author(s):

Jingang Gao ◽

Yiping Wu ◽

Han Ding

Keyword(s):

Reflow Soldering ◽

Bga Package ◽

Package Reliability

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Design for green electronics, a great potential is still ahead

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. ◽

10.1109/agec.2005.1452308 ◽

2005 ◽

Author(s):

Li Ying ◽

N. de Caluwe ◽

A. Stevels

Keyword(s):

Green Electronics

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LCA case study for copier using the matrix-based LCA software and JLCA database

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. ◽

10.1109/agec.2005.1452330 ◽

2005 ◽

Author(s):

W. Lu ◽

S. Sakai ◽

S. Izumi

Keyword(s):

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Minimize system failure rate considering variations of electronic components lifetime data [PCB design for reliability]

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. ◽

10.1109/agec.2005.1452332 ◽

2005 ◽

Author(s):

Tongdan Jin ◽

Zhenhua Xiong ◽

Peng Wang

Keyword(s):

Failure Rate ◽

Lifetime Data ◽

System Failure ◽

Electronic Components ◽

Design For Reliability ◽

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Effects of Bi - Ni additives on the microstructures and wetting properties of Sn-Zn-Cu lead-free alloy

Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC. ◽

10.1109/agec.2005.1452324 ◽

2005 ◽

Author(s):

H.P. Xie ◽

D.Q. Yu ◽

L. Wang

Keyword(s):

Lead Free ◽

Wetting Properties

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