Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM)
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(FIVE YEARS 0)

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Published By IEEE

0780313720

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Cooling performance of plate fins for multichip modules

Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM) ◽

10.1109/itherm.1994.342904 ◽

2002 ◽

Cited By ~ 13

Author(s):

H. Iwasaki ◽

T. Sasaki ◽

M. Ishizuka

Keyword(s):

Multichip Modules ◽

Cooling Performance

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Pool boiling interactions between multiple heat sources in an array of silicon chips

Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM) ◽

10.1109/itherm.1994.342919 ◽

2002 ◽

Cited By ~ 3

Author(s):

S.E. Balch ◽

S.H. Bhavnani ◽

R.C. Jaeger ◽

S. Bhutani

Keyword(s):

Pool Boiling ◽

Heat Sources ◽

Silicon Chips

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Single-phase and boiling cooling of small pin fin arrays by multiple slot nozzle suction and impingement

Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM) ◽

10.1109/itherm.1994.342918 ◽

2002 ◽

Cited By ~ 1

Author(s):

D. Copeland

Keyword(s):

Single Phase ◽

Slot Nozzle ◽

Pin Fin ◽

Pin Fin Arrays

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Finding unknown surface temperatures and heat fluxes in steady heat conduction

Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM) ◽

10.1109/itherm.1994.342894 ◽

2002 ◽

Author(s):

T.J. Martin ◽

G.S. Dulikravich

Keyword(s):

Heat Conduction ◽

Heat Fluxes ◽

Surface Temperatures ◽

Steady Heat Conduction ◽

Steady Heat

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Gas-assisted evaporative cooling of high density electronic modules

Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM) ◽

10.1109/itherm.1994.342916 ◽

2002 ◽

Cited By ~ 2

Author(s):

A. Bar-Cohen ◽

G. Sherwood ◽

M. Hodes

Keyword(s):

Evaporative Cooling ◽

High Density

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Thermap: a thermal model for microprocessors

Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM) ◽

10.1109/itherm.1994.342903 ◽

2002 ◽

Author(s):

J. Fitch ◽

L. Monier ◽

H. Tamet

Keyword(s):

Thermal Model

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Entrance analysis of turbulent flow in an array of heated rectangular blocks

Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM) ◽

10.1109/itherm.1994.342896 ◽

2002 ◽

Cited By ~ 1

Author(s):

M. Faghri ◽

M. Molki ◽

J. Chrupcala ◽

Y. Asako

Keyword(s):

Turbulent Flow

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Jet impingement boiling of a dielectric coolant in narrow gaps

Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM) ◽

10.1109/itherm.1994.342920 ◽

2002 ◽

Cited By ~ 11

Author(s):

G.M. Chrysler ◽

R.C. Chu ◽

R.E. Simons

Keyword(s):

Jet Impingement ◽

Jet Impingement Boiling ◽

Narrow Gaps

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Effects of dissolved gases on subcooled flow boiling from small heated regions with and without streamwise concave curvature

Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM) ◽

10.1109/itherm.1994.342917 ◽

2002 ◽

Cited By ~ 1

Author(s):

P.S. Wu ◽

T.W. Simon

Keyword(s):

Flow Boiling ◽

Dissolved Gases ◽

Subcooled Flow Boiling ◽

Subcooled Flow

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Modelling of thermal vias in thin film multichip modules

Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM) ◽

10.1109/itherm.1994.342909 ◽

2002 ◽

Cited By ~ 10

Author(s):

F. Christiaens ◽

E. Beyne ◽

J. Berghmans

Keyword(s):

Thin Film ◽

Multichip Modules

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Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Cooling performance of plate fins for multichip modules

Pool boiling interactions between multiple heat sources in an array of silicon chips

Single-phase and boiling cooling of small pin fin arrays by multiple slot nozzle suction and impingement

Finding unknown surface temperatures and heat fluxes in steady heat conduction

Gas-assisted evaporative cooling of high density electronic modules

Thermap: a thermal model for microprocessors

Entrance analysis of turbulent flow in an array of heated rectangular blocks

Jet impingement boiling of a dielectric coolant in narrow gaps

Effects of dissolved gases on subcooled flow boiling from small heated regions with and without streamwise concave curvature

Modelling of thermal vias in thin film multichip modules

Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM)
Latest Publications