1996 Proceedings 46th Electronic Components and Technology Conference
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193

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15

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Published By IEEE

0780332865

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Solder joint reliability study of 256 pin, 0.4 mm pitch, PQFP

1996 Proceedings 46th Electronic Components and Technology Conference ◽

10.1109/ectc.1996.550891 ◽

2002 ◽

Author(s):

C.K. Yeo ◽

S. Mhaisalkar ◽

H.L.J. Pang

Keyword(s):

Solder Joint ◽

Reliability Study ◽

Solder Joint Reliability ◽

Joint Reliability

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Thermal and viscoelastic characterization of transfer-molded epoxy encapsulant during simulated post-mold cure

1996 Proceedings 46th Electronic Components and Technology Conference ◽

10.1109/ectc.1996.550809 ◽

2002 ◽

Author(s):

S. Chew

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PWB solder wettability after simulated storage

1996 Proceedings 46th Electronic Components and Technology Conference ◽

10.1109/ectc.1996.550883 ◽

2002 ◽

Author(s):

C.L. Hernadez ◽

F.M. Hosking

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High frequency characteristics of MCM decoupling capacitors

1996 Proceedings 46th Electronic Components and Technology Conference ◽

10.1109/ectc.1996.517414 ◽

2002 ◽

Author(s):

L.W. Schaper ◽

G. Morcan

Keyword(s):

High Frequency ◽

Frequency Characteristics ◽

Decoupling Capacitors

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Area array packaging technologies for high-performance computer workstations and multiprocessors

1996 Proceedings 46th Electronic Components and Technology Conference ◽

10.1109/ectc.1996.550753 ◽

2002 ◽

Author(s):

T.C. Chung ◽

F. Ghahghahi ◽

B. Oberlin ◽

D. Carey ◽

D. Nelson

Keyword(s):

High Performance ◽

High Performance Computer

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Creep deformation of 96.5Sn-3.5Ag solder joints in a flip chip package

1996 Proceedings 46th Electronic Components and Technology Conference ◽

10.1109/ectc.1996.550880 ◽

2002 ◽

Author(s):

Hong Yang ◽

P. Deane ◽

P. Magill ◽

K.L. Murty

Keyword(s):

Creep Deformation ◽

Flip Chip ◽

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Thermo-mechanical modeling of a novel MCM-DL technology

1996 Proceedings 46th Electronic Components and Technology Conference ◽

10.1109/ectc.1996.550502 ◽

2002 ◽

Author(s):

R.C. Dunne ◽

S.K. Sitaraman

Keyword(s):

Mechanical Modeling

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The P-VixeLink/sup TM/ multichannel optical interconnect

1996 Proceedings 46th Electronic Components and Technology Conference ◽

10.1109/ectc.1996.517408 ◽

2002 ◽

Author(s):

S. Swirhun ◽

M. Dudek ◽

R. Neumann ◽

J. Calkins ◽

P. Brusenbach ◽

...

Keyword(s):

Optical Interconnect

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Laser isotope purification of lead for use in semiconductor chip interconnects

1996 Proceedings 46th Electronic Components and Technology Conference ◽

10.1109/ectc.1996.550815 ◽

2002 ◽

Author(s):

K. Scheibner ◽

C. Haynam ◽

E. Worden ◽

B. Esser

Keyword(s):

Semiconductor Chip

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High-speed optical receiver module fabrication using laser welding technique

1996 Proceedings 46th Electronic Components and Technology Conference ◽

10.1109/ectc.1996.517450 ◽

2002 ◽

Author(s):

Seung Goo Kang ◽

Min Kyu Song ◽

Nam Hwang ◽

Chan Yong Park ◽

Hee Tae Lee ◽

...

Keyword(s):

Laser Welding ◽

Optical Receiver ◽

Receiver Module ◽

Welding Technique

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