2021 Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)
Latest Publications

TOTAL DOCUMENTS

7
(FIVE YEARS 7)

H-INDEX

0
(FIVE YEARS 0)

Published By IEEE

9781728163161
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

TAPIR (compacT and modulAr Power modules with IntegRated cooling) Technology: Goals and Challenges

2021 ◽  
Author(s):  
Wendpanga-Fadel Bikinga ◽  
Bachir Mezrag ◽  
Yvan Avenas ◽  
Jean-Luc Schanen ◽  
Jean-Michel Guichon ◽  
...  
Keyword(s):  
Power Modules ◽  
Cooling Technology

Reliability aspects of 3D integrated power devices

2021 ◽  
Author(s):  
Christian Baumler ◽  
Jorg Franke ◽  
Josef Lutz
Keyword(s):  
Power Devices

Power Microtransformer on Silicon Embedded into PCB

2021 ◽  
Author(s):  
Dragan Dinulovic ◽  
Leon Haase ◽  
Martin Haug ◽  
Jurgen Wolf
Load More ...
Sign in / Sign up

Export Citation Format

Share Document