Origin of light instability in amorphous IGZO thin-film transistors and its suppression

Radiating amorphous In–Ga–Zn–O (a-IGZO) thin-film transistors (TFTs) with deep ultraviolet light (λ = 175 nm) is found to induce rigid negative threshold-voltage shift, as well as a subthreshold hump and an increase in subthreshold-voltage slope. These changes are attributed to the photo creation and ionization of oxygen vacancy states (VO), which are confined mainly to the top surface of the a-IGZO film (backchannel). Photoionization of these states generates free electrons and the transition from the neutral to the ionized VO is accompanied by lattice relaxation, which raises the energy of the ionized VO. This and the possibility of atomic exchange with weakly bonded hydrogen leads to metastability of the ionized VO, consistent with the rigid threshold-voltage shift and increase in subthreshold-voltage slope. The hump is thus a manifestation of the highly conductive backchannel and its formation can be suppressed by reduction of the a-IGZO film thickness or application of a back bias after radiation. These results support photo creation and ionization of VO as the main cause of light instability in a-IGZO TFTs and provide some insights on how to minimize the effect.

Gate-on-drain overlapped L-shaped channel Tunnel FET as label-free biosensor

In this manuscript gate-on-drain L-shaped channel Tunnel FET is proposed to detect various biomolecules through label-free bio-sensing detection technique. Biomolecules can be detected in the proposed structure through modulating ambipolar current between channel and drain by overlapping gate on drain thus creating a cavity. Trapped biomolecules within cavity gets immobilized. Immobilized biomolecules change the drain to channel tunneling width, thus changing the ambiploar leakage current. Drain doping and cavity length was fine-tuned to achieve better sensitivity in terms of ambipolar current and ambipolar knee voltage shift with and without presence of biomolecules. A maximum sensitivity of 3.8×107 is achieved for drain doping of 5×1019 donors/cm3 and cavity length of 60nm. A high value of sensitivity is achieved for each biomolecules when drain doping ranged from 1019 donors/cm3 to 5×1019 donors/cm3 and cavity length ranged between 40nm to 50nm. Effect of differently charged biomolecules on sensitivity has also be structured.

Fabrication of All-GaN Integrated MIS-HEMTs with High Threshold Voltage Stability Using Supercritical Technology

In this paper, a novel method to achieve all-GaN integrated MIS-HEMTs in a Si-CMOS platform by self-terminated and self-alignment process is reported. Furthermore, a process of repairing interface defects by supercritical technology is proposed to suppress the threshold voltage shift of all GaN integrated MIS-HEMTs. The threshold voltage characteristics of all-GaN integrated MIS-HEMTs are simulated and analyzed. We found that supercritical NH3 fluid has the characteristics of both liquid NH3 and gaseous NH3 simultaneously, i.e., high penetration and high solubility, which penetrate the packaging of MIS-HEMTs. In addition, NH2− produced via the auto coupling ionization of NH3 has strong nucleophilic ability, and is able to fill nitrogen vacancies near the GaN surface created by high temperature process. The fabricated device delivers a threshold voltage of 2.67 V. After supercritical fluid treatment, the threshold voltage shift is reduced from 0.67 V to 0.13 V. Our demonstration of the supercritical technology to repair defects of wide-bandgap family of semiconductors may bring about great changes in the field of device fabrication.