Nano-Bio- Electronic, Photonic and MEMS Packaging
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Published By Springer US

9781441900395, 9781441900401
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Nanobiosensing Electronics and Nanochemistry for Biosensor Packaging

2009 ◽  
pp. 613-663
Author(s):  
Dasharatham G. Janagama ◽  
Rao R. Tummala

Nanoscale Deformation and Strain Analysis by AFM/DIC Technique

2009 ◽  
pp. 695-718
Author(s):  
Y. F. Sun ◽  
John H.L. Pang
Keyword(s):  
Strain Analysis ◽  
Dic Technique

Nano-conductive Adhesives for Nano-electronics Interconnection

2009 ◽  
pp. 19-45 ◽  
Author(s):  
Yi Li ◽  
Kyoung-sik (Jack) Moon ◽  
C.P. Wong
Keyword(s):  
Conductive Adhesives

Molecular Dynamics Applications in Packaging

2009 ◽  
pp. 665-694
Author(s):  
Yao Li ◽  
Jeffrey A. Hinkley ◽  
Karl I. Jacob
Keyword(s):  
Molecular Dynamics

Some Aspects of Microchannel Heat Transfer

2009 ◽  
pp. 431-477
Author(s):  
Y. Joshi ◽  
X. Wei ◽  
B. Dang ◽  
K. Kota
Keyword(s):  
Heat Transfer

Nanoprobes for Live-Cell Gene Detection

2009 ◽  
pp. 479-504
Author(s):  
Gang Bao ◽  
Won Jong Rhee ◽  
Andrew Tsourkas
Keyword(s):  
Live Cell ◽  
Gene Detection ◽  
Cell Gene

Biomimetic Lotus Effect Surfaces for Nanopackaging

2009 ◽  
pp. 47-85
Author(s):  
Yonghao Xiu ◽  
C.P. Wong
Keyword(s):  
Lotus Effect

On-Chip Thermal Management and Hot-Spot Remediation

2009 ◽  
pp. 349-429 ◽  
Author(s):  
Avram Bar-Cohen ◽  
Peng Wang
Keyword(s):  
Thermal Management ◽  
Hot Spot ◽  
On Chip
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