Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging

2009 ◽  
pp. 217-246 ◽  
Author(s):  
Hongjin Jiang ◽  
Kyoung-sik (Jack) Moon ◽  
C.P. Wong
Keyword(s):  
Microelectronic Packaging ◽  
Processing Temperature ◽  
Solder Pastes ◽  
Free Solder

X-ray inspection and Six-Sigma in analysis of LED thermal pad coverage

2017 ◽  
Vol 29 (1) ◽  
pp. 28-33 ◽  
Author(s):  
Barbara Dziurdzia ◽  
Janusz Mikolajek
Keyword(s):  
Six Sigma ◽  
Vapour Phase ◽  
Inspection System ◽  
Solder Paste ◽  
Process Variables ◽  
Reflow Soldering ◽  
Content Type ◽  
X Ray ◽  
Solder Pastes ◽  
Free Solder

Purpose The purpose of this paper is to evaluate selected methods of reduction voidings in lead-free solder joints underneath thermal pads of light-emitting diodes (LEDs), using X-ray inspection and Six Sigma methodology. Design/methodology/approach On the basis of cause and effect diagram for solder voiding, the potential causes of voids and influence of process variables on void formation were found. Three process variables were chosen: the type of reflow soldering, vacuum incorporation and the type of solder paste. Samples of LEDs were mounted with convection and vapour phase reflow soldering. Vacuum was incorporated into vapour phase soldering. Two types of solder pastes OM338PT and LFS-216LT were used. Algorithm incorporated into X-ray inspection system enabled to calculate the statistical distribution of LED thermal pad coverage and to find the process capability index (Cpk) of applied soldering techniques. Findings The evaluation of selected soldering processes of LEDs in respect of their thermal pad coverage and statistical Cpk indices is presented. Vapour-phase soldering with vacuum is capable (Cpk > 1) for OM338PT and LFS-216LT paste. Convection reflow without vacuum with LFS-216LT paste is also capable (Cpk = 1.1). Other technological soldering processes require improvements. Vacuum improves radically the capability of a reflow soldering for an LED assembly. When vacuum is not accessible, some improvement of capability to a lower extent is possible by an application of void-free solder pastes. Originality/value Six Sigma statistical methodology combined with X-ray diagnosis was used to check whether applied methods of void reduction underneath LED thermal pads are capable processes.

Interfacial microstructures and solder joint strengths of the Sn–8Zn–3Bi and Sn-9Zn–lAl Pb–free solder pastes on OSP finished printed circuit boards

2008 ◽  
Vol 459 (1-2) ◽  
pp. 225-231 ◽  
Author(s):  
Ching-Tsung Lin ◽  
Chi-Shiung Hsi ◽  
Moo-Chin Wang ◽  
Tao-Chih Chang ◽  
Ming-Kann Liang
Keyword(s):  
Solder Joint ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Solder Pastes ◽  
Free Solder

In-situ Non-destructive Ultrasonic Rheology Technique for Monitoring Different Lead-free Solder Pastes for Surface Mount Applications

2008 ◽  
Author(s):  
A. Seman ◽  
N.N. Ekere ◽  
S.J. Ashenden ◽  
S. Mallik ◽  
A.E. Marks ◽  
...  
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Surface Mount ◽  
Solder Pastes ◽  
Free Solder ◽  
Non Destructive

Micro-Scale Solder Joints between Cu-Cu Wires Formed by Nanoparticle Enabled Lead-Free Solder Pastes

2016 ◽  
Author(s):  
Evan Wernicki ◽  
Edward Fratto ◽  
Yang Shu ◽  
Fan Gao ◽  
Zhiyong Gu
Keyword(s):  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Micro Scale ◽  
Solder Pastes ◽  
Free Solder

Understanding the process window for printing lead-free solder pastes

2002 ◽  
Author(s):  
T.A. Nguty ◽  
S. Budiman ◽  
D. Rajkumar ◽  
R. Solomon ◽  
N.N. Ekere ◽  
...  
Keyword(s):  
Lead Free ◽  
Process Window ◽  
Lead Free Solder ◽  
Solder Pastes ◽  
Free Solder
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