2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)
Latest Publications

TOTAL DOCUMENTS

169

(FIVE YEARS 0)

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Published By IEEE

9781467372695

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Forced-time controlled transient dynamic wire bonding simulation for wire bond process development

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) ◽

10.1109/eptc.2015.7412397 ◽

2015 ◽

Author(s):

Chai Chee Meng ◽

Eric Yong Woon Yik

Keyword(s):

Process Development ◽

Wire Bonding ◽

Transient Dynamic ◽

Wire Bond

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The impact of process sequence on the quality of pressurized sintered silver joints

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) ◽

10.1109/eptc.2015.7412289 ◽

2015 ◽

Author(s):

Wayne Ng ◽

Keisuke Kumagai ◽

Keith Sweatman ◽

Takatoshi Nishimura

Keyword(s):

Process Sequence ◽

The Impact ◽

Sintered Silver

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Substrate opening to increase solder joint reliability and circuit integration

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) ◽

10.1109/eptc.2015.7412392 ◽

2015 ◽

Cited By ~ 1

Author(s):

Lim Teck Guan ◽

Che Faxing

Keyword(s):

Solder Joint ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Circuit Integration

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TSV integration with 20nm CMOS technology for 3D-IC enablement

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) ◽

10.1109/eptc.2015.7412407 ◽

2015 ◽

Cited By ~ 3

Author(s):

Shan Gao ◽

Sukeshwar Kannan ◽

Daniel Smith ◽

Rahul Agarwal ◽

Ramakanth Alapati

Keyword(s):

Cmos Technology ◽

3D Ic

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Thermal resistance measurement of discrete capacitors

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) ◽

10.1109/eptc.2015.7412332 ◽

2015 ◽

Cited By ~ 2

Author(s):

Zoltan Sarkany ◽

Gabor Farkas ◽

Marta Rencz

Keyword(s):

Thermal Resistance ◽

Resistance Measurement

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2.5D packaging solution - From concept to platform qualification

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) ◽

10.1109/eptc.2015.7412358 ◽

2015 ◽

Cited By ~ 3

Author(s):

Jens Oswald ◽

Christian Goetze ◽

Shan Gao ◽

ShunQiang Gong ◽

Juan Boon Tan ◽

...

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Micro-channel heat sink with multiple interactive pressure-driven or electro-osmotic flows

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) ◽

10.1109/eptc.2015.7412295 ◽

2015 ◽

Cited By ~ 1

Author(s):

Yong Han ◽

Boon Long Lau ◽

Gongyue Tang ◽

Xiaowu Zhang

Keyword(s):

Heat Sink ◽

Micro Channel ◽

Pressure Driven

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Development of highly efficient 5GHz-band CMOS class-E power amplifier module

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) ◽

10.1109/eptc.2015.7412318 ◽

2015 ◽

Cited By ~ 1

Author(s):

Kyohei Eto ◽

Kizuku Takemoto ◽

Haruichi Kanaya

Keyword(s):

Power Amplifier ◽

Highly Efficient ◽

Class E

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Enabling Cu wire in 3D stack package QFN

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) ◽

10.1109/eptc.2015.7412415 ◽

2015 ◽

Author(s):

Ruby Ann M. Camenforte ◽

Ray Fredric de Asis ◽

Mahmud Chowdhury

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Reliability test failure analysis using advance FA techniques on Cu wire bonded devices

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) ◽

10.1109/eptc.2015.7412404 ◽

2015 ◽

Cited By ~ 1

Author(s):

L. Zhang ◽

T. C. Chai ◽

L. C. Wai ◽

T. W. Lam ◽

D. P. Vallett ◽

...

Keyword(s):

Failure Analysis ◽

Reliability Test ◽

Test Failure

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2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Forced-time controlled transient dynamic wire bonding simulation for wire bond process development

The impact of process sequence on the quality of pressurized sintered silver joints

Substrate opening to increase solder joint reliability and circuit integration

TSV integration with 20nm CMOS technology for 3D-IC enablement

Thermal resistance measurement of discrete capacitors

2.5D packaging solution - From concept to platform qualification

Micro-channel heat sink with multiple interactive pressure-driven or electro-osmotic flows

Development of highly efficient 5GHz-band CMOS class-E power amplifier module

Enabling Cu wire in 3D stack package QFN

Reliability test failure analysis using advance FA techniques on Cu wire bonded devices

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)
Latest Publications