2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)
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9781467372695
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The impact of process sequence on the quality of pressurized sintered silver joints

2015 ◽  
Author(s):  
Wayne Ng ◽  
Keisuke Kumagai ◽  
Keith Sweatman ◽  
Takatoshi Nishimura
Keyword(s):  
Process Sequence ◽  
The Impact ◽  
Sintered Silver

TSV integration with 20nm CMOS technology for 3D-IC enablement

2015 ◽  
Author(s):  
Shan Gao ◽  
Sukeshwar Kannan ◽  
Daniel Smith ◽  
Rahul Agarwal ◽  
Ramakanth Alapati
Keyword(s):  
Cmos Technology ◽  
3D Ic

Thermal resistance measurement of discrete capacitors

2015 ◽  
Author(s):  
Zoltan Sarkany ◽  
Gabor Farkas ◽  
Marta Rencz
Keyword(s):  
Thermal Resistance ◽  
Resistance Measurement

2.5D packaging solution - From concept to platform qualification

2015 ◽  
Author(s):  
Jens Oswald ◽  
Christian Goetze ◽  
Shan Gao ◽  
ShunQiang Gong ◽  
Juan Boon Tan ◽  
...  

Micro-channel heat sink with multiple interactive pressure-driven or electro-osmotic flows

2015 ◽  
Author(s):  
Yong Han ◽  
Boon Long Lau ◽  
Gongyue Tang ◽  
Xiaowu Zhang
Keyword(s):  
Heat Sink ◽  
Micro Channel ◽  
Pressure Driven

Enabling Cu wire in 3D stack package QFN

2015 ◽  
Author(s):  
Ruby Ann M. Camenforte ◽  
Ray Fredric de Asis ◽  
Mahmud Chowdhury

Reliability test failure analysis using advance FA techniques on Cu wire bonded devices

2015 ◽  
Author(s):  
L. Zhang ◽  
T. C. Chai ◽  
L. C. Wai ◽  
T. W. Lam ◽  
D. P. Vallett ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Reliability Test ◽  
Test Failure
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