Reliability test failure analysis using advance FA techniques on Cu wire bonded devices

2015 ◽  
Author(s):  
L. Zhang ◽  
T. C. Chai ◽  
L. C. Wai ◽  
T. W. Lam ◽  
D. P. Vallett ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Reliability Test ◽  
Test Failure

Metal Slice Defect Induced Package Level Reliability Failure

2006 ◽  
Author(s):  
Mark Zhang ◽  
Scott Liao ◽  
Sanan Liang ◽  
Ricky Lou ◽  
Rock Chen ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Reliability Test ◽  
Root Cause ◽  
Corrective Actions ◽  
Test Failure

Abstract In this paper, a case of package level reliability test failure was studied. A model of “Slice Defect”, which was identified as the root cause by failure analysis, is introduced. Experiment results are presented to approve that such model is in fact correct and the corrective actions are effective.

Updated Analysis of Circuit Reliability Test Results

2012 ◽  
Vol 2012 (HITEC) ◽  
pp. 000253-000259
Author(s):  
Milton Watts
Keyword(s):  
Failure Analysis ◽  
Detailed Analysis ◽  
Continuous Improvement ◽  
Oil And Gas ◽  
Lessons Learned ◽  
Reliability Test ◽  
Circuit Reliability ◽  
Test Results ◽  
Life Testing ◽  
Gas Market

The downhole oil and gas market is continually pushing for higher reliability at higher temperatures. Satisfying this need requires continuous improvement, driven by failure analysis of both internal testing and field returns. This paper discusses recent lessons learned from on-going tests. Results of unpowered circuit assembly tests are reviewed. Also, a detailed analysis of separate powered life testing is presented. The internal testing results are further discussed in the context of field return data.

Power MOSFET Failure Analysis and Package Effects in 3-Phase, Half-Bridge Applications and Design Improvements

2017 ◽  
Author(s):  
Mark Dipsey ◽  
Ian Kearney
Keyword(s):  
Failure Analysis ◽  
System Reliability ◽  
Consumer Perceptions ◽  
Power Device ◽  
Original Form ◽  
Reliability Test ◽  
Competitive Advantages ◽  
Power Mosfet ◽  
Specific Approach ◽  
Application Specific

Abstract The degraded performance of a power MOSFET affects customer system reliability and consumer perceptions of quality. Building a reliable product and associated application specific lifetime models to predict the suitability of a power device for a given solution can enable competitive advantages, increased quality, enhanced performance and result in market share gains. This paper describes the methodology employed to configure an application specific reliability test, the failure rates and modes observed, the package modelling, and design improvements implemented. The validation of such relative to its original form and competitor products is discussed where we demonstrate a doubling in performance and an approximate 50% increase in current handling capability. This type of analysis and application specific approach to innovation enables one to focus design improvements in areas most relevant to customer concerns while at the same time adding credibility to specified product limits.

Destruction failure analysis and international reliability test standard for power devices

2015 ◽  
Vol 55 (9-10) ◽  
pp. 1932-1937 ◽  
Author(s):  
Takashi Setoya ◽  
Tsuneo Ogura ◽  
Wataru Saito ◽  
Tomoko Matsudai ◽  
Koichi Endo
Keyword(s):  
Failure Analysis ◽  
Reliability Test ◽  
Power Devices

Reliability Test and Failure Analysis of High Power Semicounductor Laser

2017 ◽  
Vol 38 (2) ◽  
pp. 165-169
Author(s):  
王文知 WANG Wen-zhi ◽  
井红旗 JING Hong-qi ◽  
祁 琼 QI Qiong ◽  
王翠鸾 WANG Cui-luan ◽  
倪羽茜 NI Yu-xi ◽  
...  
Keyword(s):  
Failure Analysis ◽  
High Power ◽  
Reliability Test

Reliability test and failure analysis of high‐density packages assembled with a low‐temperature lead‐free solder (SnBiAg)

2008 ◽  
Vol 20 (2) ◽  
pp. 21-29 ◽  
Author(s):  
John Lau ◽  
Jerry Gleason ◽  
Valeska Schroeder ◽  
Gregory Henshall ◽  
Walter Dauksher ◽  
...  
Keyword(s):  
Low Temperature ◽  
Failure Analysis ◽  
High Density ◽  
Lead Free ◽  
Reliability Test ◽  
Lead Free Solder ◽  
Free Solder

scholarly journals Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration

2020 ◽  
Vol 17 (3) ◽  
pp. 89-98
Author(s):  
John H. Lau ◽  
Cheng-Ta Ko ◽  
Chia-Yu Peng ◽  
Kai-Ming Yang ◽  
Tim Xia ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Printed Circuit Board ◽  
Drop Test ◽  
Circuit Board ◽  
Reliability Test ◽  
Heterogeneous Integration ◽  
Test Results ◽  
Glass Panel ◽  
Printed Circuit

Abstract In this investigation, the chip-last, redistribution-layer (RDL)–first, fan-out panel-level packaging (FOPLP) for heterogeneous integration is studied. Emphasis is placed on the materials, process, fabrication, and reliability of a heterogeneous integration of one large chip (10 × 10 mm2) and two small chips (7 × 5 mm2) by an FOPLP method on a 20 × 20-mm2 RDL-first substrate fabricated on a 515 × 510 mm2 temporary glass panel. Reliability test such as the drop test of the heterogeneous integration package on a printed circuit board (PCB) is performed, and test results including failure analysis are presented. Some recommendations are also provided.

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