2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781424494019, 9781424493982, 9781424494002

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

An analytical resistive loss model for multiconductor transmission lines and the proof of its passivity

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2011.6100203 ◽

2011 ◽

Cited By ~ 2

Author(s):

Frederic Broyde ◽

Evelyne Clavelier

Keyword(s):

Transmission Lines ◽

Loss Model ◽

Multiconductor Transmission Lines

Download Full-text

Design of a 12Gb/s transceiver for high-density links with discontinuities using modal signaling

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2011.6100230 ◽

2011 ◽

Cited By ~ 5

Author(s):

Pavle Milosevic ◽

Jose E. Schutt-Aine

Keyword(s):

High Density

Download Full-text

Accuracy-improved through-silicon-via model using conformal mapping technique

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2011.6100223 ◽

2011 ◽

Cited By ~ 5

Author(s):

Tai-Yu Cheng ◽

Chuen-De Wang ◽

Yih-Peng Chiou ◽

Tzong-Lin Wu

Keyword(s):

Conformal Mapping ◽

Mapping Technique ◽

Through Silicon Via

Download Full-text

An explicit and unconditionally stable time-domain finite-element method of linear complexity for electromagnetics-based simulation of 3-D global interconnect network

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2011.6100222 ◽

2011 ◽

Cited By ~ 5

Author(s):

Qing He ◽

Duo Chen ◽

Dan Jiao

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Time Domain ◽

Linear Complexity ◽

Unconditionally Stable ◽

Global Interconnect ◽

Interconnect Network ◽

Element Method

Download Full-text

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2011.6100158 ◽

2011 ◽

Download Full-text

Temperature-dependent through-silicon via (TSV) model and noise coupling

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2011.6100238 ◽

2011 ◽

Cited By ~ 5

Author(s):

Manho Lee ◽

Jonghyun Cho ◽

Joohee Kim ◽

Jun So Pak ◽

Joungho Kim ◽

...

Keyword(s):

Temperature Dependent ◽

Through Silicon Via ◽

Noise Coupling

Download Full-text

Decoupling capacitor stacked chip (DCSC) in TSV-based 3D-ICs

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2011.6100235 ◽

2011 ◽

Author(s):

Eunseok Song ◽

Kyoungchoul Koo ◽

Myunghoi Kim ◽

Jun So Pak ◽

Joungho Kim

Keyword(s):

3D Ics ◽

Decoupling Capacitor

Download Full-text

Macromodeling and circuit analysis (M-IX)

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2011.6100180 ◽

2011 ◽

Author(s):

Michel Nakhla ◽

Ruey-Beei Wu

Keyword(s):

Circuit Analysis

Download Full-text

Switching regulator noise coupled onto high speed differential links

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2011.6100227 ◽

2011 ◽

Cited By ~ 1

Author(s):

Daniel Rodriguez ◽

Sungjun Chun ◽

Rohan Mandrekar ◽

Daniel Dreps

Keyword(s):

High Speed ◽

Switching Regulator

Download Full-text

Novel RF and chip-to-chip interconnects (M-VII)

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems ◽

10.1109/epeps.2011.6100176 ◽

2011 ◽

Author(s):

Hartmut Grabinski ◽

Daniel de Araujo

Download Full-text

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

An analytical resistive loss model for multiconductor transmission lines and the proof of its passivity

Design of a 12Gb/s transceiver for high-density links with discontinuities using modal signaling

Accuracy-improved through-silicon-via model using conformal mapping technique

An explicit and unconditionally stable time-domain finite-element method of linear complexity for electromagnetics-based simulation of 3-D global interconnect network

Table of contents

Temperature-dependent through-silicon via (TSV) model and noise coupling

Decoupling capacitor stacked chip (DCSC) in TSV-based 3D-ICs

Macromodeling and circuit analysis (M-IX)

Switching regulator noise coupled onto high speed differential links

Novel RF and chip-to-chip interconnects (M-VII)

Export Citation Format

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and SystemsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

An analytical resistive loss model for multiconductor transmission lines and the proof of its passivity

Design of a 12Gb/s transceiver for high-density links with discontinuities using modal signaling

Accuracy-improved through-silicon-via model using conformal mapping technique

An explicit and unconditionally stable time-domain finite-element method of linear complexity for electromagnetics-based simulation of 3-D global interconnect network

Table of contents

Temperature-dependent through-silicon via (TSV) model and noise coupling

Decoupling capacitor stacked chip (DCSC) in TSV-based 3D-ICs

Macromodeling and circuit analysis (M-IX)

Switching regulator noise coupled onto high speed differential links

Novel RF and chip-to-chip interconnects (M-VII)

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems
Latest Publications