2009 11th Electronics Packaging Technology Conference
Latest Publications

TOTAL DOCUMENTS

188

(FIVE YEARS 0)

H-INDEX

13

(FIVE YEARS 0)

Published By IEEE

9781424450992

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Direct liquid thermal management of 3D chip stacks

2009 11th Electronics Packaging Technology Conference ◽

10.1109/eptc.2009.5416562 ◽

2009 ◽

Author(s):

A. Bar-Cohen ◽

K. J. L. Geisler ◽

E. Rahim

Keyword(s):

Thermal Management

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Analysis of power/ground noise effect on performance degradation of analog-to-digital converter

2009 11th Electronics Packaging Technology Conference ◽

10.1109/eptc.2009.5416463 ◽

2009 ◽

Author(s):

Woojin Ahn ◽

Jongjoo Shim ◽

Jeonghyeon Cho ◽

Minchul Shin ◽

Kyoungchoul Koo ◽

...

Keyword(s):

Performance Degradation ◽

Analog To Digital Converter ◽

Digital Converter ◽

Noise Effect ◽

Analog To Digital ◽

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Structure and process development of wafer level embedded SiP (System in Package) for mobile applications

2009 11th Electronics Packaging Technology Conference ◽

10.1109/eptc.2009.5416553 ◽

2009 ◽

Author(s):

Gi-Jo Jung ◽

Byoung-Yool Jeon ◽

In-Soo Kang

Keyword(s):

Mobile Applications ◽

Process Development ◽

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Challenges for extra large embedded wafer level ball grid array development

2009 11th Electronics Packaging Technology Conference ◽

10.1109/eptc.2009.5416551 ◽

2009 ◽

Author(s):

Jing-en Luan ◽

Yonggang Jin ◽

Kim-yong Goh ◽

Yiyi Ma ◽

Guojun Hu ◽

...

Keyword(s):

Ball Grid Array ◽

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Study of the rheological behaviours of Sn-Ag-Cu solder pastes and their correlation with printing performance

2009 11th Electronics Packaging Technology Conference ◽

10.1109/eptc.2009.5416423 ◽

2009 ◽

Author(s):

S. Mallik ◽

J. Thieme ◽

R. Bauer ◽

N. N. Ekere ◽

A. Seman ◽

...

Keyword(s):

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Whole-field board strain and displacement characterization during drop impact using a single camera DIC technique

2009 11th Electronics Packaging Technology Conference ◽

10.1109/eptc.2009.5416468 ◽

2009 ◽

Author(s):

Fabian Zhi De Lim ◽

Long Bin Tan ◽

Chenggen Quan ◽

Tong Yan Tee

Keyword(s):

Drop Impact ◽

Single Camera ◽

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Fracture behavior of 96.5Sn3.0Ag0.5Cu solder joint under mixed-mode tensile and shear loading conditions

2009 11th Electronics Packaging Technology Conference ◽

10.1109/eptc.2009.5416535 ◽

2009 ◽

Author(s):

Kok Ee Tan ◽

John H.L. Pang

Keyword(s):

Solder Joint ◽

Fracture Behavior ◽

Shear Loading ◽

Loading Conditions

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Thin die stacking by low temperature In/ Au IMC based bonding method

2009 11th Electronics Packaging Technology Conference ◽

10.1109/eptc.2009.5416503 ◽

2009 ◽

Author(s):

Siong Chiew Ong ◽

Won Kyoung Choi ◽

C. S. Premachandran ◽

Ebin Liao ◽

Ling Xie

Keyword(s):

Low Temperature ◽

Die Stacking ◽

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Assessment of thinned Si wafer warpage in 3D stacked wafers

2009 11th Electronics Packaging Technology Conference ◽

10.1109/eptc.2009.5416405 ◽

2009 ◽

Author(s):

Youngrae Kim ◽

Sung-Geun Kang ◽

Eun-kyung Kim

Keyword(s):

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Lead-free flux technology and influence on cleaning

2009 11th Electronics Packaging Technology Conference ◽

10.1109/eptc.2009.5416571 ◽

2009 ◽

Author(s):

Ning-Cheng Lee

Keyword(s):

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