2009 11th Electronics Packaging Technology Conference
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TOTAL DOCUMENTS

188
(FIVE YEARS 0)

H-INDEX

13
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Published By IEEE

9781424450992
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Thin die stacking by low temperature In/ Au IMC based bonding method

2009 ◽  
Author(s):  
Siong Chiew Ong ◽  
Won Kyoung Choi ◽  
C. S. Premachandran ◽  
Ebin Liao ◽  
Ling Xie
Keyword(s):  
Low Temperature ◽  
Die Stacking ◽  
Bonding Method

Assessment of thinned Si wafer warpage in 3D stacked wafers

2009 ◽  
Author(s):  
Youngrae Kim ◽  
Sung-Geun Kang ◽  
Eun-kyung Kim
Keyword(s):  
Si Wafer

Adhesive bonding of polymeric microfluidic devices

2009 ◽  
Author(s):  
C.S. Goh ◽  
S.C. Tan ◽  
K. T. May ◽  
C.Z. Chan ◽  
S.H. Ng
Keyword(s):  
Adhesive Bonding ◽  
Microfluidic Devices ◽  
Polymeric Microfluidic

Stretchable electronic systems: Realization and applications

2009 ◽  
Author(s):  
Thomas Loher ◽  
Manuel Seckel ◽  
Rene Vieroth ◽  
Christian Dils ◽  
Christine Kallmayer ◽  
...  
Keyword(s):  
Electronic Systems

Challenges for extra large embedded wafer level ball grid array development

2009 ◽  
Author(s):  
Jing-en Luan ◽  
Yonggang Jin ◽  
Kim-yong Goh ◽  
Yiyi Ma ◽  
Guojun Hu ◽  
...  
Keyword(s):  
Ball Grid Array ◽  
Wafer Level

Study of the rheological behaviours of Sn-Ag-Cu solder pastes and their correlation with printing performance

2009 ◽  
Author(s):  
S. Mallik ◽  
J. Thieme ◽  
R. Bauer ◽  
N. N. Ekere ◽  
A. Seman ◽  
...  
Keyword(s):  
Solder Pastes
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