Reliability evaluation of fatigue life for solder joints in chip components considering shape dispersion

2009 ◽  
Author(s):  
Yuji Nishimura ◽  
Qiang Yu ◽  
Toshiaki Maruoka
Keyword(s):  
Fatigue Life ◽  
Solder Joints ◽  
Reliability Evaluation

The Fatigue Reliability Evaluation & Improvement of the Single-Arm Subway Current Collector

2012 ◽  
Vol 215-216 ◽  
pp. 826-831 ◽  
Author(s):  
Yu Chen ◽  
Zhi Ming Liu ◽  
Qiang Li
Keyword(s):  
Fatigue Life ◽  
Calculation Result ◽  
Dynamic Stress ◽  
Current Collector ◽  
Reliability Evaluation ◽  
Fatigue Reliability ◽  
Railway Vehicles ◽  
Load Spectra ◽  
Reliability Method

This study developed a fatigue reliability method for evaluating and improving the key parts on railway vehicles, which was applied to real structures. The study involved a type of single-arm current collector, while its contact shoe often collapsed in operation and needs improvements. The dynamic stress data from the actual line was tested and converted to load spectra based on damage consistency rule, and then the fatigue life of the contact shoe structure was achieved. The calculation result comes to correspond to its operation life. Based on the method, an improving plan for the structure was developed under optimizing algorithms.

scholarly journals Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis

2001 ◽  
Vol 42 (5) ◽  
pp. 809-813 ◽  
Author(s):  
Young-Eui Shin ◽  
Kyung-Woo Lee ◽  
Kyong-Ho Chang ◽  
Seung-Boo Jung ◽  
Jae Pil Jung
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Lead Free ◽  
Element Analysis ◽  
Thermal Fatigue Life

Validation of the Critical Strain-Based Methodology for Evaluating the Mechanical Safety of Ball Grid Array Solder Joints in a Launch Random Vibration Environment

2021 ◽  
Author(s):  
Tae-Yong Park ◽  
Hyun-Ung Oh
Keyword(s):  
Fatigue Life ◽  
Random Vibration ◽  
Critical Strain ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Mechanical Design ◽  
Ball Grid Array ◽  
Primary Objective ◽  
Circuit Board ◽  
Analytical Approaches

Abstract To overcome the theoretical limitations of Steinberg's theory for evaluating the mechanical safety of the solder joints of spaceborne electronics in a launch random vibration environment, a critical strain-based methodology was proposed and validated in a previous study. However, for the critical strain-based methodology to be used reliably in the mechanical design of spaceborne electronics, its effectiveness must be validated under various conditions of the package mounting locations and the first eigenfrequencies of a printed circuit board (PCB); achieving this validation is the primary objective of this study. For the experimental validation, PCB specimens with ball grid array packages mounted on various board locations were fabricated and exposed to a random vibration environment to assess the fatigue life of the solder joint. The effectiveness of the critical strain-based methodology was validated through a comparison of the fatigue life of the tested packages and their margin of safety, which was estimated using various analytical approaches.

scholarly journals Prediction of mechanical properties and fatigue life of nano silver paste in chip interconnection

2020 ◽  
Author(s):  
Hui YANG ◽  
Jihui Wu
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Stress And Strain ◽  
Nano Silver ◽  
Finite Element Software ◽  
Flip Chips ◽  
Empirical Correction ◽  
Prediction Of Mechanical Properties

Abstract The simulation of nano-silver solder joints in flip-chips is performed by the finite element software ANSYS, and the stress-strain distribution results of the solder joints are displayed. In this simulation, the solder joints use Anand viscoplastic constitutive model, which can reasonably simulate the stress and strain of solder joints under thermal cycling load. At the same time this model has been embedded in ANSYS software, so it is more convenient to use. The final simulation results show that the areas where the maximum stresses and strains occur at the solder joints are mostly distributed in the contact areas between the solder joints and the copper pillars and at the solder joints. During the entire thermal cycling load process, the area where the maximum change in stress and strain occurs is always at the solder joint, and when the temperature changes, the temperature at the solder joint changes significantly. Based on comprehensive analysis, the relevant empirical correction calculation equation is used to calculate and predict the thermal fatigue life of nano-silver solder joints. The analysis results provide a reference for the application of nano-silver solder in the electronic packaging industry.

scholarly journals Effect of Ni3Sn4 on the Thermo-Mechanical Fatigue Life of Solder Joints in 3D IC

2021 ◽  
Vol 8 ◽  
Author(s):  
Liang Zhang ◽  
Su-Juan Zhong
Keyword(s):  
Shear Stress ◽  
Diffusion Coefficient ◽  
Fatigue Life ◽  
Solder Joints ◽  
Fe Simulation ◽  
Transient Liquid Phase ◽  
Bonding Time ◽  
3D Integration ◽  
Mechanical Fatigue ◽  
Tlp Bonding

In this article, the 3D integration with Ni/Sn/Ni joints was conducted using transient liquid phase (TLP) bonding (250°C, 0.2 N) with different bonding time. After TLP bonding, plane-type Ni3Sn4 intermetallic compound (IMC) was observed, and when the bonding time is 180 min, complete Ni3Sn4 was found. The diffusion coefficient D was determined to be 32.4 μm2/min. Based on the finite element (FE) simulation, the results demonstrated that the shear stress and equivalent creep strain increased obviously with an increase in the IMC thickness; the results calculated show that the IMC thickness impacts the fatigue life of solder joints significantly, and the fatigue life decreases notably with an increase in the Ni3Sn4 thickness.

Modern Approaches to Fatigue Life Prediction of SMT Solder Joints

1991 ◽  
pp. 384-405 ◽  
Author(s):  
Thomas J. Kilinski ◽  
Jon R. Lesniak ◽  
Bela I. Sandor
Keyword(s):  
Fatigue Life ◽  
Life Prediction ◽  
Solder Joints ◽  
Fatigue Life Prediction
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