Molecular Modeling and Multiscaling Issues for Electronic Material Applications

Understanding Cleaner Efficiency for BARC (“Bottom Anti-Reflective Coating”) After Plasma Etch in Dual Damascene Structures Through the Practical Use of Molecular Modeling Trends

Molecular Modeling and Multiscaling Issues for Electronic Material Applications ◽

10.1007/978-1-4614-1728-6_3 ◽

2012 ◽

pp. 39-52 ◽

Cited By ~ 1

Author(s):

Nancy Iwamoto ◽

Deborah Yellowaga ◽

Amy Larson ◽

Ben Palmer ◽

Teri Baldwin-Hendricks

Keyword(s):

Molecular Modeling ◽

Plasma Etch ◽

Reflective Coating ◽

Dual Damascene

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Using Molecular Modeling Trending to Understand Dielectric Susceptibility in Dielectrics for Display Applications

Molecular Modeling and Multiscaling Issues for Electronic Material Applications ◽

10.1007/978-1-4614-1728-6_2 ◽

2012 ◽

pp. 25-37

Author(s):

Nancy Iwamoto ◽

Ahila Krishnamoorthy ◽

Edward W. Rutter

Keyword(s):

Molecular Modeling ◽

Dielectric Susceptibility

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Investigation of Coarse-Grained Mesoscale Molecular Models for Mechanical Properties Simulation, as Parameterized Through Molecular Modeling

Molecular Modeling and Multiscaling Issues for Electronic Material Applications ◽

10.1007/978-1-4614-1728-6_14 ◽

2012 ◽

pp. 231-249 ◽

Cited By ~ 1

Author(s):

Nancy Iwamoto

Keyword(s):

Mechanical Properties ◽

Molecular Modeling ◽

Coarse Grained ◽

Molecular Models

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Semi Emprical Low Cycle Fatigue Crack Growth Analysis of Nanostructure Chip-To-Package Copper Interconnect Using Molecular Simulation

Molecular Modeling and Multiscaling Issues for Electronic Material Applications ◽

10.1007/978-1-4614-1728-6_5 ◽

2012 ◽

pp. 77-90 ◽

Cited By ~ 1

Author(s):

S. Koh ◽

A. Saxena ◽

Willem Van Driel ◽

G. Q. (Kouchi) Zhang ◽

R. Tummala

Keyword(s):

Fatigue Crack ◽

Fatigue Crack Growth ◽

Crack Growth ◽

Molecular Simulation ◽

Growth Analysis ◽

Low Cycle Fatigue ◽

Cycle Fatigue ◽

Copper Interconnect

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A Multiscale Approach to Investigate Wettability of Surfaces with Designed Coating

Molecular Modeling and Multiscaling Issues for Electronic Material Applications ◽

10.1007/978-1-4614-1728-6_12 ◽

2012 ◽

pp. 203-212 ◽

Cited By ~ 1

Author(s):

E. K. L. Chan ◽

H. Fan ◽

M. M. F. Yuen

Keyword(s):

Multiscale Approach

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Investigation of Interfacial Delamination in Electronic Packages

Molecular Modeling and Multiscaling Issues for Electronic Material Applications ◽

10.1007/978-1-4614-1728-6_11 ◽

2012 ◽

pp. 189-201

Author(s):

H. Fan ◽

M. M. F. Yuen

Keyword(s):

Electronic Packages ◽

Interfacial Delamination

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Thermal Conductivity of Carbon Nanotube Under External Mechanical Stresses and Moisture by Molecular Dynamics Simulation

Molecular Modeling and Multiscaling Issues for Electronic Material Applications ◽

10.1007/978-1-4614-1728-6_6 ◽

2012 ◽

pp. 93-99

Author(s):

H. Fan ◽

K. Zhang ◽

M. M. F. Yuen

Keyword(s):

Thermal Conductivity ◽

Molecular Dynamics ◽

Carbon Nanotube ◽

Molecular Dynamics Simulation ◽

Mechanical Stresses ◽

Dynamics Simulation

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Atomistic Simulations of Microelectronic Materials: Prediction of Mechanical, Thermal, and Electrical Properties

Molecular Modeling and Multiscaling Issues for Electronic Material Applications ◽

10.1007/978-1-4614-1728-6_1 ◽

2012 ◽

pp. 3-24

Author(s):

V. Eyert ◽

A. Mavromaras ◽

D. Rigby ◽

W. Wolf ◽

M. Christensen ◽

...

Keyword(s):

Electrical Properties ◽

Atomistic Simulations ◽

Thermal And Electrical Properties ◽

Microelectronic Materials

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Influence of Structural Parameters of Carbon Nanotubes on their Thermal Conductivity: Numerical Assessment

Molecular Modeling and Multiscaling Issues for Electronic Material Applications ◽

10.1007/978-1-4614-1728-6_7 ◽

2012 ◽

pp. 101-112

Author(s):

Bartosz Platek ◽

Tomasz Falat ◽

Jan Felba

Keyword(s):

Thermal Conductivity ◽

Carbon Nanotubes ◽

Structural Parameters ◽

Numerical Assessment

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Glass Transition Analysis of Cross-Linked Polymers: Numerical and Mesoscale Approach

Molecular Modeling and Multiscaling Issues for Electronic Material Applications ◽

10.1007/978-1-4614-1728-6_13 ◽

2012 ◽

pp. 213-230

Author(s):

Sebastian J. Tesarski ◽

Artur Wymyslowski

Keyword(s):

Glass Transition ◽

Transition Analysis

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Molecular Modeling and Multiscaling Issues for Electronic Material Applications
Latest Publications

TOTAL DOCUMENTS

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Published By Springer US

Understanding Cleaner Efficiency for BARC (“Bottom Anti-Reflective Coating”) After Plasma Etch in Dual Damascene Structures Through the Practical Use of Molecular Modeling Trends

Using Molecular Modeling Trending to Understand Dielectric Susceptibility in Dielectrics for Display Applications

Investigation of Coarse-Grained Mesoscale Molecular Models for Mechanical Properties Simulation, as Parameterized Through Molecular Modeling

Semi Emprical Low Cycle Fatigue Crack Growth Analysis of Nanostructure Chip-To-Package Copper Interconnect Using Molecular Simulation

A Multiscale Approach to Investigate Wettability of Surfaces with Designed Coating

Investigation of Interfacial Delamination in Electronic Packages

Thermal Conductivity of Carbon Nanotube Under External Mechanical Stresses and Moisture by Molecular Dynamics Simulation

Atomistic Simulations of Microelectronic Materials: Prediction of Mechanical, Thermal, and Electrical Properties

Influence of Structural Parameters of Carbon Nanotubes on their Thermal Conductivity: Numerical Assessment

Glass Transition Analysis of Cross-Linked Polymers: Numerical and Mesoscale Approach

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Molecular Modeling and Multiscaling Issues for Electronic Material ApplicationsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By Springer US

Understanding Cleaner Efficiency for BARC (“Bottom Anti-Reflective Coating”) After Plasma Etch in Dual Damascene Structures Through the Practical Use of Molecular Modeling Trends

Using Molecular Modeling Trending to Understand Dielectric Susceptibility in Dielectrics for Display Applications

Investigation of Coarse-Grained Mesoscale Molecular Models for Mechanical Properties Simulation, as Parameterized Through Molecular Modeling

Semi Emprical Low Cycle Fatigue Crack Growth Analysis of Nanostructure Chip-To-Package Copper Interconnect Using Molecular Simulation

A Multiscale Approach to Investigate Wettability of Surfaces with Designed Coating

Investigation of Interfacial Delamination in Electronic Packages

Thermal Conductivity of Carbon Nanotube Under External Mechanical Stresses and Moisture by Molecular Dynamics Simulation

Atomistic Simulations of Microelectronic Materials: Prediction of Mechanical, Thermal, and Electrical Properties

Influence of Structural Parameters of Carbon Nanotubes on their Thermal Conductivity: Numerical Assessment

Glass Transition Analysis of Cross-Linked Polymers: Numerical and Mesoscale Approach

Molecular Modeling and Multiscaling Issues for Electronic Material Applications
Latest Publications