First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)

Advanced micro-dispensing system for conductive adhesives

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) ◽

10.1109/polytr.2001.973253 ◽

2002 ◽

Cited By ~ 5

Author(s):

T. Gaugel ◽

S. Bechtel ◽

J. Neumann-Rodekirch

Keyword(s):

Conductive Adhesives

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A long-term reliability of adhesive flip chip joints using very thin chips

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) ◽

10.1109/polytr.2001.973279 ◽

2002 ◽

Cited By ~ 1

Author(s):

A. Seppala ◽

I. Suominen ◽

E. Ristolainen

Keyword(s):

Flip Chip

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Semiconductor packaging technology for mobile phones in Japan

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) ◽

10.1109/polytr.2001.973249 ◽

2002 ◽

Author(s):

G. Murakami

Keyword(s):

Mobile Phones ◽

Packaging Technology ◽

Semiconductor Packaging

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Fracture mechanical analysis of cracks in polymer encapsulated metal structures

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) ◽

10.1109/polytr.2001.973281 ◽

2002 ◽

Cited By ~ 2

Author(s):

O. Wittler ◽

P. Sprafke ◽

J. Auersperg ◽

B. Michel ◽

H. Reichl

Keyword(s):

Mechanical Analysis ◽

Metal Structures

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New snap cure materials

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) ◽

10.1109/polytr.2001.973288 ◽

2002 ◽

Author(s):

M. Bauer ◽

J. Bauer

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Electronic adhesives new solutions for short cycled manufacturing process

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) ◽

10.1109/polytr.2001.973289 ◽

2002 ◽

Author(s):

R. Most

Keyword(s):

Manufacturing Process

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Printed polymer transistors

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) ◽

10.1109/polytr.2001.973262 ◽

2002 ◽

Cited By ~ 12

Author(s):

A. Knobloch ◽

A. Bernds ◽

W. Clemens

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Effects of HDI material for laser via hole forming

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) ◽

10.1109/polytr.2001.973283 ◽

2002 ◽

Author(s):

Y. Mikado

Keyword(s):

Via Hole

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Accelerated testing of flip chip packages under dynamic load

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) ◽

10.1109/polytr.2001.973308 ◽

2002 ◽

Cited By ~ 1

Author(s):

I. Rau ◽

R. Miessner ◽

G. Liebing ◽

K.-F. Becker

Keyword(s):

Dynamic Load ◽

Flip Chip ◽

Accelerated Testing

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Reproducibility investigations and different experiments with a new type of electronically-conducting-polymer based bipotentiostatic uric acid sensor

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) ◽

10.1109/polytr.2001.973256 ◽

2002 ◽

Author(s):

H. Santha ◽

G. Harsanyi ◽

C. Visy

Keyword(s):

Uric Acid ◽

Conducting Polymer ◽

New Type

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First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Advanced micro-dispensing system for conductive adhesives

A long-term reliability of adhesive flip chip joints using very thin chips

Semiconductor packaging technology for mobile phones in Japan

Fracture mechanical analysis of cracks in polymer encapsulated metal structures

New snap cure materials

Electronic adhesives new solutions for short cycled manufacturing process

Printed polymer transistors

Effects of HDI material for laser via hole forming

Accelerated testing of flip chip packages under dynamic load

Reproducibility investigations and different experiments with a new type of electronically-conducting-polymer based bipotentiostatic uric acid sensor

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First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Advanced micro-dispensing system for conductive adhesives

A long-term reliability of adhesive flip chip joints using very thin chips

Semiconductor packaging technology for mobile phones in Japan

Fracture mechanical analysis of cracks in polymer encapsulated metal structures

New snap cure materials

Electronic adhesives new solutions for short cycled manufacturing process

Printed polymer transistors

Effects of HDI material for laser via hole forming

Accelerated testing of flip chip packages under dynamic load

Reproducibility investigations and different experiments with a new type of electronically-conducting-polymer based bipotentiostatic uric acid sensor

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)
Latest Publications