2008 2nd Electronics Systemintegration Technology Conference
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261
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Published By IEEE

9781424428137
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scholarly journals A simulation module for supporting the manufacture of high value added electronics manufacturing

2008 ◽  
Author(s):  
L.A.M. Quintero ◽  
A.A. West ◽  
D.M. Segura Velandia ◽  
P.P. Conway ◽  
D.C. Whalley ◽  
...  
Keyword(s):  
Value Added ◽  
Electronics Manufacturing

Investigation of the moisture impact on the stacked die package

2008 ◽  
Author(s):  
C.Y. Li ◽  
Z.K. Hua ◽  
Y.X. Luo ◽  
L.Q. Cao ◽  
J.H. Zhang

Surface evolution and bonding properties of electroplated Au/Sn/Au

2008 ◽  
Author(s):  
K. Wang ◽  
K. Aasmundtveit ◽  
H. Jakobsen
Keyword(s):  
Surface Evolution ◽  
Bonding Properties
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