Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405)
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IMAPS - Int. Microelectron. & Packaging Soc

0930815564

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

CSP present and future

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) ◽

10.1109/isapm.1999.757315 ◽

2003 ◽

Author(s):

P.A. Magill ◽

J.W. Baggs

Download Full-text

Conductivity mechanisms of isotropic conductive adhesives (ICAs)

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) ◽

10.1109/isapm.1999.757278 ◽

2003 ◽

Cited By ~ 3

Author(s):

Daoqiang Lu ◽

Q.K. Tong ◽

C.P. Wong

Keyword(s):

Conductive Adhesives ◽

Isotropic Conductive Adhesives

Download Full-text

Electrically isotropic conductive adhesives: an effective contact resistance model for conductivity development

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) ◽

10.1109/isapm.1999.757327 ◽

2003 ◽

Cited By ~ 2

Author(s):

Mikrajuddin Abdullah ◽

F.G. Shi ◽

S. Chungpaiboonpatana ◽

K. Okuyama ◽

C. Davidson ◽

...

Keyword(s):

Contact Resistance ◽

Conductive Adhesives ◽

Effective Contact ◽

Isotropic Conductive Adhesives ◽

Resistance Model

Download Full-text

Low cost electroless copper metallization of BCB for high-density wiring systems

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) ◽

10.1109/isapm.1999.757312 ◽

2003 ◽

Cited By ~ 6

Author(s):

M. Topper ◽

T. Stolle ◽

H. Reichl

Keyword(s):

Low Cost ◽

High Density ◽

Copper Metallization ◽

Electroless Copper

Download Full-text

Smart tooling for assembly of thin flexible systems

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) ◽

10.1109/isapm.1999.757325 ◽

2003 ◽

Author(s):

Ruijun Chen ◽

D.F. Baldwin

Keyword(s):

Flexible Systems

Download Full-text

An overview of the NCMS/StorageTek embedded decoupling capacitance project

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) ◽

10.1109/isapm.1999.757310 ◽

2003 ◽

Cited By ~ 3

Author(s):

P.H. Bowles ◽

R. Charbonneau

Download Full-text

Direct-write fabrication of integrated, multilayer passive components

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) ◽

10.1109/isapm.1999.757309 ◽

2003 ◽

Cited By ~ 3

Author(s):

D. Dimos ◽

B.H. King ◽

P. Yang

Keyword(s):

Direct Write ◽

Passive Components

Download Full-text

Study on the relationship between the surface composition of copper pads and no-flow underfill fluxing capability

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) ◽

10.1109/isapm.1999.757333 ◽

2003 ◽

Cited By ~ 5

Author(s):

S.H. Shi ◽

D. Lu ◽

C.P. Wong

Keyword(s):

Surface Composition ◽

The Relationship

Download Full-text

Electrically anisotropic conductive adhesives: a new model for conduction mechanism

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) ◽

10.1109/isapm.1999.757305 ◽

2003 ◽

Cited By ~ 2

Author(s):

F.G. Shi ◽

M. Abdullah ◽

S. Chungpaiboonpatana ◽

K. Okuyama ◽

C. Davidson ◽

...

Keyword(s):

Conduction Mechanism ◽

Conductive Adhesives ◽

New Model

Download Full-text

Sources and control of volatile gases hazardous to hermetic electronic enclosures

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) ◽

10.1109/isapm.1999.757294 ◽

2003 ◽

Cited By ~ 1

Author(s):

R.K. Lowry

Keyword(s):

And Control

Download Full-text

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IMAPS - Int. Microelectron. & Packaging Soc

CSP present and future

Conductivity mechanisms of isotropic conductive adhesives (ICAs)

Electrically isotropic conductive adhesives: an effective contact resistance model for conductivity development

Low cost electroless copper metallization of BCB for high-density wiring systems

Smart tooling for assembly of thin flexible systems

An overview of the NCMS/StorageTek embedded decoupling capacitance project

Direct-write fabrication of integrated, multilayer passive components

Study on the relationship between the surface composition of copper pads and no-flow underfill fluxing capability

Electrically anisotropic conductive adhesives: a new model for conduction mechanism

Sources and control of volatile gases hazardous to hermetic electronic enclosures

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405)
Latest Publications