2008 14th International Workshop on Thermal Inveatigation of ICs and Systems
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9781424433650

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Transient dual interface measurement of the Rth-JC of power packages

2008 14th International Workshop on Thermal Inveatigation of ICs and Systems ◽

10.1109/therminic.2008.4669871 ◽

2008 ◽

Cited By ~ 15

Author(s):

Dirk Schweitzer

Keyword(s):

Dual Interface

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The semiconductor - dielectric interface from PN junction periphery and its influence on reliability of power devices at high temperature

2008 14th International Workshop on Thermal Inveatigation of ICs and Systems ◽

10.1109/therminic.2008.4669896 ◽

2008 ◽

Cited By ~ 1

Author(s):

V.V.N. Obreja

Keyword(s):

High Temperature ◽

Power Devices ◽

Dielectric Interface ◽

Pn Junction

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Multi-physics analysis of a photovoltaic panel with a heat recovery system

2008 14th International Workshop on Thermal Inveatigation of ICs and Systems ◽

10.1109/therminic.2008.4669886 ◽

2008 ◽

Author(s):

P. Maffezzoni ◽

L. Codecasa ◽

D. D'Amore

Keyword(s):

Heat Recovery ◽

Photovoltaic Panel ◽

Recovery System ◽

Heat Recovery System

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Dual approach for HBT thermal impedance

2008 14th International Workshop on Thermal Inveatigation of ICs and Systems ◽

10.1109/therminic.2008.4669906 ◽

2008 ◽

Cited By ~ 4

Author(s):

A. Xiong ◽

R. Sommet ◽

A.A.L. de Souza ◽

R. Quere

Keyword(s):

Thermal Impedance ◽

Dual Approach

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Compact thermal networks for conjugate heat transfer by moment matching

2008 14th International Workshop on Thermal Inveatigation of ICs and Systems ◽

10.1109/therminic.2008.4669878 ◽

2008 ◽

Cited By ~ 10

Author(s):

Lorenzo Codecasa ◽

Dario D'Amore ◽

Paolo Maffezzoni

Keyword(s):

Heat Transfer ◽

Conjugate Heat Transfer ◽

Moment Matching

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Assessment of die attach quality by analysis of circuit thermal response spectrum

2008 14th International Workshop on Thermal Inveatigation of ICs and Systems ◽

10.1109/therminic.2008.4669876 ◽

2008 ◽

Author(s):

M. Janicki ◽

B. Vermeersch ◽

J. Banaszczyk ◽

M. Kaminski ◽

G. De Mey ◽

...

Keyword(s):

Response Spectrum ◽

Thermal Response ◽

Die Attach

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Material characterization and non-destructive failure analysis by transient pulse generation and IR-thermography

2008 14th International Workshop on Thermal Inveatigation of ICs and Systems ◽

10.1109/therminic.2008.4669877 ◽

2008 ◽

Cited By ~ 6

Author(s):

D. May ◽

B. Wunderle ◽

M. Abo Ras ◽

W. Faust ◽

A. Gollhard ◽

...

Keyword(s):

Failure Analysis ◽

Material Characterization ◽

Pulse Generation ◽

Ir Thermography ◽

Non Destructive

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A novel procedure and device to allow comprehensive characterization of power leds over a wide range of temperature

2008 14th International Workshop on Thermal Inveatigation of ICs and Systems ◽

10.1109/therminic.2008.4669885 ◽

2008 ◽

Cited By ~ 1

Author(s):

Gabor Molnar ◽

Gergely Nagy ◽

Zoltan Szocs

Keyword(s):

Wide Range ◽

Comprehensive Characterization

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CFD for Electronics Cooling: MCAD and EDA embedded vs. stand-alone

2008 14th International Workshop on Thermal Inveatigation of ICs and Systems ◽

10.1109/therminic.2008.4669869 ◽

2008 ◽

Author(s):

John D. Parry

Keyword(s):

Electronics Cooling

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Recent progress of thermal interface material research - an overview

2008 14th International Workshop on Thermal Inveatigation of ICs and Systems ◽

10.1109/therminic.2008.4669900 ◽

2008 ◽

Cited By ~ 15

Author(s):

Johan Liu ◽

Bruno Michel ◽

Marta Rencz ◽

Christian Tantolin ◽

Claude Sarno ◽

...

Keyword(s):

Recent Progress ◽

Thermal Interface Material ◽

Material Research ◽

Thermal Interface

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2008 14th International Workshop on Thermal Inveatigation of ICs and SystemsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Transient dual interface measurement of the Rth-JC of power packages

The semiconductor - dielectric interface from PN junction periphery and its influence on reliability of power devices at high temperature

Multi-physics analysis of a photovoltaic panel with a heat recovery system

Dual approach for HBT thermal impedance

Compact thermal networks for conjugate heat transfer by moment matching

Assessment of die attach quality by analysis of circuit thermal response spectrum

Material characterization and non-destructive failure analysis by transient pulse generation and IR-thermography

A novel procedure and device to allow comprehensive characterization of power leds over a wide range of temperature

CFD for Electronics Cooling: MCAD and EDA embedded vs. stand-alone

Recent progress of thermal interface material research - an overview

2008 14th International Workshop on Thermal Inveatigation of ICs and Systems
Latest Publications