2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Analytical, numerical and experimental approach to analysis properties of a silicon membrane pressure sensor

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2016.7463305 ◽

2016 ◽

Cited By ~ 1

Author(s):

A. Wymyslowski ◽

A. Gorecka-Drzazga ◽

K. Sarelo

Keyword(s):

Pressure Sensor ◽

Experimental Approach ◽

Silicon Membrane

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Fatigue crack growth modeling in the metallization of power semiconductors under cyclic thermo-mechanical loading

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2016.7463373 ◽

2016 ◽

Author(s):

Martin Springer ◽

Michael Nelhiebel ◽

Heinz E. Pettermann

Keyword(s):

Fatigue Crack ◽

Fatigue Crack Growth ◽

Crack Growth ◽

Mechanical Loading ◽

Growth Modeling ◽

Power Semiconductors ◽

Crack Growth Modeling

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A study of dry stiction phenomenon in MEMS using a computational stochastic multi-scale methodology

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2016.7463333 ◽

2016 ◽

Author(s):

T.-V. Hoang ◽

L. Wu ◽

S. Paquay ◽

J.-C. Golinval ◽

M. Arnst ◽

...

Keyword(s):

Multi Scale

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SBPG: A secure better portable graphics compression architecture for high speed trusted image communication in the IoT

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2016.7463397 ◽

2016 ◽

Cited By ~ 2

Author(s):

Umar Albalawi ◽

Saraju P. Mohanty ◽

Elias Kougianos

Keyword(s):

High Speed ◽

Image Communication

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Thermal-electric-mechanical simulation of a multilevel metallization system

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2016.7463354 ◽

2016 ◽

Author(s):

Yanpeng Liu ◽

Kirsten Weide-Zaage

Keyword(s):

Mechanical Simulation

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Design of a MZI Micro-Opto-Mechanical Pressure Sensor for a SiN photonics platform

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2016.7463357 ◽

2016 ◽

Cited By ~ 7

Author(s):

V. Rochus ◽

R. Jansen ◽

J. Goyvaerts ◽

G. Vandenboch ◽

B. van de Voort ◽

...

Keyword(s):

Pressure Sensor ◽

Mechanical Pressure

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Lifetime evaluation methods for LED products

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2016.7463319 ◽

2016 ◽

Cited By ~ 2

Author(s):

Ruixia Zhang ◽

Chenzhao Zhang ◽

Dongyue Liu ◽

Min Zhao ◽

Jie Huang ◽

...

Keyword(s):

Evaluation Methods

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Comparison of lifetime predictions with LED lamps and light source modules in accelerated aging tests

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2016.7463299 ◽

2016 ◽

Cited By ~ 4

Author(s):

Jian Hao ◽

Qiang Sun ◽

Lei Jing ◽

Yao Wang ◽

Jian Zhao ◽

...

Keyword(s):

Light Source ◽

Accelerated Aging

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Master curve synthesis by effective viscoelastic plastic material modeling

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2016.7463384 ◽

2016 ◽

Cited By ~ 1

Author(s):

Florian Schindler-Saefkow ◽

Remi Pantou ◽

Gerd Schlottig ◽

Sridhar Kumar ◽

Thomas Brunschwiler ◽

...

Keyword(s):

Master Curve ◽

Plastic Material ◽

Material Modeling

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Aerospace-electronics reliability-assurance (AERA): Three-step prognostics-and-health-monitoring (PHM) modeling approach

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ◽

10.1109/eurosime.2016.7463293 ◽

2016 ◽

Author(s):

E. Suhir

Keyword(s):

Health Monitoring ◽

Modeling Approach ◽

Electronics Reliability ◽

Prognostics And Health Monitoring

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2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Analytical, numerical and experimental approach to analysis properties of a silicon membrane pressure sensor

Fatigue crack growth modeling in the metallization of power semiconductors under cyclic thermo-mechanical loading

A study of dry stiction phenomenon in MEMS using a computational stochastic multi-scale methodology

SBPG: A secure better portable graphics compression architecture for high speed trusted image communication in the IoT

Thermal-electric-mechanical simulation of a multilevel metallization system

Design of a MZI Micro-Opto-Mechanical Pressure Sensor for a SiN photonics platform

Lifetime evaluation methods for LED products

Comparison of lifetime predictions with LED lamps and light source modules in accelerated aging tests

Master curve synthesis by effective viscoelastic plastic material modeling

Aerospace-electronics reliability-assurance (AERA): Three-step prognostics-and-health-monitoring (PHM) modeling approach

Export Citation Format

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Analytical, numerical and experimental approach to analysis properties of a silicon membrane pressure sensor

Fatigue crack growth modeling in the metallization of power semiconductors under cyclic thermo-mechanical loading

A study of dry stiction phenomenon in MEMS using a computational stochastic multi-scale methodology

SBPG: A secure better portable graphics compression architecture for high speed trusted image communication in the IoT

Thermal-electric-mechanical simulation of a multilevel metallization system

Design of a MZI Micro-Opto-Mechanical Pressure Sensor for a SiN photonics platform

Lifetime evaluation methods for LED products

Comparison of lifetime predictions with LED lamps and light source modules in accelerated aging tests

Master curve synthesis by effective viscoelastic plastic material modeling

Aerospace-electronics reliability-assurance (AERA): Three-step prognostics-and-health-monitoring (PHM) modeling approach

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Latest Publications