Copper Clad Ultra-Thin Flexible Ceramic Substrate for High Power Electronics
2019 ◽
Vol 1309
◽
pp. 012016
2020 ◽
Vol 14
(1)
◽
pp. 94-118
2016 ◽
Vol 65
◽
pp. 168-175
◽
2015 ◽
Vol 103
(12)
◽
pp. 2312-2319
◽
2019 ◽
Vol 9
(5)
◽
pp. 854-863
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