2018 19th International Conference on Electronic Packaging Technology (ICEPT)
Latest Publications

TOTAL DOCUMENTS

384

(FIVE YEARS 0)

H-INDEX

3

(FIVE YEARS 0)

Published By IEEE

9781538663868

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Investigation on Copper Clip Bonding Structure for Power Package

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480731 ◽

2018 ◽

Author(s):

Linqi Liu ◽

Wei Jiang ◽

Qiang Liu ◽

Wei Lin ◽

Xiaoyong Miao ◽

...

Keyword(s):

Bonding Structure

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Application of worst case analysis to failure analysis of hybrid IC

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480779 ◽

2018 ◽

Author(s):

Tong Wang ◽

Xu Wang ◽

Meng Meng ◽

Zhimin Ding ◽

Ming He

Keyword(s):

Failure Analysis ◽

Case Analysis ◽

Worst Case Analysis ◽

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Effect of oxide layers on MONOS device performance based on TCAD simulation

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480524 ◽

2018 ◽

Author(s):

Chuang Sun ◽

Dandan Yi ◽

Ming Li ◽

Liming Gao

Keyword(s):

Device Performance ◽

Oxide Layers ◽

Tcad Simulation

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Thermo-mechanical Modelling of Cu Wire Parallel Gap Micro-resistance Welding Process

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480767 ◽

2018 ◽

Author(s):

Bingying Wu ◽

Chunjin Hang ◽

Yue Li ◽

Yang Liu ◽

Yanhong Tian ◽

...

Keyword(s):

Welding Process ◽

Resistance Welding ◽

Mechanical Modelling

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Molecular dynamics study of copper wire bonding process

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480502 ◽

2018 ◽

Author(s):

Xiyou Wang ◽

Lei Wang ◽

Daoguo Yang ◽

Zhangping Yang

Keyword(s):

Molecular Dynamics ◽

Copper Wire ◽

Wire Bonding ◽

Bonding Process ◽

Copper Wire Bonding

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Optimize FT Hardware Design by RSS Tolerance Analysis Method

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480797 ◽

2018 ◽

Author(s):

Zhao ChunHua ◽

Cao LuXin

Keyword(s):

Hardware Design ◽

Tolerance Analysis ◽

Analysis Method

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Research on LTCC - based Flat Optocoupler Assembly Technology

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480497 ◽

2018 ◽

Author(s):

ZHANG Jun ◽

Ye Xiao Fei ◽

LI Meng Lin ◽

SHI Hailin

Keyword(s):

Assembly Technology

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A highly reliable cleaning process

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480478 ◽

2018 ◽

Author(s):

ZHANG Jun ◽

Ye Xiao Fei ◽

SHI Hailin

Keyword(s):

Cleaning Process

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Plasma Treatment Technology in Microwave PCB Manufacturing

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480434 ◽

2018 ◽

Author(s):

Guangqian Dai ◽

Fangsheng Bian ◽

Ce Zeng ◽

Yumin Lin ◽

Xiaolin Gong ◽

...

Keyword(s):

Plasma Treatment ◽

Treatment Technology ◽

Pcb Manufacturing

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Noise Analysis and Transmission Coding Optimization for High-speed Interconnection

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480557 ◽

2018 ◽

Author(s):

Tianfang CHEN ◽

Min MIAO ◽

Bo HAN ◽

Zhensong LI ◽

Kai ZHAO ◽

...

Keyword(s):

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