2018 19th International Conference on Electronic Packaging Technology (ICEPT)
Latest Publications

TOTAL DOCUMENTS

384

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781538663868

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Research and Introduction of the Process Flow of Full-automatic Wafer Level Flip Chip Machine

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480617 ◽

2018 ◽

Author(s):

He Yunbo ◽

Gao Jian ◽

Chen Yun ◽

Ye Wentao ◽

Chen Xun ◽

...

Keyword(s):

Flip Chip ◽

Wafer Level ◽

Process Flow

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Design of incremental grating ruler online measuring- displacement system based on LabVIEW

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480694 ◽

2018 ◽

Cited By ~ 1

Author(s):

Li YanFeng ◽

Yang ZhiJun ◽

Sun Han ◽

Xiong ShaoWang ◽

Li Qian

Keyword(s):

Displacement System

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Thermal Simulation into the Effect of Varying Encapsulant Media on Wire Bond Stress Under Temperature Cycling

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480816 ◽

2018 ◽

Cited By ~ 1

Author(s):

Matt Packwood ◽

Daohui Li ◽

Paul Mumby-Croft ◽

Xiaoping Dai

Keyword(s):

Thermal Simulation ◽

Temperature Cycling ◽

Bond Stress ◽

Wire Bond

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Thermal Error Analysis and Compensation of Die Attach Equipment for Fan-out Package

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480504 ◽

2018 ◽

Author(s):

Yelezhi Wangjunshuai ◽

Haiming Wang ◽

Ping Lang ◽

Zhiyue Wang

Keyword(s):

Error Analysis ◽

Thermal Error ◽

Die Attach

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Room-Temperature Synthesis of Cesium Lead Halide Perovskite Nanorods

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480484 ◽

2018 ◽

Author(s):

Xuewei Du ◽

Zongtao Li ◽

Xinrui Ding ◽

Hanguang Lu ◽

Longshi Rao ◽

...

Keyword(s):

Room Temperature ◽

Temperature Synthesis ◽

Room Temperature Synthesis ◽

Halide Perovskite ◽

Lead Halide

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Three-dimensional simulation of the effects of Cu protrusion of Cu-filled TSVs on thermal fatigue behavior of micro-bump joints in 3D integration

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480623 ◽

2018 ◽

Author(s):

Jie-Ying Zhou ◽

Cheng Wei ◽

Shui-Bao Liang ◽

Han Jiang ◽

Xiao Ma ◽

...

Keyword(s):

Thermal Fatigue ◽

Fatigue Behavior ◽

Three Dimensional ◽

3D Integration ◽

Thermal Fatigue Behavior ◽

Dimensional Simulation

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A High Performance and Low Cost Half Bridge IGBT Planar Power Module

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480598 ◽

2018 ◽

Author(s):

Jainfeng Li ◽

Ke Li ◽

Jingru Dai ◽

Christopher Mark Johnson ◽

Xi Lin

Keyword(s):

High Performance ◽

Low Cost ◽

Power Module

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Polypyrrole Hollow Nanosphere Intercalated Graphene-based Flexible Supercapacitor

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480452 ◽

2018 ◽

Author(s):

Yuanyuan Yang ◽

Pengli Zhu ◽

Leicong Zhang ◽

Tingxi Li ◽

Qing Wang ◽

...

Keyword(s):

Hollow Nanosphere ◽

Flexible Supercapacitor

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A novel graphene oxide millispheres / epoxy resin composite with improved thermal conductivity

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480514 ◽

2018 ◽

Author(s):

Chen Li ◽

Xiaoliang Zeng ◽

Deliang Zhu ◽

Rong Sun ◽

Jianbin Xu ◽

...

Keyword(s):

Thermal Conductivity ◽

Graphene Oxide ◽

Epoxy Resin ◽

Resin Composite ◽

Epoxy Resin Composite

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Model and Analysis of Planar Spiral Inductor Based on Package Substrate

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480751 ◽

2018 ◽

Cited By ~ 1

Author(s):

SUN Haiyan ◽

SUN Wenjun ◽

SUN Ling ◽

ZHAO Jicong ◽

FANG Jiaen ◽

...

Keyword(s):

Spiral Inductor

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2018 19th International Conference on Electronic Packaging Technology (ICEPT)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Research and Introduction of the Process Flow of Full-automatic Wafer Level Flip Chip Machine

Design of incremental grating ruler online measuring- displacement system based on LabVIEW

Thermal Simulation into the Effect of Varying Encapsulant Media on Wire Bond Stress Under Temperature Cycling

Thermal Error Analysis and Compensation of Die Attach Equipment for Fan-out Package

Room-Temperature Synthesis of Cesium Lead Halide Perovskite Nanorods

Three-dimensional simulation of the effects of Cu protrusion of Cu-filled TSVs on thermal fatigue behavior of micro-bump joints in 3D integration

A High Performance and Low Cost Half Bridge IGBT Planar Power Module

Polypyrrole Hollow Nanosphere Intercalated Graphene-based Flexible Supercapacitor

A novel graphene oxide millispheres / epoxy resin composite with improved thermal conductivity

Model and Analysis of Planar Spiral Inductor Based on Package Substrate

2018 19th International Conference on Electronic Packaging Technology (ICEPT)
Latest Publications